STM32L151C6

NRND
Education

Ultra-low-power Arm Cortex-M3 MCU with 32 Kbytes of Flash memory, 32 MHz CPU, USB

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製品概要

概要

The ultra-low-power STM32L151x6/8/B and STM32L152x6/8/B devices incorporate the connectivity power of the universal serial bus (USB) with the high-performance ARM®Cortex®-M3 32-bit RISC core operating at 32 MHz frequency (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 16 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All the devices offer a 12-bit ADC, 2 DACs and 2 ultra-low-power comparators, six general-purpose 16-bit timers and two basic timers, which can be used as time bases.
Moreover, the STM32L151x6/8/B and STM32L152x6/8/B devices contain standard and advanced communication interfaces: up to two I2Cs and SPIs, three USARTs and a USB. The STM32L151x6/8/B and STM32L152x6/8/B devices offer up to 20 capacitive sensing channels to simply add touch sensing functionality to any application.
They also include a real-time clock and a set of backup registers that remain powered in Standby mode.
Finally, the integrated LCD controller (except STM32L151x6/8/B devices) has a built-in LCD voltage generator that allows to drive up to 8 multiplexed LCDs with contrast independent of the supply voltage.
The ultra-low-power STM32L151x6/8/B and STM32L152x6/8/B devices operate from a 1.8 to 3.6 V power supply (down to 1.65 V at power down) with BOR and from a 1.65 to 3.6 V power supply without BOR option. It is available in the -40 to +85 °C temperature range, extended to 105°C in low power dissipation state. A comprehensive set of power-saving modes allows the design of low-power applications.
  • 特徴

    • Ultra-low-power platform
      • 1.65 V to 3.6 V power supply
      • -40°C to 85°C/105°C temperature range
      • 0.3 μA Standby mode (3 wakeup pins)
      • 0.9 μA Standby mode + RTC
      • 0.57 μA Stop mode (16 wakeup lines)
      • 1.2 μA Stop mode + RTC
      • 9 μA Low-power run mode
      • 214 μA/MHz Run mode
      • 10 nA ultra-low I/O leakage
      • < 8 μs wakeup time
    • Core: ARM®Cortex®-M3 32-bit CPU
      • From 32 kHz up to 32 MHz max
      • 1.25 DMIPS/MHz (Dhrystone 2.1)
      • Memory protection unit
    • Reset and supply management
      • Ultra-safe, low-power BOR (brownout reset) with 5 selectable thresholds
      • Ultra-low-power POR/PDR
      • Programmable voltage detector (PVD)
    • Clock sources
      • 1 to 24 MHz crystal oscillator
      • 32 kHz oscillator for RTC with calibration
      • High Speed Internal 16 MHz factory-trimmed RC (+/- 1%)
      • Internal low-power 37 kHz RC
      • Internal multispeed low-power 65 kHz to 4.2 MHz
      • PLL for CPU clock and USB (48 MHz)
    • Pre-programmed bootloader
      • USART supported
    • Development support
      • Serial wire debug supported
      • JTAG and trace supported
    • Up to 83 fast I/Os (73 I/Os 5V tolerant), all mappable on 16 external interrupt vectors
    • Memories
      • Up to 128 Kbytes Flash memory with ECC
      • Up to 16 Kbytes RAM
      • Up to 4 Kbytes of true EEPROM with ECC
      • 80-byte backup register
    • LCD Driver (except STM32L151x/6/8/B devices) for up to 8x40 segments
      • Support contrast adjustment
      • Support blinking mode
      • Step-up converter on board
    • Rich analog peripherals (down to 1.8 V)
      • 12-bit ADC 1 Msps up to 24 channels
      • 12-bit DAC 2 channels with output buffers
      • 2x ultra-low-power-comparators(window mode and wake up capability)
    • DMA controller 7x channels
    • 8x peripheral communication interfaces
      • 1x USB 2.0 (internal 48 MHz PLL)
      • 3x USARTs (ISO 7816, IrDA)
      • 2x SPIs 16 Mbit/s
      • 2x I2Cs (SMBus/PMBus)
    • 10x timers: 6x 16-bit with up to 4 IC/OC/PWM channels, 2x 16-bit basic timers, 2x watchdog timers (independent and window)
    • Up to 20 capacitive sensing channels supporting touchkey, linear and rotary touch sensors
    • CRC calculation unit, 96-bit unique ID

All tools & software

    • 製品型番
      ステータス
      概要
      タイプ
      サプライヤ

      Enhanced Carrier Connectivity Services

      量産中

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      クラウド Sierra Wireless
      Enhanced Carrier Connectivity Services

      概要:

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Global Smart Connectivity Services

      量産中

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      クラウド Sierra Wireless
      Global Smart Connectivity Services

      概要:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      量産中

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

      クラウド Sierra Wireless
      Octave Services

      概要:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
    • 製品型番
      ステータス
      概要
      タイプ
      サプライヤ

      Enhanced Carrier Connectivity SIM

      量産中

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      コンポーネント & モジュール Sierra Wireless
      Enhanced Carrier Connectivity SIM

      概要:

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Global Smart Connectivity SIM

      量産中

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      コンポーネント & モジュール Sierra Wireless
      Global Smart Connectivity SIM

      概要:

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Octave Cellular Modules

      量産中

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      コンポーネント & モジュール Sierra Wireless
      Octave Cellular Modules

      概要:

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      RF Modules

      量産中

      RF modules for Sub GigaHz and Bluetooth.

      コンポーネント & モジュール DiZiC
      RF Modules

      概要:

      RF modules for Sub GigaHz and Bluetooth.

      SIGFOX-MOD1-C / -E

      量産中

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.

      コンポーネント & モジュール XoverIoT
      SIGFOX-MOD1-C / -E

      概要:

      The SIGFOX-MOD1 are ultra-low-power modules designed especially for sensor node applications mounted with chip antenna.