概要
ツール & ソフトウェア
リソース
ソリューション
品質 & 信頼性
Sales Briefcase
eDesignSuite
Get Started
サンプル & 購入
Partner products
  • This silicon carbide Power MOSFET has been developed using ST’s advanced and innovative 2nd generation SiC MOSFET technology. The device features remarkably low on-resistance per unit area and very good switching performance.

    主な特徴

    • Very tight variation of on-resistance vs. temperature
    • Very fast and robust intrinsic body diode
    • Low capacitance

サンプル & 購入

製品型番
パッケージ
梱包タイプ
製品ステータス
概算価格(USS)
数量
ECCN (US)
Country of Origin
販売代理店からオーダー
STからオーダー
SCTH35N65G2V-7 H2PAK-7 Tape And Reel
Active
15 1000 EAR99 CHINA No availability of distributors reported, please contact our sales office

SCTH35N65G2V-7

パッケージ

H2PAK-7

梱包タイプ

Tape And Reel

Unit Price (US$)

15.0*

製品ステータス

Active

Unit Price (US$)

15

数量

1000

ECCN (US)

EAR99

Country of Origin

CHINA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

推奨コンテンツ

00 ファイルがダウンロード用に選択されています

技術文書

    • 概要 バージョン サイズ アクション
      DS12047
      Silicon carbide Power MOSFET 650 V, 45 A, 65 mΩ (typ., TJ = 175 °C) in an H2PAK-7 package
      2.0
      791.46 KB
      PDF
      DS12047

      Silicon carbide Power MOSFET 650 V, 45 A, 65 mΩ (typ., TJ = 175 °C) in an H2PAK-7 package

    • 概要 バージョン サイズ アクション
      AN4671
      How to fine tune your SiC MOSFET gate driver to minimize losses
      1.1
      555.54 KB
      PDF
      AN5355
      Mitigation technique of the SiC MOSFET gate voltage glitches with Miller clamp
      1.0
      6.39 MB
      PDF
      AN3152
      The right technology for solar converters
      1.4
      416.3 KB
      PDF
      AN4671

      How to fine tune your SiC MOSFET gate driver to minimize losses

      AN5355

      Mitigation technique of the SiC MOSFET gate voltage glitches with Miller clamp

      AN3152

      The right technology for solar converters

    • 概要 バージョン サイズ アクション
      TA0349
      Comparative analysis of driving approach and performance of 1.2 kV SiC MOSFETs, Si IGBTs, and normally-off SiC JFETs
      2.2
      2.34 MB
      PDF
      TA0349

      Comparative analysis of driving approach and performance of 1.2 kV SiC MOSFETs, Si IGBTs, and normally-off SiC JFETs

    • 概要 バージョン サイズ アクション
      UM1575
      Spice model tutorial for Power MOSFETs
      1.3
      1.51 MB
      PDF
      UM1575

      Spice model tutorial for Power MOSFETs

関連資料

    • 概要 バージョン サイズ アクション
      SiC MOSFET: The real breakthrough in high-voltage switching 1.0
      401.67 KB
      PDF
      SiC MOSFETs: The real breakthrough in high-voltage switching 3.0
      651.11 KB
      PDF

      SiC MOSFET: The real breakthrough in high-voltage switching

      SiC MOSFETs: The real breakthrough in high-voltage switching

    • 概要 バージョン サイズ アクション
      Electric vehicle (EV) ecosystem 1.1
      1.03 MB
      PDF

      Electric vehicle (EV) ecosystem

    • 概要 バージョン サイズ アクション
      3C-SiC Hetero-Epitaxially Grown on Silicon Compliance Substrates and New 3C-SiC Substrates for Sustainable Wide-Band-Gap Power Devices 1.0
      760.82 KB
      PDF
      Cost benefits of a SiC MOSFET-based high frequency converter 1.0
      1.8 MB
      PDF
      Design rules for paralleling of Silicon Carbide Power MOSFETs 1.0
      582.21 KB
      PDF
      SiC and Silicon MOSFET solution for high frequency DC-AC converters 1.0
      1.06 MB
      PDF
      Stacking Faults Defects on 3C-SiC Homo-Epitaxial Films 1.0
      980.73 KB
      PDF
      Stress Relaxation Mechanism after Thinning Process on 4H-SiC Substrate 1.0
      1.35 MB
      PDF
      Wide bandgap materials: revolution in automotive power electronics 1.0
      792.49 KB
      PDF

      3C-SiC Hetero-Epitaxially Grown on Silicon Compliance Substrates and New 3C-SiC Substrates for Sustainable Wide-Band-Gap Power Devices

      Cost benefits of a SiC MOSFET-based high frequency converter

      Design rules for paralleling of Silicon Carbide Power MOSFETs

      SiC and Silicon MOSFET solution for high frequency DC-AC converters

      Stacking Faults Defects on 3C-SiC Homo-Epitaxial Films

      Stress Relaxation Mechanism after Thinning Process on 4H-SiC Substrate

      Wide bandgap materials: revolution in automotive power electronics

製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
SCTH35N65G2V-7
Active
H2PAK-7 インダストリアル Ecopack2

SCTH35N65G2V-7

Package:

H2PAK-7

Material Declaration**:

Marketing Status

Active

Package

H2PAK-7

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.