ST33TPHF2XSPI

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Long-term evolution TPM 2.0 device with an SPI interface

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  • The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

    It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
    These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
    The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified
    They embed an Arm SecurCore SC300 processor with additional security features to help protect against advanced forms of attack.
    The ST33TPHF2XSPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
    It offers resilience services during the TPM firmware upgrade process, and self-recovery of TPM firmware and critical data upon failure detection.
    The ST33TPHF2XSPI operates in the –25 to +85 °C commercial temperature range at 1.8 V, or in the –40 °C to 105 °C extended temperature range at 3.3 V.
    The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

    Key Features

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
      • SP800-193 compliant for protection, detection and recovery requirements
      • Targeted certifications:
        • CC according to TPM 2.0 PP at EAL4+(AVA_VAN.5, resistant to high-potential attacks)
        • FIPS 140-2 level 2 (physical security level 3)
        • TCG certification
      • SPI support at up to 33 MHz
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
        • RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
        • SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
        • HMAC SHA-1, SHA-2 and SHA-3
        • AES-128,192 and 256 bits
        • TDES 192 bits
        • ECC (NIST P-256, P-384 curves): key generation, ECDH and ECDSA, ECSchnorr
        • ECDAA (BN-256 curve)
      • Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
      • Device provisioned with 3 RSA key pairs to reduce the TPM provisioning time
    • Product compliance
      • Compliant with Microsoft Windows 10
      • Compliant with Linux® drivers
      • Compliant with Intel vPro technology
      • Compliant with TCG test suite for TPM 2.0
      • Compliant with the open-source TCG TPM 2.0 TSS implementation

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DB3421
      Long-term evolution Flash-memory-based TPM 2.0 device with an SPI interface
      4.0
      326.06 KB
      PDF
      DB3421

      Long-term evolution Flash-memory-based TPM 2.0 device with an SPI interface

    • Description Version Size Action
      TN1330
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates
      1.0
      158.71 KB
      PDF
      TN1330

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

Publications and Collaterals

    • Description Version Size Action
      STSAFE-TPM standardized solution for trusted devices 1.0
      195 KB
      PDF

      STSAFE-TPM standardized solution for trusted devices

    • Description Version Size Action
      Make LoRa® easy and secure 1.0
      1.7 MB
      PDF
      Making Sigfox devices easy and secure 1.0
      1.42 MB
      PDF
      STSAFE secure solutions for IoT 1.0
      1.12 MB
      PDF
      Secure Solutions - Ensuring your peace of mind 2.0
      539.44 KB
      PDF

      Make LoRa® easy and secure

      Making Sigfox devices easy and secure

      STSAFE secure solutions for IoT

      Secure Solutions - Ensuring your peace of mind

Digital Certificates

    • Description Version Size Action
      STM TPM ECC Intermediate CA 02 1.0
      683 Byte(s)
      ZIP
      STM TPM ECC384 Intermediate CA 01 1.0
      726 Byte(s)
      ZIP

      STM TPM ECC Intermediate CA 02

      STM TPM ECC384 Intermediate CA 01

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ST33HTPH2X28AHD4
Active
TSSOP28 9.7 x 4.4 Ecopack2
ST33HTPH2X32AHD4
Active
VFQFPN 32 5x5x1.0 Ecopack2

ST33HTPH2X28AHD4

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

ST33HTPH2X32AHD4

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
ST33HTPH2X32AHD4 No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape And Reel VFQFPN 32 5x5x1.0 0 70 PHILIPPINES
ST33HTPH2X28AHD4 No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape And Reel TSSOP28 9.7 x 4.4 0 70 PHILIPPINES

ST33HTPH2X32AHD4

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

VFQFPN 32 5x5x1.0

Operating Temperature (°C)

(min)

0

(max)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST33HTPH2X28AHD4

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

TSSOP28 9.7 x 4.4

Operating Temperature (°C)

(min)

0

(max)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors