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Condition Monitoring and Predictive Maintenance at a glance

predictive maintenance industrial

Condition Monitoring (CM) is the monitoring of various parameters such as vibration or temperature to identify potential failures. This method aims at highlighting problems, allowing Preventive Maintenance to be scheduled before any damage occurs.

Continuous condition monitoring techniques are normally used on equipment such as compressors, pumps, and motors. Data collection in Industry 4.0 is an essential part of the monitoring process and helps ensure factory floor machines run smoothly.

Predictive Maintenance (PdM) is based on Condition Monitoring, abnormality detection and classification algorithms, and integrates predictive models which can identify the remaining machine runtime left, according to detected abnormalities. This approach uses a wide range of tools, such as statistical analysis and Machine Learning to monitor the state of the equipment.

    • Preventive Maintenance is essentially planned, scheduled maintenance and is based on the expected condition of the equipment, determined by condition monitoring techniques and statistical process control. However, this can lead to unnecessary maintenance and so-called reactive maintenance. Further to a failure diagnosis, repairs are completed after a piece of equipment has failed.

      The difference between Preventive and Predictive Maintenance is that Predictive Maintenance systems use smart condition monitoring sensors as data loggers to collect and pre-process data within the equipment to identify patterns of wear and provide a more accurate approach in order to predict failure. Predictive models include statistical monitoring but can also use Neural Networks, running Machine Learning algorithms to identify patterns in the data. Predictive Maintenance monitors the system’s health to allow Preventive Maintenance to be scheduled.

      predictive maintenance advantages vs preventive maintenance
      Predictive vs Preventive maintenance

      Smart condition monitoring sensors are key elements of the predictive analysis. They collect, log, pre-process and securely communicate data to later be used in visualization tools and other processing algorithms. For example, a sudden increase in temperature indicates a probable device issue, and a small rise can be an indicator of future reliability problems.

      predictive maintenance sensors

      Vibration monitoring can reveal potential problems such as misalignments or a failure of the bearings. When the vibration analysis shows a change in the harmonic frequency of rotating equipment, the condition monitoring tools can map the equipment degradation against a predictive model.

      Predictive Maintenance strategy for cost-savings

      Predictive Maintenance tools are now becoming an integral part of the so-called Industrial Internet of Things (IIoT). Using a Predictive Maintenance strategy to analyse data helps avoid unscheduled failures that stop production lines, as a machine can be taken off-line in a managed and organized way to be repaired. By allowing spare parts to be ordered and delivered in a timely manner, predictive maintenance helps reduce maintenance costs. For example, some wind turbine components identified by the remote condition monitoring system can be replaced when demand for electricity is low. An effective Predictive Maintenance strategy based on real-time Condition Monitoring techniques with different types of data analysis provides more cost-effective repair strategies.

      Moving from Condition Monitoring to Predictive Maintenance is challenging and requires different skillsets and competencies: from designing the smart sensor node and configuring embedded software running in the sensor node and gateway, to developing software to be integrated in the Cloud or company Enterprise Resource Planning (ERP) system, Machine Learning and Artificial Intelligence algorithms can be implemented to ensure any technical abnormality is detected and equipment lifetime is accurately measured.

      Condition Monitoring and Predictive Maintenance are value-added and challenging applications in Industry 4.0. ST has therefore deployed advanced ICs and an ecosystem of evaluation tools, software, documentation and online dashboards for remote monitoring, which are continuously being updated to match industrial needs.

ST's portfolio for Condition Monitoring and Predictive Maintenance

ST offers high-performance, cost-competitive sensors with a 10-year supply guarantee (longevity program), including accelerometers and ultra-sound analog microphones to enable vibration analysis from simple Pass/Fail monitoring to high-accuracy, frequency-based data analysis, as well as a range of environmental sensors for temperature, humidity and pressure sensing.

Our ultra-low-power STM32 Arm® Cortex® M4 microcontrollers and STM32 Arm® Cortex®-A7® microprocessor series with floating points capabilities can process sensor data at the edge, making them a dedicated toolchain to implement a deep learning approach.

ST also provides a range of wired solutions, including IO-Link-compatible devices for industrial wired connectivity, and a portfolio of wireless technology such as Bluetooth-Low-Energy network processors and transceivers, as well as Sub-1GHz transceivers.

We are aware that Predictive Maintenance is a key challenge for the industry and that the necessary skills to implement these techniques may not be easy to find or acquire. We have therefore brought together an ecosystem of Partners to support our customers in the tailored design and implementation of their solution. To find out more, visit our Partner page and our Tools and Software session.

