製品概要
概要
The STDES-SICGP4 reference design allows evaluating the switching and thermal performance of power SiC MOSFETs in an HiP247-4 (four-lead) package in a half-bridge topology.
The MOSFETs are controlled by isolated gate drivers. Drivers are supplied by isolated DC-DC converters.
The system requires the connection of an external inductor, a source, a load, an auxiliary supply, and PWM signals. It can be used to test operation in buck or boost configuration.
It is possible to use a low inductance shunt or to assemble a coaxial shunt to measure current through the low side MOSFET. In this perspective, the board can be used as a tool for double pulse test (DPT), to measure overshoot (voltage and current), speed (di/dt; dv/dt), and switching energy (EON; EOFF; ERR).
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All features
- Half-bridge structure assembled with power SiC MOSFETs in an HiP247-4 package
- Half-bridge driven by the STGAP2HS galvanic isolated gate driver optimized for SiC MOSFETs
- Isolated gate drivers supplied by an isolated fly-buck converter based on the L6986I
- Preset +18 V/-3 V supply voltage for output stage of isolated gate drivers
- Possibility to set a specific gate voltage, positive and negative level
- Possibility to set the gate resistor
- Low inductance sense resistor
- Prepared for a coaxial shunt resistor for a higher bandwidth of current measurement
- Specifications:
Max. DC input/output voltage: 1 kV Input current level peak (duration up to 100 μs): 69 A
推奨コンテンツ
すべてのリソース
| Resource title | Version | Latest update | Actions | Details | ダウンロード |
|---|
Board Manufacturing Specifications (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 13 Dec 2022 | 13 Dec 2022 |
BOM (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 13 Dec 2022 | 13 Dec 2022 |
Schematic Pack (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 13 Dec 2022 | 13 Dec 2022 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHSコンプライアンスグレード | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| STDES-SICGP4 | Active 交換品交換品 | - | Industrial | - | Yes | - | - | |
STDES-SICGP4
Package:
-Material Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
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Sample & Buy
| Part Number | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | Board production status | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STDES-SICGP4 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
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STDES-SICGP4 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。