H3LIS200DL

Active

Ultra low power 3-axis accelerometer, SPI/I2C digital output MEMS motion sensor, user-selectable full scales of ±100g/±200g

Download datasheet Order Direct
Overview
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
eDesignSuite
Get Started
Partner products
Sales Briefcase
  • The H3LIS200DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.

    The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
    The H3LIS200DL has dynamically user-selectable full scales of ±100g/±200g and is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
    The H3LIS200DL is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

    Key Features

    • Wide supply voltage, 2.16 V to 3.6 V
    • Low-voltage compatible IOs, 1.8 V
    • Ultra-low power consumption down to 10 μA in low-power mode
    • ±100g/±200g dynamically selectable full scales
    • I2C/SPI digital output interface
    • 8-bit data output
    • Sleep-to-wakeup function
    • 10000 g high shock survivability
    • ECOPACK®, RoHS and “Green” compliant

Recommended for you

Related Applications

Energy generation and distribution

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      AWS IoT Core

      Active

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices

      Cloud AWS

      AZURE Cloud

      Active

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

      Cloud Microsoft

      Watson IoT Platform

      Active

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

      Cloud IBM
      AWS IoT Core

      Description:

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
      AZURE Cloud

      Description:

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
      Watson IoT Platform

      Description:

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
    • Part number
      Status
      Description
      Type
      Supplier

      STEVAL-MKI167V1

      Active

      H3LIS200DL adapter board for a standard DIL 24 socket

      MEMS Motion Sensor Eval Boards ST
      STEVAL-MKI167V1

      Description:

      H3LIS200DL adapter board for a standard DIL 24 socket
    • Part number
      Status
      Description
      Type
      Supplier

      Hardware and firmware design

      Active

      Complete hardware and firmware design for all applications

      Engineering Services SIANA Systems

      SensiEDGE customization services

      Active

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Engineering Services SensiEDGE

      SensorTile.box customization services

      Active

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

      Engineering Services FAE Technology
      Hardware and firmware design

      Description:

      Complete hardware and firmware design for all applications
      SensiEDGE customization services

      Description:

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
      SensorTile.box customization services

      Description:

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

EDA Symbols, Footprints and 3D Models

STMicroelectronics - H3LIS200DL

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

Quality and Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
H3LIS200DL
Active
LLGA 16 3x3x1.0 Ecopack2
H3LIS200DLTR
Active
LLGA 16 3x3x1.0 Ecopack2

H3LIS200DL

Package:

LLGA 16 3x3x1.0

Material Declaration**:

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

H3LIS200DLTR

Package:

LLGA 16 3x3x1.0

Material Declaration**:

Marketing Status

Active

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Country of Origin
Budgetary Price (US$)*/Qty
min
max
H3LIS200DL Available at 1 distributors

Distributor availability ofH3LIS200DL

Distributor Name
Region Stock Min. Order Third party link
RUTRONIK EUROPE 5880 490 Order Now

Distributor reported inventory date: 2020-11-23

Distributor Name

RUTRONIK

Stock

5880

Min.Order

490

Region

EUROPE Order Now

Distributor reported inventory date: 2020-11-23

Active
EAR99 NEC Tray LLGA 16 3x3x1.0 -40 85 MALTA 4.0 / 1k
H3LIS200DLTR Available at 1 distributors

Distributor availability ofH3LIS200DLTR

Distributor Name
Region Stock Min. Order Third party link
MOUSER WORLDWIDE 1099 1 Order Now

Distributor reported inventory date: 2020-11-23

Distributor Name

MOUSER

Stock

1099

Min.Order

1

Region

WORLDWIDE Order Now

Distributor reported inventory date: 2020-11-23

Free Sample Buy Direct
Active
EAR99 NEC Tape And Reel LLGA 16 3x3x1.0 -40 85 MALTA 4.0 / 1k

H3LIS200DL

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

4.0 / 1k

Distributor availability ofH3LIS200DL

Distributor Name
Region Stock Min. Order Third party link
RUTRONIK EUROPE 5880 490 Order Now

Distributor reported inventory date: 2020-11-23

Distributor Name

RUTRONIK

Stock

5880

Min.Order

490

Region

EUROPE Order Now

Distributor reported inventory date: 2020-11-23

ECCN (EU)

NEC

Packing Type

Tray

Package

LLGA 16 3x3x1.0

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

4.0 / 1k

Country of Origin

MALTA

H3LIS200DLTR

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

4.0 / 1k

Distributor availability ofH3LIS200DLTR

Distributor Name
Region Stock Min. Order Third party link
MOUSER WORLDWIDE 1099 1 Order Now

Distributor reported inventory date: 2020-11-23

Distributor Name

MOUSER

Stock

1099

Min.Order

1

Region

WORLDWIDE Order Now

Distributor reported inventory date: 2020-11-23

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

LLGA 16 3x3x1.0

Operating Temperature (°C)

(min)

-40

(max)

85

Budgetary Price (US$)* / Qty

4.0 / 1k

Country of Origin

MALTA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors