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The LSM6DSO is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSO supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSO fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer.
High robustness to mechanical shock makes the LSM6DSO the preferred choice of system designers for the creation and manufacturing of reliable products.The LSM6DSO is available in a plastic land grid array (LGA) package.主な特徴
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbyte
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable Finite State Machine: accelerometer, gyroscope and external sensors
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | 製品ステータス | 概算価格（USS） | 数量 | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DSOTR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel |
Active
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1.99 | 1000 | EAR99 | - | 在庫チェック | Get sample |
| LSM6DSO | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tray |
Preview
|
- | - | EAR99 | - | No availability of distributors reported, please contact our sales office |
LSM6DSO
パッケージ
VFLGA2.5X3X.86 14L P.5 L.475X.25梱包タイプ
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
A bridge between the sensor on the motherboard and your laptop
開発環境
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写真 品名 製造元 概要 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 製品型番AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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写真 品名 製造元 概要 
X-NUCLEO-IKS01A3 ST Motion MEMS and environmental sensor expansion board for STM32 Nucleo 製品型番Motion MEMS and environmental sensor expansion board for STM32 Nucleo
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ソフトウェア製品
評価ツール
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写真 品名 製造元 概要 
STEVAL-MKI196V1 ST LSM6DSO adapter board for a standard DIL24 socket 製品型番LSM6DSO adapter board for a standard DIL24 socket
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写真 品名 製造元 概要 
STEVAL-BCN002V1B ST BlueTile - Bluetooth LE enabled sensor node development kit 製品型番BlueTile - Bluetooth LE enabled sensor node development kit
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サポート & アプリケーション
| 製品型番 | 製品ステータス | パッケージ | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|
| LSM6DSO |
Preview
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
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| LSM6DSOTR |
Active
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
