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予知保全とは

予知保全(PdM)は、さまざまなセンサから収集されたデータで構築された統計モデルにより、潜在的な故障を発生前に検知する機能です。設備状態の傾向を追跡する統計分析や機械学習など、さまざまなツールを活用することができ、その多くはクラウド上のものとなります。

産業用予知保全

状態モニタとは

状態モニタ(CM)は、潜在的な障害を見つけるために振動や温度といったさまざまなパラメータをモニタする機能です。設備の問題点を明らかにすることで、故障時期の推測、および故障を防ぐ予防保全に貢献します。

一般的にコンプレッサやポンプ、モータでは、継続的に状態モニタが行われます。状態モニタによってIndustry 4.0における生産現場の円滑な運営をサポートする上では、データ収集がきわめて重要となります。

    • 予防保全とは

      予防保全とは、実際の設備状態にかかわらず計画され、予定された保全のことを指します。一般的に、状態モニタ・システムや統計的なプロセス制御により得られる稼働年数やシステム利用状況から予想される設備状態に基づいて実施されます。しかしこの場合、実際の設備状態に基づいていないため、不要な保全や事後保全につながる可能性があります。また、機器に障害が発生した後で実施される潤滑剤や潤滑油の診断などに頼ることになります。

      予防保全と予知保全の主な違い

      予知保全システムでは、状態モニタ・センサが設備内のデータを収集することで劣化のパターンを特定し、より的確な故障予知に貢献します。予知保全ではこの際、統計的モニタを用いることもできますが、機械学習アルゴリズムが動作するニューラルネットワークを使って、データ内のパターンを特定することもできます。このようにシステムの状態をモニタすることで、予防保全の計画に貢献します。

      予知保全のメリットと予防保全
      予知保全と予防保全

      状態モニタ・センサの果たす重要な役割

      温度センサなどの状態モニタ・センサは、予測分析において重要な要素です。温度は障害を検出する上での鍵となり、わずかな上昇でも将来の信頼性にかかわる問題を示している可能性があります。温度の上昇は、機器内のプローブや、離れた場所から赤外線サーモグラフィによって確認することもできます。また、赤外線サーモグラフィのようなサーマル・イメージングでは、マシン・ビジョン・テクノロジーを用いることでプローブでは確認できない機器内の温度上昇も示すことができます。

      予知保全センサ

      振動も、潜在的な問題を明らかにする上で重要な要因の一つです。振動分析により、回転する機械の周波数の変化を示すことで、状態モニタ・ツールは劣化の進行を予測モデルに対してマッピングすることができます。

      STの産業用センサ

      予知保全によるコスト削減

      さまざまなデータをすべて組み合わせ、戦略的に予知保全を活用することで、適切な時期、方法において機械の修理をすることが可能となります。またこれにより、ライン停止につながる重大な障害を予防できます。時間に余裕を持った予備部品の発注や、計画的なダウンタイムへの準備を実現し、保全コストの削減に貢献します。例えば風力タービンの場合、遠隔状態モニタ・システムによって特定したコンポーネントを、電力への需要が低いときに取り替えることができます。

      予知保全ツールはインダストリアルIoT(IIoT)において欠かせないものとなりつつあります。リアルタイムの状態モニタとさまざまなタイプのデータ分析に基づく効果的な予知保全によって、機器修理におけるコストを削減します。

STの製品

状態モニタと予知保全は、Industry 4.0における付加価値アプリケーションです。そのため、STは先進的なICに加え、評価ツール、ソフトウェア、ドキュメント、および遠隔モニタ用オンライン・ダッシュボードのエコシステムを展開し、産業分野のニーズに応じて更新しています。

高価値かつコスト競争力のある産業用センサは、STの10年間長期供給保証プログラムの対象製品です。単純なパス / フェイル・モニタから、加速度センサや超音波アナログ・マイクからの周波数に基づく高精度データ分析までの振動センシングが可能です。また、温湿度センサや大気圧センサなどの環境センサも提供しています。

