Product overview
概要
The testing board contains a half-bridge (HB) structure based on two high voltage SiC MOSFETs. The MOSFETs are controlled by isolated gate drivers, which are supplied by isolated DC-DC converters. The system requires external connections for an inductor, source, load, auxiliary supply, and PWM signals. It can be used for testing operation in buck or boost configuration. It is possible to use a low inductance shunt or assemble a coaxial shunt to measure current through the low side MOSFET. In this perspective, the board can be used as a tool for double pulse test (DPT).
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All features
- Half Bridge structure assembled by Power SiC MOSFETs in HU3PAK package
- Both Power MOSFETs are driven by STGAP2HS. Isolated gate drive optimized for SiC MOSFETs
- Isolated gate drivers are supplied by isolated fly-buck converter based on L6596I
- Preset 18 V/-3 V supply voltage for output stage of isolated drivers
- Possibility to set a specific gate voltage positive and negative level
- Possibility to set gate resistor
- Low inductance sense resistor
- Prepared for coaxial shunt resistor for higher bandwidth of current measurement
- Working voltage up to 1 kV
推奨コンテンツ
すべてのリソース
| Resource title | Version | Latest update | Actions | Details | ダウンロード |
|---|
Board Manufacturing Specifications (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 19 Feb 2024 | 19 Feb 2024 |
BOM (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 19 Feb 2024 | 19 Feb 2024 |
Schematic Pack (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 19 Feb 2024 | 19 Feb 2024 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHSコンプライアンスグレード | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| STDES-SICGPHU3 | Active 交換品交換品 | CARD | Industrial | - | Yes | - | - | |
STDES-SICGPHU3
Package:
CARDMaterial Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
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Sample & Buy
| Part Number | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | Board production status | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STDES-SICGPHU3 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
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STDES-SICGPHU3 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。