Block diagram

Part Number
Description
STEVAL-BFA001V1B Predictive maintenance kit with sensors and IO-Link capability Quick view

Key Features

  • Compact solution for condition monitoring and predictive maintenance based on 3D digital accelerometer, environmental and acoustic MEMS sensors
  • Main supply voltage: 18 V - 32 V
  • Main components:
    • 32-bit ARM® Cortex® -M4 core for signal processing and analysis (STM32F469AI)
    • iNEMO 6DoF (ISM330DLC)
    • Absolute digital pressure sensor (LPS22HB)
    • Relative humidity and temperature sensors (HTS221)
    • Digital microphone sensors (MP34DT05-A)
    • IO-Link PHY device (L6362A)
    • EEPROM (M95M01-DF) for data storage
    • Step-down switching regulator and LDO regulator (L6984 and LDK220)
  • Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
    • Programmable FFT size (512, 1024, 2048)
    • Programmable FFT averaging
    • Programmable overlapping
    • Programmable windowing (Flat Top, Hanning, Hamming)
    • Speed RMS moving average, acceleration max. peak
    • Programmable threshold for warning and alarm conditions in spectral band
  • Microphone algorithms for:
    • PDM to PCM
    • Sound pressure
    • Audio FFT
  • IO-Link PHY using the L6362A Device transceiver for data communication with host unit
  • M12 industrial connector
  • SWD connector for debugging and programming capability
  • Reset button
  • Expansion connector with GPIO, ADC, I2C bus
  • Designed to meet IEC industrial standard requirements
  • WEEE compliant
  • RoHS compliant

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Schematics BOM Gerber
STM32MP157C-DK2 Discovery kit with STM32MP157C MPU Quick view

Key Features

  • Common features
    • STM32MP157 Arm® -based dual Cortex® -A7 32 bits + Cortex® -M4 32 bits MPU in TFBGA361 package
    • ST PMIC STPMIC1
    • 4-Gbit DDR3L, 16 bits, 533 MHz
    • 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
    • USB OTG HS
    • Audio codec
    • 4 user LEDs
    • 2 user and reset push-buttons, 1 wake-up button
    • 5 V / 3 A USB Type-CTM power supply input (not provided)
    • Board connectors:Ethernet RJ454 × USB Host Type-AUSB Type-CTM DRPMIPI DSISM HDMI® Stereo headset jack including analog microphone inputmicroSDTM cardGPIO expansion connector (Raspberry Pi® shields capability)ARDUINO® Uno V3 expansion connectors
    • On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
    • STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
    • Support of a wide choice of Integrated Development Environments (IDEs) including IARTM , Keil® , GCC-based IDEs
  • Board-specific features
    • 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
    • Wi-Fi® 802.11b/g/n
    • Bluetooth® Low Energy 4.1

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Schematics BOM Gerber
STEVAL-STWINKT1 STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications Quick view

Key Features

  • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
  • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
  • Micro SD Card slot for standalone data logging applications
  • Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
  • Option to implement Authentication and Brand protection secure solution with STSAFE-A100 (footprint)
  • Wide range of industrial IoT sensors:
    • ultra-wide bandwidth MEMS vibrometer up to 5 kHz (IIS3DWB)
    • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
    • ultra-low-power high performance MEMS motion sensor (IIS2DH)
    • ultra-low-power 3-axis magnetometer (IIS2MDC)
    • digital absolute pressure sensor (LPS22HH)
    • relative humidity and temperature sensor (HTS221)
    • low-voltage digital local temperature sensor (STTS751)
    • industrial grade digital MEMS microphone (IMP34DT05)
    • wideband analog MEMS microphone (MP23ABS1)
  • Modular architecture, expandable via on-board connectors:
    • STMOD+ and 40-pin flex general purpose expansions
    • 12-pin male plug for connectivity expansions
    • 12-pin female plug for sensing expansions
  • Other kit components:
    • Li-Po battery 480 mAh
    • STLINK-V3MINI debugger with programming cable
    • Plastic box

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Schematics BOM Gerber
SL-PREDMNT-E2C Edge processing enabling Condition Monitoring and Predictive Maintenance: quick start for end to end architecture based on wired Smart Sensor Nodes and Gateway Quick view