センサ・データの処理は、STのSTM32 マイクロコントローラおよびマイクロプロセッサ・シリーズによって行うことができます。また、ソフトウェア・ライブラリと組み合わせてディープラーニングを実装するための専用ツールチェーンにすることで、より高度な処理も可能です。STM32シリーズでは、超低消費電力マイコンをはじめ、浮動小数点ユニットを備えたArm® Cortex®-M4 / M7 ベースのデュアル・コア・マイコンまで、幅広い製品を提供しています。

状態モニタと予知保全においては、有線 / 無線問わず、通信機能がきわめて重要です。STは、RS485ベースの産業向けフィールドバスやIO-Link対応デバイス、および無線ネットワーク・テクノロジー向けのBluetooth-Low-Energy SoC、Sub-GHz SoC、トランシーバを提供し、先進的な予知保全用センサ・ノードや、新たなスマート・マニュファクチャリング・ソリューションのスムーズな試作開発をサポートします。

状態モニタから予知保全への移行は、スマート・センサ・ノードの設計、センサ・ノードやゲートウェイ内で動作する組込みソフトウェアの設定、クラウドまたは企業のエンタープライズ・リソース・プランニング(ERP)システムに統合するソフトウェアの開発、さらには異常の検出や装置寿命の正確な測定を可能にする機械学習アルゴリズムやAIアルゴリズムの実装など、高度でさまざまなスキルや能力が要求されます。

ブロック図

製品型番
概要
STEVAL-BFA001V1B Predictive maintenance kit with sensors and IO-Link capability クイック・ビュー

主な特徴

  • Compact solution for condition monitoring and predictive maintenance based on 3D digital accelerometer, environmental and acoustic MEMS sensors
  • Main supply voltage: 18 V - 32 V
  • Main components:
    • 32-bit ARM® Cortex® -M4 core for signal processing and analysis (STM32F469AI)
    • iNEMO 6DoF (ISM330DLC)
    • Absolute digital pressure sensor (LPS22HB)
    • Relative humidity and temperature sensors (HTS221)
    • Digital microphone sensors (MP34DT05-A)
    • IO-Link PHY device (L6362A)
    • EEPROM (M95M01-DF) for data storage
    • Step-down switching regulator and LDO regulator (L6984 and LDK220)
  • Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
    • Programmable FFT size (512, 1024, 2048)
    • Programmable FFT averaging
    • Programmable overlapping
    • Programmable windowing (Flat Top, Hanning, Hamming)
    • Speed RMS moving average, acceleration max. peak
    • Programmable threshold for warning and alarm conditions in spectral band
  • Microphone algorithms for:
    • PDM to PCM
    • Sound pressure
    • Audio FFT
  • IO-Link PHY using the L6362A Device transceiver for data communication with host unit
  • M12 industrial connector
  • SWD connector for debugging and programming capability
  • Reset button
  • Expansion connector with GPIO, ADC, I2C bus
  • Designed to meet IEC industrial standard requirements
  • WEEE compliant
  • RoHS compliant

続きを読む

STM32MP157C-DK2 Discovery kit with STM32MP157C MPU クイック・ビュー

主な特徴

  • Common features
    • STM32MP157 Arm® -based dual Cortex® -A7 32 bits + Cortex® -M4 32 bits MPU in TFBGA361 package
    • ST PMIC STPMIC1
    • 4-Gbit DDR3L, 16 bits, 533 MHz
    • 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
    • USB OTG HS
    • Audio codec
    • 4 user LEDs
    • 2 user and reset push-buttons, 1 wake-up button
    • 5 V / 3 A USB Type-CTM power supply input (not provided)
    • Board connectors:Ethernet RJ454 × USB Host Type-AUSB Type-CTM DRPMIPI DSISM HDMI® Stereo headset jack including analog microphone inputmicroSDTM cardGPIO expansion connector (Raspberry Pi® shields capability)ARDUINO® Uno V3 expansion connectors
    • On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
    • STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
    • Support of a wide choice of Integrated Development Environments (IDEs) including IARTM , Keil® , GCC-based IDEs
  • Board-specific features
    • 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
    • Wi-Fi® 802.11b/g/n
    • Bluetooth® Low Energy 4.1

続きを読む

STEVAL-STWINKT1 STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications クイック・ビュー

主な特徴

  • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
  • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
  • Micro SD Card slot for standalone data logging applications
  • Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
  • Option to implement Authentication and Brand protection secure solution with STSAFE-A100 (footprint)
  • Wide range of industrial IoT sensors:
    • ultra-wide bandwidth MEMS vibrometer up to 5 kHz (IIS3DWB)
    • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
    • ultra-low-power high performance MEMS motion sensor (IIS2DH)
    • ultra-low-power 3-axis magnetometer (IIS2MDC)
    • digital absolute pressure sensor (LPS22HH)
    • relative humidity and temperature sensor (HTS221)
    • low-voltage digital local temperature sensor (STTS751)
    • industrial grade digital MEMS microphone (IMP34DT05)
    • wideband analog MEMS microphone (MP23ABS1)
  • Modular architecture, expandable via on-board connectors:
    • STMOD+ and 40-pin flex general purpose expansions
    • 12-pin male plug for connectivity expansions
    • 12-pin female plug for sensing expansions
  • Other kit components:
    • Li-Po battery 480 mAh
    • STLINK-V3MINI debugger with programming cable
    • Plastic box

続きを読む

SL-PREDMNT-E2C Edge processing enabling Condition Monitoring and Predictive Maintenance: quick start for end to end architecture based on wired Smart Sensor Nodes and Gateway クイック・ビュー

主な特徴

  • Vibration monitoring data in the form of vibration speed (RMS), peak acceleration, and FFTs by STM32 core on vibration data from ST industrial sensors.
  • Temperature, humidity and pressure data from ST environmental sensors.
  • Condition monitoring example demonstrating Edge node processing of data from a 4-channel IO-Link master, in communication with a Cloud application via a secure gateway.
  • End-to-end communication framework allowing Condition Monitoring platform to develop into a Predictive Maintenance solution.
  • Further processing potential on Edge node with AWS Greengrass and Lambda functions.
  • Cloud Dashboard to register and provision the devices, configure a gateway for Edge processing, assign a gateway to a group of devices, analyze real time and historical data, and set thresholds to trigger alerts for particular equipment conditions.
  • Free usage terms for a limited number of sensors and gateways, and for a limited time, as part of the DSH-PREDMNT Cloud application user license agreement.
  • Based on STM32Cube and STM32OpenSTLinux expansion packages.
  • Serverless deployment of the Dashboard application in user account through Cloud Formation tool.

続きを読む

IMAGE

Image
Image
X-NUCLEO-IKS01A2 Motion MEMS and environmental sensor expansion board for STM32 Nucleo クイック・ビュー

主な特徴

  • LSM6DSL MEMS 3D accelerometer (±2/±4/±8/±16 g) and 3D gyroscope (±125/±245/±500/±1000/±2000 dps)
  • LSM303AGR MEMS 3D accelerometer (±2/±4/±8/±16 g) and MEMS3D magnetometer (±50 gauss)
  • LPS22HB MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
  • HTS221: capacitive digital relative humidity and temperature
  • DIL24 socket for additional MEMS adapters and other sensors
  • Free comprehensive development firmware library and example for all sensors compatible with STM32Cube firmware
  • I²C sensor hub features on LSM6DSL available
  • Compatible with STM32 Nucleo boards
  • Equipped with Arduino UNO R3 connector
  • RoHS compliant

続きを読む

STEVAL-IDP004V1 IO-Link master multi-port evaluation board based on L6360 クイック・ビュー

主な特徴

  • Main supply voltage 32 V maximum
  • 4 L6360 IO-Link master devices
  • RS-485 serial interface
  • CAN serial interface
  • USB interface
  • DC-DC converter
  • On-board reverse polarity protection
  • Designed to meet IEC requirement for industrial standards
  • RoHS and WEEE compliant

続きを読む

STEVAL-STWINWFV1 Wi-Fi expansion for the SensorTile Wireless Industrial Node (STWIN) kit クイック・ビュー

主な特徴

  • Wi-Fi adapter for STWIN (STEVAL-STWINKT1)
  • Plugs into STWIN core system board through dedicated 12-pin connector
  • Single 3.3 V power supply input
  • ISM43362-M3G-L44-E Wi-Fi module:
    • 802.11 b/g/n Compatible based on Broadcom MAC/Baseband/Radio device
    • Fully contained TCP/IP stack
    • Host interface: SPI up to 25 MHz
    • Network features ICMP ( Ping), ARP, DHCP,TCP, UDP
    • Low power operation (3.3 V supply) with built-in low power modes
    • Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK
    • CE certified
    • FCC certified
    • IC certified
  • RoHS and China RoHS compliant
  • WEEE compliant

続きを読む

製品型番
STEVAL-BFA001V1B

Predictive maintenance kit with sensors and IO-Link capability

主な特徴

  • Compact solution for condition monitoring and predictive maintenance based on 3D digital accelerometer, environmental and acoustic MEMS sensors
  • Main supply voltage: 18 V - 32 V
  • Main components:
    • 32-bit ARM® Cortex® -M4 core for signal processing and analysis (STM32F469AI)
    • iNEMO 6DoF (ISM330DLC)
    • Absolute digital pressure sensor (LPS22HB)
    • Relative humidity and temperature sensors (HTS221)
    • Digital microphone sensors (MP34DT05-A)
    • IO-Link PHY device (L6362A)
    • EEPROM (M95M01-DF) for data storage
    • Step-down switching regulator and LDO regulator (L6984 and LDK220)
  • Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
    • Programmable FFT size (512, 1024, 2048)
    • Programmable FFT averaging
    • Programmable overlapping
    • Programmable windowing (Flat Top, Hanning, Hamming)
    • Speed RMS moving average, acceleration max. peak
    • Programmable threshold for warning and alarm conditions in spectral band
  • Microphone algorithms for:
    • PDM to PCM
    • Sound pressure
    • Audio FFT
  • IO-Link PHY using the L6362A Device transceiver for data communication with host unit
  • M12 industrial connector
  • SWD connector for debugging and programming capability
  • Reset button
  • Expansion connector with GPIO, ADC, I2C bus
  • Designed to meet IEC industrial standard requirements
  • WEEE compliant
  • RoHS compliant

続きを読む

STM32MP157C-DK2

Discovery kit with STM32MP157C MPU

主な特徴

  • Common features
    • STM32MP157 Arm® -based dual Cortex® -A7 32 bits + Cortex® -M4 32 bits MPU in TFBGA361 package
    • ST PMIC STPMIC1
    • 4-Gbit DDR3L, 16 bits, 533 MHz
    • 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
    • USB OTG HS
    • Audio codec
    • 4 user LEDs
    • 2 user and reset push-buttons, 1 wake-up button
    • 5 V / 3 A USB Type-CTM power supply input (not provided)
    • Board connectors:Ethernet RJ454 × USB Host Type-AUSB Type-CTM DRPMIPI DSISM HDMI® Stereo headset jack including analog microphone inputmicroSDTM cardGPIO expansion connector (Raspberry Pi® shields capability)ARDUINO® Uno V3 expansion connectors
    • On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
    • STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
    • Support of a wide choice of Integrated Development Environments (IDEs) including IARTM , Keil® , GCC-based IDEs
  • Board-specific features
    • 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
    • Wi-Fi® 802.11b/g/n
    • Bluetooth® Low Energy 4.1

続きを読む

STEVAL-STWINKT1

STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

主な特徴

  • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
  • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
  • Micro SD Card slot for standalone data logging applications
  • Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
  • Option to implement Authentication and Brand protection secure solution with STSAFE-A100 (footprint)
  • Wide range of industrial IoT sensors:
    • ultra-wide bandwidth MEMS vibrometer up to 5 kHz (IIS3DWB)
    • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
    • ultra-low-power high performance MEMS motion sensor (IIS2DH)
    • ultra-low-power 3-axis magnetometer (IIS2MDC)
    • digital absolute pressure sensor (LPS22HH)
    • relative humidity and temperature sensor (HTS221)
    • low-voltage digital local temperature sensor (STTS751)
    • industrial grade digital MEMS microphone (IMP34DT05)
    • wideband analog MEMS microphone (MP23ABS1)
  • Modular architecture, expandable via on-board connectors:
    • STMOD+ and 40-pin flex general purpose expansions
    • 12-pin male plug for connectivity expansions
    • 12-pin female plug for sensing expansions
  • Other kit components:
    • Li-Po battery 480 mAh
    • STLINK-V3MINI debugger with programming cable
    • Plastic box

続きを読む

SL-PREDMNT-E2C

Edge processing enabling Condition Monitoring and Predictive Maintenance: quick start for end to end architecture based on wired Smart Sensor Nodes and Gateway

主な特徴

  • Vibration monitoring data in the form of vibration speed (RMS), peak acceleration, and FFTs by STM32 core on vibration data from ST industrial sensors.
  • Temperature, humidity and pressure data from ST environmental sensors.
  • Condition monitoring example demonstrating Edge node processing of data from a 4-channel IO-Link master, in communication with a Cloud application via a secure gateway.
  • End-to-end communication framework allowing Condition Monitoring platform to develop into a Predictive Maintenance solution.
  • Further processing potential on Edge node with AWS Greengrass and Lambda functions.
  • Cloud Dashboard to register and provision the devices, configure a gateway for Edge processing, assign a gateway to a group of devices, analyze real time and historical data, and set thresholds to trigger alerts for particular equipment conditions.
  • Free usage terms for a limited number of sensors and gateways, and for a limited time, as part of the DSH-PREDMNT Cloud application user license agreement.
  • Based on STM32Cube and STM32OpenSTLinux expansion packages.
  • Serverless deployment of the Dashboard application in user account through Cloud Formation tool.

続きを読む

IMAGE

Image
Image
X-NUCLEO-IKS01A2

Motion MEMS and environmental sensor expansion board for STM32 Nucleo

主な特徴

  • LSM6DSL MEMS 3D accelerometer (±2/±4/±8/±16 g) and 3D gyroscope (±125/±245/±500/±1000/±2000 dps)
  • LSM303AGR MEMS 3D accelerometer (±2/±4/±8/±16 g) and MEMS3D magnetometer (±50 gauss)
  • LPS22HB MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
  • HTS221: capacitive digital relative humidity and temperature
  • DIL24 socket for additional MEMS adapters and other sensors
  • Free comprehensive development firmware library and example for all sensors compatible with STM32Cube firmware
  • I²C sensor hub features on LSM6DSL available
  • Compatible with STM32 Nucleo boards
  • Equipped with Arduino UNO R3 connector
  • RoHS compliant

続きを読む

STEVAL-IDP004V1

IO-Link master multi-port evaluation board based on L6360

主な特徴

  • Main supply voltage 32 V maximum
  • 4 L6360 IO-Link master devices
  • RS-485 serial interface
  • CAN serial interface
  • USB interface
  • DC-DC converter
  • On-board reverse polarity protection
  • Designed to meet IEC requirement for industrial standards
  • RoHS and WEEE compliant

続きを読む

STEVAL-STWINWFV1

Wi-Fi expansion for the SensorTile Wireless Industrial Node (STWIN) kit

主な特徴

  • Wi-Fi adapter for STWIN (STEVAL-STWINKT1)
  • Plugs into STWIN core system board through dedicated 12-pin connector
  • Single 3.3 V power supply input
  • ISM43362-M3G-L44-E Wi-Fi module:
    • 802.11 b/g/n Compatible based on Broadcom MAC/Baseband/Radio device
    • Fully contained TCP/IP stack
    • Host interface: SPI up to 25 MHz
    • Network features ICMP ( Ping), ARP, DHCP,TCP, UDP
    • Low power operation (3.3 V supply) with built-in low power modes
    • Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK
    • CE certified
    • FCC certified
    • IC certified
  • RoHS and China RoHS compliant
  • WEEE compliant

続きを読む

00 ファイルがダウンロード用に選択されています

技術文書

    • 概要 Version Size Action
      AN5146
      IIS3DHHC: high-resolution, high-stability 3-axis digital accelerometer
      2.0
      411.03 KB
      PDF
      AN5041
      IO-Link solution based on STEVAL-IDP004V2 master evaluation board and STEVAL-IDP003V1 kit
      4.0
      1.34 MB
      PDF
      AN5063
      LPS33HW digital pressure sensor: guidelines for system integration
      1.0
      681.3 KB
      PDF
      AN4113
      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32F05x USART
      1.3
      142.25 KB
      PDF
      AN3070
      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32™’s USART
      1.4
      188.96 KB
      PDF
      AN5146

      IIS3DHHC: high-resolution, high-stability 3-axis digital accelerometer

      AN5041

      IO-Link solution based on STEVAL-IDP004V2 master evaluation board and STEVAL-IDP003V1 kit

      AN5063

      LPS33HW digital pressure sensor: guidelines for system integration

      AN4113

      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32F05x USART

      AN3070

      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32™’s USART

    • 概要 Version Size Action
      DT0064
      Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance
      1.0
      616.94 KB
      PDF
      DT0064

      Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance

プレゼンテーション & トレーニング資料

    • 概要 Version Size Action
      FP-CLD-AZURE1 quick start guide 3.3
      4.84 MB
      PDF
      IoT: Cloud Connectivity Expansion Packages for STM32Cube 1.0
      895.03 KB
      PDF
      LPWAN Technologies For IoT Francesco Doddo 1.0
      7.55 MB
      PDF
      STEVAL-BFA001V1B GETTING STARTED GUIDE 1.1
      3.41 MB
      PDF

      FP-CLD-AZURE1 quick start guide

      IoT: Cloud Connectivity Expansion Packages for STM32Cube

      LPWAN Technologies For IoT Francesco Doddo

      STEVAL-BFA001V1B GETTING STARTED GUIDE

関連資料

    • 概要 Version Size Action
      L6360 & L6362A - Industry 4.0をサポート 07.2018
      272.77 KB
      PDF
      MEMS sensors for smart industry 4.0 2.1
      874.15 KB
      PDF
      S2-LP:Ultra-low-power, high-performance, sub-1GHz RF transceiver 1.2
      664.12 KB
      PDF
      STSAFE-TPM Standardized solution for trusted devices 1.0
      226.91 KB
      PDF

      L6360 & L6362A - Industry 4.0をサポート

      MEMS sensors for smart industry 4.0

      S2-LP:Ultra-low-power, high-performance, sub-1GHz RF transceiver

      STSAFE-TPM Standardized solution for trusted devices

    • 概要 Version Size Action
      Amplifiers & Comparators Brochures Broaden Your Horizons 1.0
      2.55 MB
      PDF
      Brochure Secure MCUs - Secure Solutions 1.1
      1.26 MB
      PDF
      IO-Link向け ソリューション 08.2017
      1.12 MB
      PDF
      スマート・インダストリ向け 製品 & ソリューション ガイド 3.1
      3.41 MB
      PDF
      STM32L series - Ultra-low-power 32-bit MCUs 17.5
      1.66 MB
      PDF

      Amplifiers & Comparators Brochures Broaden Your Horizons

      Brochure Secure MCUs - Secure Solutions

      IO-Link向け ソリューション

      スマート・インダストリ向け 製品 & ソリューション ガイド

      STM32L series - Ultra-low-power 32-bit MCUs

    • 概要 Version Size Action
      Capacitive MEMS accelerometer for condition monitoring 1.0
      3.35 MB
      PDF

      Capacitive MEMS accelerometer for condition monitoring

ソフトウェア製品

    • 製品型番

      Cloud based web application for condition monitoring and predictive maintenance

      Predictive maintenance evaluation kit firmware

      Firmware for STEVAL-STWINKT1 evaluation kit for predictive maintenance, smart industry, IoT and remote monitoring applications

    • 製品型番

      STM32Cube function pack for multi sensors node with signal processing to enable predictive maintenance

      STM32 MPU OpenSTLinux Expansion Pack for Predictive Maintenance applications

eDesignSuite

コンバータ

Input

V This option is required. And must be less than or equal to Volt. Max [V]
V This option is required. And must be greater than or equal to Volt. Min [V]

Output Power

V This option is required and must be a number.
A This option is required and must be a number.

