ST33TPHF20SPI

Active

Trusted Platform Module 2.0 with TCG SPI interface

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  • The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

    It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
    These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
    The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
    They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
    The ST33TPHF20SPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
    The ST33TPHF20SPI supports TPM 2.0 commands exclusively, and offers 112 Kbytes of user-dedicated non-volatile memory.
    The ST33TPHF20SPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
    The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

    Key Features

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 2 certification
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS-compliant random-number generator (RNG) built on an SP800-90A compliant SHA256 deterministic random bit generator (DRBG) and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA (Rivest-Shamir-Adleman) key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • Hash-based message authentication code (HMAC) SHA-1 & SHA-256
        • Advanced Encryption Standard (AES)-128-192-256
        • Elliptic curve cryptography (ECC) 224 & 256 bits
        • Elliptic curve Diffie–Hellman (ECDH) 224 & 256 bits
        • Elliptic curve direct anonymous attestation (ECDAA)
    • Product compliance
      • TPM 2.0 compliant with Microsoft Windows 8.1 and 10
      • Compliant with Intel TXT
      • TPM 2.0 compliant with the corresponding TCG test suites

Sample & Buy

Part Number
Marketing Status
Quantity
Budgetary Price (US$)*
Package
Packing Type
ECCN (EU)
Country of Origin
Order from Distributors
Order from ST
ST33HTPH2028AHD1
Active
- - TSSOP28 9.7 x 4.4 Tape And Reel NEC PHILIPPINES No availability of distributors reported, please contact our sales office
ST33HTPH2032AHD1
Active
- - VFQFPN 32 5x5x1.0 Tape And Reel NEC PHILIPPINES No availability of distributors reported, please contact our sales office

ST33HTPH2028AHD1

Marketing Status

Active

Quantity

-

Unit Price (US$)

*

Unit Price (US$)

-

Package

TSSOP28 9.7 x 4.4

Packing Type

Tape And Reel

ECCN (EU)

NEC

Country of Origin

PHILIPPINES

ST33HTPH2032AHD1

Marketing Status

Active

Quantity

-

Unit Price (US$)

*

Unit Price (US$)

-

Package

VFQFPN 32 5x5x1.0

Packing Type

Tape And Reel

ECCN (EU)

NEC

Country of Origin

PHILIPPINES

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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Related Applications

Evaluation Tools

    • Part Number

      TPM development kit

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DB2868
      Flash-memory-based TPM 2.0 device with an SPI interface
      4.0
      429.77 KB
      PDF
      DB2868

      Flash-memory-based TPM 2.0 device with an SPI interface

    • Description Version Size Action
      TN1309
      ST33TPHF2ESPI, ST33TPHF20SPI, ST33TPHF2EI2C and ST33TPHF20I2C TPM 2.0 security recommendations
      1.0
      196.17 KB
      PDF
      TN1309

      ST33TPHF2ESPI, ST33TPHF20SPI, ST33TPHF2EI2C and ST33TPHF20I2C TPM 2.0 security recommendations

Publications and Collaterals

    • Description Version Size Action
      STSAFE-TPM Standardized solution for trusted devices 1.0
      195 KB
      PDF

      STSAFE-TPM Standardized solution for trusted devices

    • Description Version Size Action
      Make LoRa® easy and secure 1.0
      1.7 MB
      PDF
      Making Sigfox devices easy and secure 1.0
      1.42 MB
      PDF
      STSAFE - Secure Solutions for IoT 1.0
      1.12 MB
      PDF

      Make LoRa® easy and secure

      Making Sigfox devices easy and secure

      STSAFE - Secure Solutions for IoT

Digital Certificates

    • Description Version Size Action
      GlobalSign Trusted Computing CA 1.0
      928 Byte(s)
      ZIP
      GlobalSign Trusted Platform Module ECC Root CA 1.0
      693 Byte(s)
      ZIP
      ST Intermediate CA 05 1.0
      1.04 KB
      ZIP
      ST TPM Root Certificates 1.0
      1.07 KB
      ZIP
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates 4.0
      185.14 KB
      PDF
      STM TPM ECC Intermediate CA 01 1.0
      691 Byte(s)
      ZIP
      STM TPM ECC Root CA 01 1.0
      800 Byte(s)
      ZIP

      GlobalSign Trusted Computing CA

      GlobalSign Trusted Platform Module ECC Root CA

      ST Intermediate CA 05

      ST TPM Root Certificates

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

      STM TPM ECC Intermediate CA 01

      STM TPM ECC Root CA 01

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ST33HTPH2028AHD1
Active
TSSOP28 9.7 x 4.4 Ecopack2
ST33HTPH2032AHD1
Active
VFQFPN 32 5x5x1.0 Ecopack2

ST33HTPH2028AHD1

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

Marketing Status

Active

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

ST33HTPH2032AHD1

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

Marketing Status

Active

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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