Key Features

  • Vibration monitoring data in the form of vibration speed (RMS), peak acceleration, and FFTs by STM32 core on vibration data from ST industrial sensors.
  • Temperature, humidity and pressure data from ST environmental sensors.
  • Condition monitoring example demonstrating Edge node processing of data from a 4-channel IO-Link master, in communication with a Cloud application via a secure gateway.
  • End-to-end communication framework allowing Condition Monitoring platform to develop into a Predictive Maintenance solution.
  • Further processing potential on Edge node with AWS Greengrass and Lambda functions.
  • Cloud Dashboard to register and provision the devices, configure a gateway for Edge processing, assign a gateway to a group of devices, analyze real time and historical data, and set thresholds to trigger alerts for particular equipment conditions.
  • Free usage terms for a limited number of sensors and gateways, and for a limited time, as part of the DSH-PREDMNT Cloud application user license agreement.
  • Based on STM32Cube and STM32OpenSTLinux expansion packages.
  • Serverless deployment of the Dashboard application in user account through Cloud Formation tool.

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X-NUCLEO-IKS01A2 Motion MEMS and environmental sensor expansion board for STM32 Nucleo Quick view

Key Features

  • LSM6DSL MEMS 3D accelerometer (±2/±4/±8/±16 g) and 3D gyroscope (±125/±245/±500/±1000/±2000 dps)
  • LSM303AGR MEMS 3D accelerometer (±2/±4/±8/±16 g) and MEMS3D magnetometer (±50 gauss)
  • LPS22HB MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
  • HTS221: capacitive digital relative humidity and temperature
  • DIL24 socket for additional MEMS adapters and other sensors
  • Free comprehensive development firmware library and example for all sensors compatible with STM32Cube firmware
  • I²C sensor hub features on LSM6DSL available
  • Compatible with STM32 Nucleo boards
  • Equipped with Arduino UNO R3 connector
  • RoHS compliant

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Schematics BOM Gerber
STEVAL-IDP004V1 IO-Link master multi-port evaluation board based on L6360 Quick view

Key Features

  • Main supply voltage 32 V maximum
  • 4 L6360 IO-Link master devices
  • RS-485 serial interface
  • CAN serial interface
  • USB interface
  • DC-DC converter
  • On-board reverse polarity protection
  • Designed to meet IEC requirement for industrial standards
  • RoHS and WEEE compliant

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Schematics BOM Gerber
STEVAL-STWINWFV1 Wi-Fi expansion for the SensorTile Wireless Industrial Node (STWIN) kit Quick view

Key Features

  • Wi-Fi adapter for STWIN (STEVAL-STWINKT1)
  • Plugs into STWIN core system board through dedicated 12-pin connector
  • Single 3.3 V power supply input
  • ISM43362-M3G-L44-E Wi-Fi module:
    • 802.11 b/g/n Compatible based on Broadcom MAC/Baseband/Radio device
    • Fully contained TCP/IP stack
    • Host interface: SPI up to 25 MHz
    • Network features ICMP ( Ping), ARP, DHCP,TCP, UDP
    • Low power operation (3.3 V supply) with built-in low power modes
    • Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK
    • CE certified
    • FCC certified
    • IC certified
  • RoHS and China RoHS compliant
  • WEEE compliant

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Schematics BOM Gerber
Part Number
STEVAL-BFA001V1B

Predictive maintenance kit with sensors and IO-Link capability

Key Features

  • Compact solution for condition monitoring and predictive maintenance based on 3D digital accelerometer, environmental and acoustic MEMS sensors
  • Main supply voltage: 18 V - 32 V
  • Main components:
    • 32-bit ARM® Cortex® -M4 core for signal processing and analysis (STM32F469AI)
    • iNEMO 6DoF (ISM330DLC)
    • Absolute digital pressure sensor (LPS22HB)
    • Relative humidity and temperature sensors (HTS221)
    • Digital microphone sensors (MP34DT05-A)
    • IO-Link PHY device (L6362A)
    • EEPROM (M95M01-DF) for data storage
    • Step-down switching regulator and LDO regulator (L6984 and LDK220)
  • Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
    • Programmable FFT size (512, 1024, 2048)
    • Programmable FFT averaging
    • Programmable overlapping
    • Programmable windowing (Flat Top, Hanning, Hamming)
    • Speed RMS moving average, acceleration max. peak
    • Programmable threshold for warning and alarm conditions in spectral band
  • Microphone algorithms for:
    • PDM to PCM
    • Sound pressure
    • Audio FFT
  • IO-Link PHY using the L6362A Device transceiver for data communication with host unit
  • M12 industrial connector
  • SWD connector for debugging and programming capability
  • Reset button
  • Expansion connector with GPIO, ADC, I2C bus
  • Designed to meet IEC industrial standard requirements
  • WEEE compliant
  • RoHS compliant

