STM32 Wireless MCU Solutions

9:30 – 10:10
Speaker: TBC, STMicroelectronics

Connectivity solutions are more important than ever in today’s IoT design. The STM32 wireless MCU series continues to expand, offering wider choice of devices such as the STM32WB that brings BLE 5.0 connectivity coupled with Cortex^® M-4 and M0+ Arm^® cores in a single chip solution. With security features that will ensure your IoT design is secure, multiple connection options such as BLE Mesh, Zigbee or Thread, the STM32WB is truly the most complete Bluetooth^® SoC available on the market today. The STM32L series power consumption schemes applied to STM32WB will ensure your IoT devices can be powered as long as possible in the field.

Low Cost, Highly Precise Real Time Kinematics for Automotive and Autonomous Systems

10:15 – 10:55
Speaker: Michael Murray, Aceinna

This discussion will focus upon the market trends, applications and adoption rates for Real Time Kinematic systems. We will also discuss how newly integrated devices and networks are disrupting existing and emerging applications due to the decreased cost, complexity and subsequently, time to market.

Introduction to the STM32MP1 Microprocessor Series

11:00 – 11:40
Speaker: Mike Hartmann, STMicroelectronics

Leveraging the unparalleled success of the STM32, ST recently announced the newest addition to the family, the STM32MP1. This general purpose multicore microprocessor series will facilitate development of high-performance solutions for Industrial, Consumer, Medical and Smart Home applications. This session will introduce attendees to the STM32MP1, its features and capabilities, the available tools, and the ecosystem around it.

System in Package: Simplifying Your STM32MP1 Designs

11:45 – 12:25
Speaker: Martin Burgos, Octavo

The future of device integration has Arrived. System in Package leverages IC manufacturing processes to deliver smaller designs, faster and at a lower cost. Bringing this technology to the new STM32MP1, Octavo Systems has created a module that delivers the performance of the MP1 in a package that is up to 64% smaller and feels like a microcontroller. This talk will introduce you to System in Package technology and demonstrate how the OSD32MP15x System in Package module can simplify your design using the STM32MP1 microprocessor getting you to market faster.

Session Title TBC

2:00 – 2:40
Speaker: TBC, uSound

Session title and abstract forthcoming…

Predictive Maintenance: Use of Advanced Sensors in Smart Industry Applications

2:50 – 3:30
Speaker: Manuel Cantone, STMicroelectronics

In this session we will discuss the use of various sensing technologies applied to condition monitoring of an asset: vibration analysis, environmental sensing, use of ultrasound. We will present the development kits available from ST and a development path from condition monitoring to predictive maintenance using an end-to-end sensor-to-cloud platform.

Lighting and Metering in Home Building Automation

3:40 – 4:20
Speaker: TBC, STMicroelectronics

Abstract forthcoming...

Understanding LDO architectures and their impact on noise sensitive applications

9:30 – 10:10
Speaker: Salvo Galati, STMicroelectronics

Whether standalone or integrated inside PMICs, LDOs are the basic building block in most power supplies. In electronic systems that are susceptible to noise, as in RF transceivers with high sensitivity, data converters, and precision signal processing, a constant voltage supply free from unwanted disturbance is required for optimal performance. While the primary purpose of an LDO is to accurately generate a constant supply voltage to power an electronic circuit, the way LDOs operate also makes them very effective at filtering out upstream power supply noise, preventing disruptive electronic signals from affecting those noise‐sensitive loads. This presentation will explore the most commonly used LDO architectures and explain how the dynamic characteristics of LDOs translate into a "clean" power supply voltage. The presentation will also address LDO thermal design and its control loop stability, in an effort to clear out common misunderstandings and avoid costly PCB design mistakes.

Ultrasound for Real Life Applications

10:15 – 10:55
Speaker: Steffen Grahlmann, STMicroelectronics

Advances in semiconductor process technology in recent years have made it possible to dramatically miniaturize the key components of systems that generate and analyze ultrasound waves. This miniaturization and consequent cost reduction created a host of new application fields for ultrasound systems beyond the traditional focus of medical imaging.

In this talk we will cover the physics of ultrasound waves, the components of a typical ultrasound system and discuss concrete application examples for distance measurement, flow rate measurement, presence and obstacle detection as well as structural integrity testing (NDT). The presentation will also provide an overview of ST’s application specific standard products and the relevant eval tools that make application development simple.

Jump start your IOT Design with BlueNRG Bluetooth Low Energy Modules

11:00 – 11:40
Speaker: Julio Sanchez, STMicroelectronics

Learn how STMicroelectronics' new Bluetooth Low Energy modules can allow you to boost your IoT product time-to-market. The new BlueNRG modules are all based on the BlueNRG SoC series and come with the same suite of easy-to-use hardware and software that have made BlueNRG an award-winning series. In addition, we will also review the ST Bluetooth Mesh SDK that allows the expansion of your network made up of BlueNRG modules.

