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  • The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

    It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
    These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
    The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
    They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
    The ST33TPHF20SPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
    The ST33TPHF20SPI supports TPM 2.0 commands exclusively, and offers 112 Kbytes of user-dedicated non-volatile memory.
    The ST33TPHF20SPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
    The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

    主な特徴

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 2 certification
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS-compliant random-number generator (RNG) built on an SP800-90A compliant SHA256 deterministic random bit generator (DRBG) and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA (Rivest-Shamir-Adleman) key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • Hash-based message authentication code (HMAC) SHA-1 & SHA-256
        • Advanced Encryption Standard (AES)-128-192-256
        • Elliptic curve cryptography (ECC) 224 & 256 bits
        • Elliptic curve Diffie–Hellman (ECDH) 224 & 256 bits
        • Elliptic curve direct anonymous attestation (ECDAA)
    • Product compliance
      • TPM 2.0 compliant with Microsoft Windows 8.1 and 10
      • Compliant with Intel TXT
      • TPM 2.0 compliant with the corresponding TCG test suites

推奨コンテンツ

評価ツール

    • 製品型番

      TPM development kit

00 ファイルがダウンロード用に選択されています

技術文書

    • 概要 バージョン サイズ アクション
      DB2868
      Flash-memory-based TPM 2.0 device with an SPI interface
      4.0
      429.77 KB
      PDF
      DB2868

      Flash-memory-based TPM 2.0 device with an SPI interface

    • 概要 バージョン サイズ アクション
      TN1330
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates
      1.0
      158.71 KB
      PDF
      TN1309
      ST33TPHF2ESPI, ST33TPHF20SPI, ST33TPHF2EI2C and ST33TPHF20I2C TPM 2.0 security recommendations
      2.0
      185.23 KB
      PDF
      TN1330

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

      TN1309

      ST33TPHF2ESPI, ST33TPHF20SPI, ST33TPHF2EI2C and ST33TPHF20I2C TPM 2.0 security recommendations

Presentations & Training Material

    • 概要 バージョン サイズ アクション
      Authentication and IoT secure solutions 1.0
      561.07 KB
      PDF

      Authentication and IoT secure solutions

関連資料

    • 概要 バージョン サイズ アクション
      STSAFE-TPM standardized solution for trusted devices 1.0
      226.91 KB
      PDF

      STSAFE-TPM standardized solution for trusted devices

    • 概要 バージョン サイズ アクション
      Make LoRa® easy and secure 1.0
      1.16 MB
      PDF
      Making Sigfox devices easy and secure 1.0
      1.1 MB
      PDF
      STSAFE for authentication and embedded security 1.0
      1.13 MB
      PDF
      Secure solutions portfolio 1.1
      1.26 MB
      PDF

      Make LoRa® easy and secure

      Making Sigfox devices easy and secure

      STSAFE for authentication and embedded security

      Secure solutions portfolio

Digital Certificates

    • 概要 バージョン サイズ アクション
      GlobalSign Trusted Computing CA 1.0
      928 Byte(s)
      ZIP
      GlobalSign Trusted Platform Module ECC Root CA 1.0
      693 Byte(s)
      ZIP
      ST Intermediate CA 05 1.0
      1.04 KB
      ZIP
      ST TPM Root Certificates 1.0
      1.07 KB
      ZIP
      STM TPM ECC Intermediate CA 01 1.0
      691 Byte(s)
      ZIP
      STM TPM ECC Root CA 01 1.0
      800 Byte(s)
      ZIP

      GlobalSign Trusted Computing CA

      GlobalSign Trusted Platform Module ECC Root CA

      ST Intermediate CA 05

      ST TPM Root Certificates

      STM TPM ECC Intermediate CA 01

      STM TPM ECC Root CA 01

品質 & 信頼性

製品型番 Marketing Status パッケージ RoHSコンプライアンスグレード 材料宣誓書**
ST33HTPH2028AHD1
量産中
TSSOP28 9.7 x 4.4 Ecopack2
ST33HTPH2032AHD1
量産中
VFQFPN 32 5x5x1.0 Ecopack2

ST33HTPH2028AHD1

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

ST33HTPH2032AHD1

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番
販売代理店からオーダー
STからオーダー
製品ステータス
ECCN (US)
ECCN (EU)
梱包タイプ
パッケージ
温度(℃) Country of Origin
Budgetary Price (US$)*/Qty
最小
最大
ST33HTPH2028AHD1

販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください

量産中
EAR99 NEC Tape And Reel TSSOP28 9.7 x 4.4 0 70 PHILIPPINES
ST33HTPH2032AHD1

販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください

量産中
EAR99 NEC Tape And Reel VFQFPN 32 5x5x1.0 0 70 PHILIPPINES

ST33HTPH2028AHD1

製品ステータス

量産中

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

TSSOP28 9.7 x 4.4

Operating Temperature (°C)

(最小)

0

(最大)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

ST33HTPH2032AHD1

製品ステータス

量産中

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

VFQFPN 32 5x5x1.0

Operating Temperature (°C)

(最小)

0

(最大)

70

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*)概算用の希望小売単価(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。