The LSM9DS1 is a system-in-package featuring a 3D digital linear acceleration sensor, a 3D digital angular rate sensor, and a 3D digital magnetic sensor.
The LSM9DS1 has a linear acceleration full scale of ±2g/±4g/±8/±16 g, a magnetic field full scale of ±4/±8/±12/±16 gauss and an angular rate of ±245/±500/±2000 dps.
The LSM9DS1 includes an I2C serial bus interface supporting standard and fast mode (100 kHz and 400 kHz) and an SPI serial standard interface.
Magnetic, accelerometer and gyroscope sensing can be enabled or set in power-down mode separately for smart power management.
The LSM9DS1 is available in a plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
|DS10101: iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer||3.0||1 MB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148 KB|
|DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance||1.0||616 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192 KB|
|MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience||1.0||1 MB|
|Sensor & motion algorithm software pack for STM32Cube||1.0||675 KB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|STEVAL-MKI159V1||ST||LSM9DS1 adapter board for standard DIL24 socket|
|製品型番||パッケージ||Packing Type||Marketing Status||Unit Price (US$) *||数量||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LSM9DS1TR||TFLGA 3.5X3X1 24L||Tape And Reel||Active : Product is in volume production||3.229||1000||EAR99||-||MORE INFO||Free Sample 買い物かごに追加||DISTRIBUTOR AVAILABILITY|
|製品型番||Marketing Status||パッケージ||RoHS Compliance Grade||Material Declaration**|
|LSM9DS1TR||アクティブ||TFLGA 3.5X3X1 24L||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.