VB5943
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Design Win
Feature-rich 5-megapixel monochrome CMOS image sensor with hybrid shutter

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Product overview

Key Benefits

Sharp imaging in every light

Exceptional sensitivity and high MTF from visible to near-infrared, combined with on-chip HDR, deliver crisp, detailed images even in the darkest outdoor environments.

Dual global and rolling shutter

Combine artifact-free clarity with exceptional dynamic range and optimized light sensitivity for versatile, high-quality image capture in every scenario.

Computer vision made easy

Powerful on-chip processing and MIPI CSI-2 output streamline integration and lower power, enabling superior image quality optimized for embedded vision applications.

Description

The VB5943 and VD5943 are 5.1 megapixel, 2.25 µm global, and rolling shutter image sensors. They are designed for a wide spectrum of applications that require capturing monochromatic from visible to NIR (near infrared) images. Operation of these sensors combines global and rolling shutter technology with an extended dynamic range.

Leveraging from preeminent 3D stacking and ST patented processes, these sensors perform outstandingly in the NIR (940 nm) and visible region. In global shutter mode, they can capture up to 100 frames per second in a 2560 x 1984 resolution format in global shutter operation.

The VB5943 and VD5943 sensors can be used in rolling shutter mode, taking advantage of low dark noise capability. They can operate in an 18-bit HDR mode compressed down to 12 or 10 bits through a customizable PWL.

For computer vision applications, or night or low light conditions, acquisition can be switched to global shutter mode with an NIR light source. Switching to global shutter mode with an external NIR light source greatly reduces the system power consumption that is required to drive the illumination.

These sensors are also capable of working in split exposure, enabling spatial HDR mode.

  • All features

    • Resolution: 5.1 megapixel sensor (2560 x 1984)
    • Chroma: Monochrome
    • Optical format: 1/2.5 inch
    • Image array size: 5.8 mm x 4.5 mm
    • Pixel technology:
      • 3D stacked sensor with 2.25 μm x 2.25 μm BSI pixel size
      • Global and rolling shutter technology
    • Functions:
      • Dual exposure modes for:Common exposure (same for all pixels)Split exposure (specific exposure control for 1 pixel in each 2x2 kernel)
      • Automatic/external synchronization mode
      • Independent horizontal and vertical image flip
      • Automatic dark calibration
      • Dynamic defective pixel correction
      • Integrated noise reduction feature
    • Advanced image processing:
      • Embedded 18-bit high dynamic range pixel reconstruction
      • Four programmable contexts with versatile sequencing management
    • Frame rates:
      • Up to 100 frames per second at full resolution in global shutter mode
      • Up to 50 frames per second at full resolution in rolling shutter mode
    • Interfaces:
      • MIPI CSI-2 interface (dual/quad lanes, max. 1.5 Gbps/lane)
      • MIPI CCI control interface up to 1 MHz
      • 4 programmable GPIOs (general-purpose input/output) to control external illuminators:Output is synchronized with sensor integration periodsPWM (pulse-width modulation) control
    • Additional features: Integrated temperature sensor
    • Package options:
      • Available as bare die
      • Available in OBGA package
    • OBGA package:
      • Package size: 10.3 x 8.9 mm
      • Ball matrix: 10 x 9 balls, pitch 0.8 mm

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - VB5943

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Longevity Commitment Longevity Starting Date Material Declaration**
VB5943CAJX
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VB5943CAJX

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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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