Audio ICs

製品型番 概要
MP23ABS1 High performance MEMS audio sensor single ended analog bottom-port microphone
MP34DT05-A MEMS audio sensor omnidirectional digital microphone, 64 dB SNR, -26 dBFS sensitivity, top-port, 122.5 dBSPL AOP
MP34DT06J MEMS audio sensor omnidirectional stereo digital microphone
製品型番
High performance MEMS audio sensor single ended analog bottom-port microphone
MEMS audio sensor omnidirectional digital microphone, 64 dB SNR, -26 dBFS sensitivity, top-port, 122.5 dBSPL AOP
MEMS audio sensor omnidirectional stereo digital microphone

Interfaces and Transceivers

製品型番 概要
SERC816 SERCOS Interface controller
ST1480AB 3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [-40oC, 85oC] TEMPERATURE RANGE
ST1480AC 3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [0oC, 70oC] TEMPERATURE RANGE
ST26C31B CMOS QUAD TRI-STATE DIFFERENTIAL LINE DRIVER
ST26C32AB CMOS QUAD 3-STATE DIFFERENTIAL LINE RECEIVER
ST3485EB 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST3485EC 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
ST3485EI 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 125oC] temperature range
ST3485EIY 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, automotive grade
ST4485EB 3.3 V powered, 15 kV ESD protected, up to 20 Mbps RS-485/RS-422 transceiver, [-40oC, 105oC] temperature range
ST485AB very high speed low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485B low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485C low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
ST485EB 15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485EC 15 kV ESD protected, low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
ST485ERB 15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485EX 15 kV ESD protected, low power RS-485/RS-422 transceiver, [-55oC, 125oC] temperature range
ST490AB Low power full duplex high speed RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
STR485 3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps
STR485E 3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps
製品型番
SERCOS Interface controller
3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [-40oC, 85oC] TEMPERATURE RANGE
3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [0oC, 70oC] TEMPERATURE RANGE
CMOS QUAD TRI-STATE DIFFERENTIAL LINE DRIVER
CMOS QUAD 3-STATE DIFFERENTIAL LINE RECEIVER
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 125oC] temperature range
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, automotive grade
3.3 V powered, 15 kV ESD protected, up to 20 Mbps RS-485/RS-422 transceiver, [-40oC, 105oC] temperature range
very high speed low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [-55oC, 125oC] temperature range
Low power full duplex high speed RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps
3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps

MEMS and Sensors

製品型番 概要
IIS2DH 3-axis digital accelerometer, ultra low-power high performance MEMS motion sensor
IIS2DLPC MEMS digital output motion sensor: high-performance ultra-low-power 3-axis accelerometer for industrial applications
IIS2MDC High accuracy, ultra-low-power ,3-axis digital output magnetometer
IIS328DQ 3-axis accelerometer for industrial applications, SPI/I2C digital output, ultra low-power high performance
IIS3DHHC High-resolution, high-stability 3-axis digital inclinometer for industrial applications
IMP34DT05 MEMS audio sensor omnidirectional digital microphone for industrial applications
ISM303DAC High Performance,Low Power, compact 3D accelerometer and 3D Magnetometer module
ISM330DHCX iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications
ISM330DLC iNEMO inertial measurement unit (IMU): 3D accelerometer and 3D gyroscope with digital output for industrial applications
LPS22HB Ultra-compact piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, full-mold, holed LGA package (HLGA)
LPS22HD Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, small and thin package
LPS22HH MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
LPS25HB Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, I2C, SPI
LPS27HHW MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water resistant package
LPS33HW Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, water resistant package
LPS33W MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with potted gel package
LPS35HW Waterproof piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer
STTS22H Low-voltage, ultra-low-power, 0.5 °C accuracy I2C/SMBus 3.0 temperature sensor
製品型番
3-axis digital accelerometer, ultra low-power high performance MEMS motion sensor
MEMS digital output motion sensor: high-performance ultra-low-power 3-axis accelerometer for industrial applications
High accuracy, ultra-low-power ,3-axis digital output magnetometer
3-axis accelerometer for industrial applications, SPI/I2C digital output, ultra low-power high performance
High-resolution, high-stability 3-axis digital inclinometer for industrial applications
MEMS audio sensor omnidirectional digital microphone for industrial applications
High Performance,Low Power, compact 3D accelerometer and 3D Magnetometer module
iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications
iNEMO inertial measurement unit (IMU): 3D accelerometer and 3D gyroscope with digital output for industrial applications
Ultra-compact piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, full-mold, holed LGA package (HLGA)
Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, small and thin package
MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, I2C, SPI
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water resistant package
Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, water resistant package
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with potted gel package
Waterproof piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer
Low-voltage, ultra-low-power, 0.5 °C accuracy I2C/SMBus 3.0 temperature sensor

