Product overview
-
All features
- TPM features
- Flash-memory-based trusted platform module (TPM)
- Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 159 – errata 1.1 and TCG PC Client Specific TPM Platform Specifications 1.05 rev 14
- Fault-tolerant firmware loader that keeps the TPM fully functional when the loading process is interrupted (self-recovery)
- SP800-193 compliant for protection, detection and recovery requirements
- Targeted certifications:
- CC according to TPM 2.0 PP at EAL4+ (augmented with AVA_VAN.5 and ALC_FLR.1)
- FIPS 140-2 level 2 (physical security level 3)
- TCG certification
- SPI support at up to 33 MHz
- Hardware features
- Highly reliable Flash memory technology
- Extended temperature range: −40 °C to 105 °C
- ESD protection up to 4 kV (HBM) and 750 V (CDM)
- 1.8 V or 3.3 V supply voltage range
- Security features
- Active shield and environmental sensors
- Monitoring of environmental parameters (power)
- Hardware and software protection against fault injection
- FIPS SP800-90A and AIS20-compliant deterministic random-bit generator (DRBG)
- FIPS SP800-90B and AIS31-compliant true random-number generator (TRNG)
- Cryptographic algorithms:
- RSA key generation (1024, 2048 or 3072 bits)
- RSA signature (RSASSA-PSS, RSASSA-PKCS1v1_5)
- RSA encryption (RSAES-OAEP, RSAESPKCS1-v1_5)
- SHA-1, SHA-2 (256 and 384 bits), SHA-3 (256 and 384 bits)
- HMAC SHA-1, SHA-2, and SHA-3
- AES-128, 192, and 256 bits
- TDES 192 bits
- ECC (NIST P-256, P-384 curves): key generation, ECDH, and ECDSA, ECSchnorr
- ECDAA (BN-256 curve)
- Device provided with 3 endorsement keys (EK) and EK certificates (RSA2048, ECC NIST P_256 and ECC NIST P_384)
- Device provisioned with three 2048-bit RSA key pairs to reduce the TPM provisioning time
- Product compliance
- Compliant with Microsoft® Windows® 10 and 11
- Compliant with Linux® drivers
- Compliant with Intel® vPro® technology
- Compliant with the TCG test suite for TPM 2.0
- Compliant with the open-source TCG TPM 2.0 TSS implementation
- TPM features
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All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 5.0 | 22 Mar 2021 | 22 Mar 2021 | ||
| 1.0 | 20 Dec 2022 | 20 Dec 2022 |
Application Notes (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 11 Apr 2022 | 11 Apr 2022 | ||
| 1.0 | 16 Sep 2021 | 16 Sep 2021 |
Technical Notes & Articles (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 27 Jan 2023 | 27 Jan 2023 | ||
| 2.0 | 10 Mar 2023 | 10 Mar 2023 |
Presentations (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.1 | 21 Nov 2022 | 21 Nov 2022 |
Flyers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 02 Dec 2020 | 02 Dec 2020 |
Brochures (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Aug 2020 | 13 Aug 2020 | ||
| 2.0 | 11 Jun 2020 | 11 Jun 2020 |
TPM Certificates (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 29 Jul 2019 | 29 Jul 2019 | |
| ZIP | 1.0 | 29 Jul 2019 | 29 Jul 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ST33TPHF2XSPI
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| ST33HTPH2X32AHD4 | Active | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
| ST33HTPH2X32AHD8 | Active | VFQFPN 32 5x5x1.0 mm | Ecopack2 | |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
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| Part Number | Order from distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| ST33HTPH2X32AHD4 | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape and Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | | ||
| ST33HTPH2X32AHD8 | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape and Reel | VFQFPN 32 5x5x1.0 mm | 0 | 70 | PHILIPPINES | | ||
ST33HTPH2X32AHD4 Active
Package:
VFQFPN 32 5x5x1.0 mm
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-
distributors
No availability of distributors reported, please contact our sales office
ST33HTPH2X32AHD8 Active
Package:
VFQFPN 32 5x5x1.0 mm
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-
distributors
No availability of distributors reported, please contact our sales office
Don't show this again
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors