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LSM9DS1

量産中
MySTに保存

9-axis iNEMO inertial module (IMU): 3D magnetometer, 3D accelerometer, 3D gyroscope with I2C and SPI

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  • The LSM9DS1 is a system-in-package featuring a 3D digital linear acceleration sensor, a 3D digital angular rate sensor, and a 3D digital magnetic sensor.

    The LSM9DS1 has a linear acceleration full scale of ±2g/±4g/±8/±16 g, a magnetic field full scale of ±4/±8/±12/±16 gauss and an angular rate of ±245/±500/±2000 dps.
    The LSM9DS1 includes an I2C serial bus interface supporting standard and fast mode (100 kHz and 400 kHz) and an SPI serial standard interface.
    Magnetic, accelerometer and gyroscope sensing can be enabled or set in power-down mode separately for smart power management.
    The LSM9DS1 is available in a plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

    特徴

    • 3 acceleration channels, 3 angular rate channels, 3 magnetic field channels
    • ±2/±4/±8/±16 g linear acceleration full scale
    • ±4/±8/±12/±16 gauss magnetic full scale
    • ±245/±500/±2000 dps angular rate full scale
    • 16-bit data output
    • SPI / I2C serial interfaces
    • Analog supply voltage 1.9 V to 3.6 V
    • “Always-on” eco power mode down to 1.9 mA
    • Programmable interrupt generators
    • Embedded temperature sensor
    • Embedded FIFO
    • Position and motion detection functions
    • Click/double-click recognition
    • Intelligent power saving for handheld devices
    • ECOPACK®, RoHS and “Green” compliant
    続きを読む 一部を表示

注目ビデオ

すべてを見る
Embedded advanced pedometer with iNEMO™ Inertial Measurement Units (IMU) 
Embedded advanced pedometer with iNEMO™ Inertial Measurement Units (IMU) 

This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).

LSM6DSOXに搭載の機械学習コア入門
LSM6DSOXに搭載の機械学習コア入門

モーション･センサに搭載された機械学習コア･アルゴリズムを紹介すると共に、省電力化へのアプローチを分かりやすく解説します。

SensorTile.box: Pro Mode
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This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.

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All resources

製品スペック (1)

Resource title
Latest update
DS10101 iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer 3.0
23 Mar 2015
23 Mar 2015
DS10101 iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer 3.0

技術ノート & 解説 (1)

Resource title
Latest update
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2
18 Jan 2021
18 Jan 2021
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5)

Resource title
Latest update
DT0105 1-point or 3-point tumble sensor calibration 1.1
21 Jan 2021
21 Jan 2021
DT0105 1-point or 3-point tumble sensor calibration 1.1
DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
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08 Jan 2021
DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
11 Jan 2021
11 Jan 2021
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DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0
22 Apr 2020
22 Apr 2020
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DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1
21 Jan 2021
21 Jan 2021
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1

プレゼンテーション (1)

Resource title
Latest update
iNEMO* inertial modules: Evaluation tools and GUI 1.0
13 Jan 2021
13 Jan 2021
iNEMO* inertial modules: Evaluation tools and GUI 1.0

フライヤ (3)

Resource title
Latest update
ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0
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パンフレット (4)

Resource title
Latest update
MEMS Sensors for automotive applications 1.0
13 Jun 2019
13 Jun 2019
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MEMS and Sensors Quick Reference Guide 1.1
09 Dec 2020
09 Dec 2020
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06 Aug 2020
06 Aug 2020
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Sensor & motion algorithm software pack for STM32Cube 1.0
29 Oct 2018
29 Oct 2018
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EDA Symbols, Footprints and 3D Models

STMicroelectronics - LSM9DS1

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

品質 & 信頼性

製品型番 Marketing Status パッケージ RoHSコンプライアンスグレード 材料宣誓書**
LSM9DS1TR
量産中
TFLGA 3.5X3X1 24L Ecopack2

LSM9DS1TR

Package:

TFLGA 3.5X3X1 24L

Material Declaration**:

PDF XML
More Info

Marketing Status

量産中

Package

TFLGA 3.5X3X1 24L

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番
販売代理店からオーダー
STからオーダー
製品ステータス
ECCN (US)
ECCN (EU)
梱包タイプ
パッケージ
温度（℃） Country of Origin
Budgetary Price (US$)*/Qty
最小
最大
LSM9DS1TR Available at 1 distributors

販売代理店在庫LSM9DS1TR

代理店名
地域 在庫 最小発注 パートナー企業リンク
ARROW EUROPE 4000 0 発注する

代理店レポートによる在庫データ: 2021-01-24

代理店名

ARROW

在庫

4000

Min.Order

0

地域

EUROPE 発注する

代理店レポートによる在庫データ: 2021-01-24

量産中
EAR99 NEC Tape And Reel TFLGA 3.5X3X1 24L -40 85 MALTA 3.229 / 1k

LSM9DS1TR

製品ステータス

量産中

ECCN (US)

EAR99
詳細情報

Budgetary Price (US$)*/Qty

3.229 / 1k

販売代理店在庫LSM9DS1TR

代理店名
地域 在庫 最小発注 パートナー企業リンク
ARROW EUROPE 4000 0 発注する

代理店レポートによる在庫データ: 2021-01-24

代理店名

ARROW

在庫

4000

Min.Order

0

地域

EUROPE 発注する

代理店レポートによる在庫データ: 2021-01-24

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

TFLGA 3.5X3X1 24L

Operating Temperature (°C)

(最小)

-40

(最大)

85

Budgetary Price (US$)* / Qty

3.229 / 1k

Country of Origin

MALTA

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。