製品概要
-
All features
- TPM features
- Flash-memory-based trusted platform module (TPM)
- Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 159 – errata 1.1 and TCG PC Client Specific TPM Platform Specifications 1.05 rev 14
- Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
- SP800-193 compliant for protection, detection and recovery requirements
- Targeted certifications:
- CC according to TPM 2.0 PP at EAL4+ (augmented with AVA_VAN.5 and ALC_FLR.1)
- FIPS 140-2 level 2 (physical security level 3)
- TCG certification
- SPI support at up to 33 MHz
- Hardware features
- Highly reliable Flash memory technology
- Extended temperature range: −40 °C to 105 °C
- ESD protection up to 4 kV (HBM) and 750 V (CDM)
- 1.8 V or 3.3 V supply voltage range
- Security features
- Active shield and environmental sensors
- Monitoring of environmental parameters (power)
- Hardware and software protection against fault injection
- FIPS SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
- FIPS SP800-90B and AIS31-compliant true random-number generator (TRNG)
- Cryptographic algorithms:
- RSA key generation (1024, 2048 or 3072 bits)
- RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
- RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
- SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
- HMAC SHA-1, SHA-2, and SHA-3
- AES-128, 192, and 256 bits
- TDES 192 bits
- ECC (NIST P-256, P-384 curves): key generation, ECDH, and ECDSA, ECSchnorr
- ECDAA (BN-256 curve)
- Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
- Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
- Product compliance
- Compliant with Microsoft® Windows® 10 and 11
- Compliant with Linux® drivers
- Compliant with Intel® vPro® technology
- Compliant with the TCG test suite for TPM 2.0
- Compliant with the open-source TCG TPM 2.0 TSS implementation
- TPM features
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STMicroelectronics - ST33TPHF2XSPI
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Quality and Reliability
| Part Number | Marketing Status | Package | RoHSコンプライアンスグレード | Material Declaration** |
|---|---|---|---|---|
| ST33HTPH2X32AHD4 | Active 交換品交換品 | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
| ST33HTPH2X32AHD8 | Active 交換品交換品 | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
| ST33HTPH2X32AHE4 | Active 交換品交換品 | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
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Sample & Buy
| Part Number | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | |||||||||||||
| ST33HTPH2X32AHD4 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | |||||||||||
| ST33HTPH2X32AHD8 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | |||||||||||
| ST33HTPH2X32AHE4 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | |||||||||||
ST33HTPH2X32AHD4 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
ST33HTPH2X32AHD8 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
ST33HTPH2X32AHE4 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。