製品概要
概要
The ST4SIM-111M is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for all industrial devices.
The ST4SIM-111M pre-integrates a cellular connectivity configuration provided by trusted partners. In this way, the product is ready to be deployed to the field.
The device ensures the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java® Card environment compliant with Java® Card v3.0.5 ClassicMoreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java® Card garbage collection mechanism optimizing the usage of the memory.
The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm® SecurCore® SC300™ RISC core.
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特徴
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- Cellular network connectivity configuration provided by trusted partners
- Compliant with 3G / 4G (LTE) / 5G / NB-IoT / CAT–M networks
- Network access applications supported: SIM / USIM / ISIM / CSIM
- Secure element access control (ARF / PKCS#15)
- OTA capability over SMS, CAT-TP & HTTPS (including DNS)
- Multi-interfaces able to combine (U)SIM + eSE
- Hardware
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- Product available on ST33G1M2M
- ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
- Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
- Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
- Serial peripheral interface (SPI), depending on packages
- Industrial qualification (JEDEC JESD47)
- Operating temperature: -40°C to +105°C
- Common Criteria EAL5+
- ECOPACK-compliant packages
- 2FF, 3FF or 4FF plugin card
- DFN8 with wettable flanks (MFF2)
- WLCSP11
- セキュリティ
- Symmetric cryptography DES / 3DES / AES
- Asymmetric cryptography RSA (up to 2048 bits)
- HTTPS remote management TLS v1.0, v1.1 and v1.2
- Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
- Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE
- Software standard compliancy
- Java® Cardv.3.0.5 Classic
- GlobalPlatform®card specification v2.3, including GP amendments A, B, C, D and E
- ETSI, 3GPP and 3GPP release 16 (for further information, contact the local STMicroelectronics sales office)
- Power saving features (PSM and eDRX) defined by ETSI
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EDAシンボル / フットプリント / 3Dモデル
STMicroelectronics - ST4SIM-111M
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品質 & 信頼性
| 製品型番 | マーケティング･ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|---|
| ST4SI1M0008SCIFW | 量産中 | VFDFPN 8 5X6 WETTABLE FLANK | インダストリアル | N/A | |
| ST4SIM-111M | 量産中 | DICE | インダストリアル | N/A | |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | パッケージ | 梱包タイプ | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度（℃） | Service and Connectivity Provider | Operating Temperature (°C) (min) | Service and Connectivity Provider | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | |||||||||||||||
| ST4SI1M0008SCIFW | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | VFDFPN 8 5X6 WETTABLE FLANK | Tape and Reel | PHILIPPINES | 3A991.a.2 | NEC | -40 | 105 | Soracom | -40 | Soracom | |||
| ST4SIM-111M | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | DICE | Not Applicable | FRANCE | 3A991.a.2 | NEC | -40 | 105 | - | -40 | - | |||
ST4SI1M0008SCIFW 量産中
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
ST4SIM-111M 量産中
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。