You will learn:

• The fundamentals of the Bluetooth Low Energy BlueNRG SoC’s
• The product range of the new BlueNRG modules
• How to take advantage of the easy-to-use BlueNRG SDK
• How to get started with Bluetooth mesh onto the new BlueNRG modules
• Where to find the associated resources

A Breakthrough Innovation in MEMS Sensors: Smart Inertial Measurement Units (IMU) with a Machine Learning Core for Ultra-Low-Power Edge Nodes

11:45 – 12:25
Speaker: Simon Calleweart, STMicroelectronics

Machine Learning Core is a unique, revolutionary approach ST IMUs are offering. Machine Learning algorithms allow to build predictive models from large amount of training data. The Machine Learning Core enables running such predictive models, and specifically decision trees, inside an optimized core hosted in the IMU. This processing capability allows moving some algorithms from the host processor to the IMU. For typical tasks the IMU would consume less than one hundredth of the MCU power for the same task. This is a key enabler for ultralow-power edge-computing with the additional positive effect of reducing the amount of data to be transmitted to the cloud and will enable a new wave of consumer, Industrial or IoT applications.

Benefits of Applying Silicon Carbide Power MOSFETs

2:00 – 2:40
Speaker: Jeff Fedison, STMicroelectronics

The recent commercialization of silicon carbide power devices has given way to a revolution in power electronics where traditional silicon devices are being replaced by smaller and more efficient silicon carbide devices. This presentation will describe benefits silicon carbide devices impart on power electronics. The state of the art in SiC MOSFETs will be reviewed along with information about the latest offering from ST. A wide range of applications already exist for SiC, including traction inverters and chargers for electric vehicles, photovoltaic inverters, industrial drives and switched-mode power supplies. A few examples of these applications will be described and comparisons will be made to traditional silicon-based solutions. The presentation will include a discussion of the requirements of gate drivers suitable for SiC MOSFETs.

Analog and Digital Solutions for Power Converters

2:50 – 3:30
Speaker: TBC, STMicroelectronics

Abstract forthcoming...

Understanding Operational Amplifier Parameters and Accuracy Measurements

3:40 – 4:20
Speaker: Gregory Gosciniak, STMicroelectronics

Sensors in today’s world are extensively used to measure weight, read temperature, evaluate gas concentration, identify VOC, control speed and more. Even though we live in an increasingly digital world, many sensors today are bound to operate in the analog domain. And most of them provide an extremely small signal that needs to be amplified, before being converted into bits of digital information for processing and visualization. Precision operational amplifiers are the primary link between these analog sensors and the digital world.

In this presentation, the theoretical foundations of precision in operational amplifiers will be explored, the fundamentals of the four underlying parameters affecting precision will be presented, and the theoretical and practical explanation of a gas sensor operation with ST’s TSZ121 zero drift operation amplifier will be presented.

NFC Reader Design and Optimization

9:30 – 10:10
Speaker: Dan Merino, STMicroelectronics

This session will cover the basic principles of reader antenna matching network design including optimization for card emulation mode. The course will start with measuring antenna parameters, followed by using the antenna design tool and finally optimizing the design for read range vs current consumption. Product families and design tools available for customers will also be covered.

Explore the NFC technology in your Androids and iPhones – Hands-on Workshop

10:15 – 12:00
Speaker: John Tran & the STMicroelectronics Team

Pair, transfer data, change setting, update firmware and wakeup/power up the ST25DV-Discovery with Bluetooth + Wifi module. Also learn the physics behind NFC and design your own antennas.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

Building a Sensor to Cloud Industrial IoT Condition Monitoring Application – Hands-on Workshop

1:30 – 4:30
Speaker: STMicroelectronics team

The STWIN SensorTile Wireless Industrial Node (STEVAL-STWINKT1) is a development kit that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.

In this workshop, STMicroelectronics will guide the developers unboxing the STWIN platform, registering the kit to the AWS Cloud through the Dashboard application, configuring it and connecting it to the cloud and accessing the generated sensor data.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

Create an IoT dashboard leveraging Microsoft Azure IoT Services & the STM32L4 MCU

9:30 – 12:15
Speaker: TBC, Microsoft team

Microsoft is leading in IoT because they are passionate about simplifying IoT so any company can benefit from it quickly and securely. IoT is transforming every business on the planet, and that transformation is accelerating. Companies are harnessing billions of IoT devices to help them find valuable insights into critical parts of their business that were previously not connected.

This workshop will feature hands on labs leveraging the STM32L4 Discovery kit IoT node with Azure IoT components, including Azure RTOS (formerly known as ThreadX), IoT Devices SDK featuring Plug and Play, Device Provisioning Services connected to the Azure IoT Hub Service and displaying data using the Azure IoT Central dashboard. Additionally, we will introduce new Azure IoT Services planned for future releases.

Accelerating the Human-Machine Interface (HMI) of Things with STM32 and TouchGFX

1:30 – 5:00
Speaker: STMicroelectronics team

Attend this hands-on workshop to gain knowledge and practical experience with the STM32H7 microcontroller and the TouchGFX graphics framework. If you are an embedded developer interested in microcontroller-based graphics applications, this workshop will teach you how to advance your product’s HMI (Human-Machine Interface) to improve the user experience. There will be hands-on labs using TouchGFX Designer, STM32CubeMX, the new X-Cube-TouchGFX package, and STM32CubeIDE, along with the STM32H7B3I Discovery kit.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.