ST33TPHF2XSPI

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Long-term evolution TPM 2.0 device with an SPI interface

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Product overview

  • All features

    • TPM features
      • Flash-memory-based trusted platform module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 159 – errata 1.1 and TCG PC Client Specific TPM Platform Specifications 1.05 rev 14
      • Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
      • SP800-193 compliant for protection, detection and recovery requirements
      • Targeted certifications:
        • CC according to TPM 2.0 PP at EAL4+ (augmented with AVA_VAN.5 and ALC_FLR.1)
        • FIPS 140-2 level 2 (physical security level 3)
        • TCG certification
      • SPI support at up to 33 MHz
    • Hardware features
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD protection up to 4 kV (HBM) and 750 V (CDM)
      • 1.8 V or 3.3 V supply voltage range
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
      • FIPS SP800-90B and AIS31-compliant true random-number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024, 2048 or 3072 bits)
        • RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
        • RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
        • SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
        • HMAC SHA-1, SHA-2, and SHA-3
        • AES-128, 192, and 256 bits
        • TDES 192 bits
        • ECC (NIST P-256, P-384 curves): key generation, ECDH, and ECDSA, ECSchnorr
        • ECDAA (BN-256 curve)
      • Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
      • Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
    • Product compliance
      • Compliant with Microsoft® Windows® 10 and 11
      • Compliant with Linux® drivers
      • Compliant with Intel® vPro® technology
      • Compliant with the TCG test suite for TPM 2.0
      • Compliant with the open-source TCG TPM 2.0 TSS implementation

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST33TPHF2XSPI

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3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ST33HTPH2X32AHD4
Active
VFQFPN 32 5x5x1.0 mm Ecopack2
ST33HTPH2X32AHD8
Active
VFQFPN 32 5x5x1.0 mm Ecopack2

ST33HTPH2X32AHD4

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

Marketing Status

Active

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

ST33HTPH2X32AHD8

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

Marketing Status

Active

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Part Number
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ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
ST33HTPH2X32AHD4 Available at distributors

Distributor availability of ST33HTPH2X32AHD4

Distributor Name
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Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape and Reel VFQFPN 32 5x5x1.0 mm 0 70 PHILIPPINES
ST33HTPH2X32AHD8 Available at distributors

Distributor availability of ST33HTPH2X32AHD8

Distributor Name
Region Stock Min. Order Third party link

Distributor reported inventory date:

No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape and Reel VFQFPN 32 5x5x1.0 mm 0 70 PHILIPPINES

ST33HTPH2X32AHD4 Active

Package:
VFQFPN 32 5x5x1.0 mm
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

ST33HTPH2X32AHD4

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

0

Max:

70

Country of Origin:

PHILIPPINES

ST33HTPH2X32AHD8 Active

Package:
VFQFPN 32 5x5x1.0 mm
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

ST33HTPH2X32AHD8

ECCN (EU):

NEC

Packing Type:

Tape and Reel

Operating Temperature (°C)

Min:

0

Max:

70

Country of Origin:

PHILIPPINES

Swipe or click the button to explore more details Don't show this again

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors