Ultra low power 3-axis accelerometer, SPI/I2C digital output MEMS motion sensor, user-selectable full scales of ±100g/±200g

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  • The H3LIS200DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.

    The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
    The H3LIS200DL has dynamically user-selectable full scales of ±100g/±200g and is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
    The H3LIS200DL is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

    主な特徴

    Wide supply voltage, 2.16 V to 3.6 V


    Low-voltage compatible IOs, 1.8 V


    Ultra-low power consumption down to 10 μA in low-power mode


    ±100g/±200g dynamically selectable full scales


    I2C/SPI digital output interface
    8-bit data output


    Sleep-to-wakeup function


    10000 g high shock survivability


    ECOPACK®, RoHS and “Green” compliant

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製品型番
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H3LIS200DL LLGA 16 3x3x1.0 Tray
Active
4 1000 EAR99 - No availability of distributors reported, please contact our sales office
H3LIS200DLTR LLGA 16 3x3x1.0 Tape And Reel
Active
4 1000 EAR99 - Check Availability

Distributor availability ofH3LIS200DLTR

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DIGIKEY WORLDWIDE 2701 1 Order Now
MOUSER WORLDWIDE 104 1 Order Now
Farnell Element14 EUROPE 3 1 Order Now

代理店レポートによる在庫データ: 2019-03-25

代理店名

DIGIKEY

在庫

2701

Min.Order

1

地域

WORLDWIDE Order Now

MOUSER

在庫

104

Min.Order

1

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WORLDWIDE Order Now

Farnell Element14

在庫

3

Min.Order

1

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EUROPE Order Now

代理店レポートによる在庫データ: 2019-03-25

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H3LIS200DL

パッケージ

LLGA 16 3x3x1.0

Packing Type

Tray

Unit Price (US$)

4.0*

Marketing Status

Active

Unit Price (US$)

4

数量

1000

ECCN (US)

EAR99

Country of Origin

-

H3LIS200DLTR

パッケージ

LLGA 16 3x3x1.0

Packing Type

Tape And Reel

Unit Price (US$)

4.0*

Distributor availability ofH3LIS200DLTR

代理店名
地域 在庫 最小発注 Third party link
DIGIKEY WORLDWIDE 2701 1 Order Now
MOUSER WORLDWIDE 104 1 Order Now
Farnell Element14 EUROPE 3 1 Order Now

代理店レポートによる在庫データ: 2019-03-25

代理店名

DIGIKEY

在庫

2701

Min.Order

1

地域

WORLDWIDE Order Now

MOUSER

在庫

104

Min.Order

1

地域

WORLDWIDE Order Now

Farnell Element14

在庫

3

Min.Order

1

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-03-25

Marketing Status

Active

Unit Price (US$)

4

数量

1000

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

開発環境

    • 製品型番

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      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

    • 製品型番

      Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!

      Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

評価ツール

    • 製品型番

      H3LIS200DL adapter board for a standard DIL 24 socket

Support and Applications

    • 製品型番

      Complete hardware and firmware design for all applications

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

00 Files Selected

技術文書

    • Description バージョン サイズ アクション
      DS10884
      MEMS motion sensor: low-power high-g 3-axis digital accelerometer
      2.0
      659.25 KB
      PDF
      DS10884

      MEMS motion sensor: low-power high-g 3-axis digital accelerometer

    • Description バージョン サイズ アクション
      TN0018
      Surface mounting guidelines for MEMS sensors in an LGA package
      6.0
      214.31 KB
      PDF
      TN0018

      Surface mounting guidelines for MEMS sensors in an LGA package

    • Description バージョン サイズ アクション
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0053
      6-point tumble sensor calibration
      1.0
      464.9 KB
      PDF
      DT0126
      Low-power application design with ST's MEMS accelerometers
      1.0
      184.68 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0127
      ST's MEMS accelerometer sensor testing & self-test
      1.1
      409.32 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0053

      6-point tumble sensor calibration

      DT0126

      Low-power application design with ST's MEMS accelerometers

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

      DT0127

      ST's MEMS accelerometer sensor testing & self-test

Publications and Collaterals

    • Description バージョン サイズ アクション
      Industrial MEMS motion sensors 1.0
      659.27 KB
      PDF

      Industrial MEMS motion sensors

    • Description バージョン サイズ アクション
      MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience 1.0
      1.91 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      675.19 KB
      PDF
      Sensors for industrial and multi-segment solutions 1.0
      1.77 MB
      PDF

      MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience

      Sensor & motion algorithm software pack for STM32Cube

      Sensors for industrial and multi-segment solutions

    • Description バージョン サイズ アクション
      Capacitive MEMS accelerometer for condition monitoring 1.0
      3.35 MB
      PDF

      Capacitive MEMS accelerometer for condition monitoring

製品型番 Marketing Status パッケージ RoHS Compliance Grade Material Declaration**
H3LIS200DL
Active
LLGA 16 3x3x1.0 Ecopack2
H3LIS200DLTR
Active
LLGA 16 3x3x1.0 Ecopack2

H3LIS200DL

Package:

LLGA 16 3x3x1.0

Material Declaration**:

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

H3LIS200DLTR

Package:

LLGA 16 3x3x1.0

Material Declaration**:

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.