VB5943 | 製品 - STマイクロエレクトロニクス

はじめる

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製品概要

主な利点

コンピュータ･ビジョンを簡単に

パワフルなオンチップ･プロセッシングとMIPI CSI-2出力により、統合が最適化されるとともに、電力消費は低減され、組み込みビジョン･アプリケーションに最適化された優れた画質を実現します。

どんな光の中でも鮮明な画像

可視光から近赤外光までの優れた感度と高いMTFを、オンチップHDRと組み合わせることで、最も暗い屋外環境でも鮮明で詳細な画像を提供します。

グローバル･シャッタ & ローリング･シャッタ

乱れのない明瞭さと、卓越したダイナミック･レンジ、最適化された光感度を組み合わせることで、あらゆるシナリオで多彩で高品質な画像を実現します。

概要

The VB5943 and VD5943 are 5.1 megapixel, 2.25 µm global, and rolling shutter image sensors. They are designed for a wide spectrum of applications that require capturing monochromatic from visible to NIR (near infrared) images. Operation of these sensors combines global and rolling shutter technology with an extended dynamic range.

VB1943, VB5943: Webpage illustration .png

Leveraging from preeminent 3D stacking and ST patented processes, these sensors perform outstandingly in the NIR (940 nm) and visible region. In global shutter mode, they can capture up to 100 frames per second in a 2560 x 1984 resolution format in global shutter operation.

The VB5943 and VD5943 sensors can be used in rolling shutter mode, taking advantage of low dark noise capability. They can operate in an 18-bit HDR mode compressed down to 12 or 10 bits through a customizable PWL.

For computer vision applications, or night or low light conditions, acquisition can be switched to global shutter mode with an NIR light source. Switching to global shutter mode with an external NIR light source greatly reduces the system power consumption that is required to drive the illumination.

These sensors are also capable of working in split exposure, enabling spatial HDR mode.

特徴
Resolution: 5.1 megapixel sensor (2560 x 1984)

Chroma: Monochrome

Optical format: 1/2.5 inch

Image array size: 5.8 mm x 4.5 mm

Pixel technology:

3D stacked sensor with 2.25 μm x 2.25 μm BSI pixel size

Global and rolling shutter technology

Functions:

Dual exposure modes for:Common exposure (same for all pixels)Split exposure (specific exposure control for 1 pixel in each 2x2 kernel)

Automatic/external synchronization mode

Independent horizontal and vertical image flip

Automatic dark calibration

Dynamic defective pixel correction

Integrated noise reduction feature
Advanced image processing:

Embedded 18-bit high dynamic range pixel reconstruction

Four programmable contexts with versatile sequencing management

Frame rates:

Up to 100 frames per second at full resolution in global shutter mode

Up to 50 frames per second at full resolution in rolling shutter mode

Interfaces:

MIPI CSI-2 interface (dual/quad lanes, max. 1.5 Gbps/lane)

MIPI CCI control interface up to 1 MHz

4 programmable GPIOs (general-purpose input/output) to control external illuminators:Output is synchronized with sensor integration periodsPWM (pulse-width modulation) control

Additional features: Integrated temperature sensor

Package options:

Available as bare die

Available in OBGA package

OBGA package:

Package size: 10.3 x 8.9 mm

Ball matrix: 10 x 9 balls, pitch 0.8 mm
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