Microcontrollers & Microprocessors

製品型番 概要
STM32F469AI High-performance advanced line, ARM Cortex-M4 core with DSP and FPU, 2 Mbytes Flash, 180 MHz CPU, ART Accelerator, Chrom-ART Accelerator, FMC with SDRAM, Dual QSPI, TFT, MIPI-DSI
STM32L476RG Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, LCD, USB OTG, DFSDM
STM32L4A6QG Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, USB OTG, LCD, AES-256, DFSDM
STM32L4R9ZI Ultra-low-power with FPU ARM Cortex-M4 MCU 120 MHz with 2048 kbytes Flash, USB OTG, DFSDM, LCD-TFT, MIPI DSI
STM32MP157C MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography
STM32WB50CG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1Mbyte Flash memory, 128KB RAM, Bluetooth 5, 802.15.4, +4dBm output power, 100dB link budget
STM32WB55CC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55CE Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55CG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55RC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256 Kbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55RE Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55RG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55VC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55VE Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55VG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
製品型番
High-performance advanced line, ARM Cortex-M4 core with DSP and FPU, 2 Mbytes Flash, 180 MHz CPU, ART Accelerator, Chrom-ART Accelerator, FMC with SDRAM, Dual QSPI, TFT, MIPI-DSI
Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, LCD, USB OTG, DFSDM
Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, USB OTG, LCD, AES-256, DFSDM
Ultra-low-power with FPU ARM Cortex-M4 MCU 120 MHz with 2048 kbytes Flash, USB OTG, DFSDM, LCD-TFT, MIPI DSI
MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1Mbyte Flash memory, 128KB RAM, Bluetooth 5, 802.15.4, +4dBm output power, 100dB link budget
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256 Kbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256

パワー・マネージメント

製品型番 概要
L6360 IO-Link communication master transceiver IC
L6362A IO-Link communication transceiver device IC
製品型番
IO-Link communication master transceiver IC
IO-Link communication transceiver device IC

Secure MCUs

製品型番 概要
Kerkey Security Module for Smart Metering system
ST33TPHF20I2C Trusted Platform Module 2.0 with I2C interface
ST33TPHF20SPI Trusted Platform Module 2.0 with TCG SPI interface
ST33TPHF2EI2C Trusted Platform Module 1.2 & 2.0 with TCG I2C interface
ST33TPHF2ESPI Trusted Platform Module 1.2 & 2.0 with TCG SPI interface
ST33TPM12I2C Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300 CPU
ST33TPM12LPC Trusted Platform Module with LPC interface based on 32-bit ARM® SecurCore® SC300 CPU
ST33TPM12SPI Trusted Platform Module with SPI interface based on 32-bit ARM® SecurCore® SC300 CPU
STSAFE-A100 Authentication & Brand protection secure solution
STSAFE-A1SX Secure Element for Sigfox LPWAN network
STSAFE-J100 Flexible programmable secure solution for Gateway
STSAFE-J100-BS Security Module of a Smart Meter gateway as defined by BSI
製品型番
Security Module for Smart Metering system
Trusted Platform Module 2.0 with I2C interface
Trusted Platform Module 2.0 with TCG SPI interface
Trusted Platform Module 1.2 & 2.0 with TCG I2C interface
Trusted Platform Module 1.2 & 2.0 with TCG SPI interface
Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300 CPU
Trusted Platform Module with LPC interface based on 32-bit ARM® SecurCore® SC300 CPU
Trusted Platform Module with SPI interface based on 32-bit ARM® SecurCore® SC300 CPU
Authentication & Brand protection secure solution
Secure Element for Sigfox LPWAN network
Flexible programmable secure solution for Gateway
Security Module of a Smart Meter gateway as defined by BSI

ワイヤレス・トランシーバ / マイコン / モジュール

製品型番 概要
BlueNRG-M2 Very low power application processor module for Bluetooth® low energy v5.0
S2-LP Ultra-low power, high performance, sub-1GHz transceiver
製品型番
Very low power application processor module for Bluetooth® low energy v5.0
Ultra-low power, high performance, sub-1GHz transceiver
サポート &フィードバック