Show More

IMAGE

Image
Image

FEATURED RESOURCES

Schematics BOM Gerber
STM32MP157C-DK2

Discovery kit with STM32MP157C MPU

Key Features

  • Common features
    • STM32MP157 Arm® -based dual Cortex® -A7 32 bits + Cortex® -M4 32 bits MPU in TFBGA361 package
    • ST PMIC STPMIC1
    • 4-Gbit DDR3L, 16 bits, 533 MHz
    • 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
    • USB OTG HS
    • Audio codec
    • 4 user LEDs
    • 2 user and reset push-buttons, 1 wake-up button
    • 5 V / 3 A USB Type-CTM power supply input (not provided)
    • Board connectors:Ethernet RJ454 × USB Host Type-AUSB Type-CTM DRPMIPI DSISM HDMI® Stereo headset jack including analog microphone inputmicroSDTM cardGPIO expansion connector (Raspberry Pi® shields capability)ARDUINO® Uno V3 expansion connectors
    • On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
    • STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
    • Support of a wide choice of Integrated Development Environments (IDEs) including IARTM , Keil® , GCC-based IDEs
  • Board-specific features
    • 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
    • Wi-Fi® 802.11b/g/n
    • Bluetooth® Low Energy 4.1

Show More

IMAGE

Image
Image

FEATURED RESOURCES

Schematics BOM Gerber
STEVAL-STWINKT1

STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

Key Features

  • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
  • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
  • Micro SD Card slot for standalone data logging applications
  • Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
  • Option to implement Authentication and Brand protection secure solution with STSAFE-A100 (footprint)
  • Wide range of industrial IoT sensors:
    • ultra-wide bandwidth MEMS vibrometer up to 5 kHz (IIS3DWB)
    • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
    • ultra-low-power high performance MEMS motion sensor (IIS2DH)
    • ultra-low-power 3-axis magnetometer (IIS2MDC)
    • digital absolute pressure sensor (LPS22HH)
    • relative humidity and temperature sensor (HTS221)
    • low-voltage digital local temperature sensor (STTS751)
    • industrial grade digital MEMS microphone (IMP34DT05)
    • wideband analog MEMS microphone (MP23ABS1)
  • Modular architecture, expandable via on-board connectors:
    • STMOD+ and 40-pin flex general purpose expansions
    • 12-pin male plug for connectivity expansions
    • 12-pin female plug for sensing expansions
  • Other kit components:
    • Li-Po battery 480 mAh
    • STLINK-V3MINI debugger with programming cable
    • Plastic box

Show More

IMAGE

Image
Image

FEATURED RESOURCES

Schematics BOM Gerber
SL-PREDMNT-E2C

Edge processing enabling Condition Monitoring and Predictive Maintenance: quick start for end to end architecture based on wired Smart Sensor Nodes and Gateway

Key Features

  • Vibration monitoring data in the form of vibration speed (RMS), peak acceleration, and FFTs by STM32 core on vibration data from ST industrial sensors.
  • Temperature, humidity and pressure data from ST environmental sensors.
  • Condition monitoring example demonstrating Edge node processing of data from a 4-channel IO-Link master, in communication with a Cloud application via a secure gateway.
  • End-to-end communication framework allowing Condition Monitoring platform to develop into a Predictive Maintenance solution.
  • Further processing potential on Edge node with AWS Greengrass and Lambda functions.
  • Cloud Dashboard to register and provision the devices, configure a gateway for Edge processing, assign a gateway to a group of devices, analyze real time and historical data, and set thresholds to trigger alerts for particular equipment conditions.
  • Free usage terms for a limited number of sensors and gateways, and for a limited time, as part of the DSH-PREDMNT Cloud application user license agreement.
  • Based on STM32Cube and STM32OpenSTLinux expansion packages.
  • Serverless deployment of the Dashboard application in user account through Cloud Formation tool.

Show More

IMAGE

Image
Image
X-NUCLEO-IKS01A2

Motion MEMS and environmental sensor expansion board for STM32 Nucleo

Key Features

  • LSM6DSL MEMS 3D accelerometer (±2/±4/±8/±16 g) and 3D gyroscope (±125/±245/±500/±1000/±2000 dps)
  • LSM303AGR MEMS 3D accelerometer (±2/±4/±8/±16 g) and MEMS3D magnetometer (±50 gauss)
  • LPS22HB MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
  • HTS221: capacitive digital relative humidity and temperature
  • DIL24 socket for additional MEMS adapters and other sensors
  • Free comprehensive development firmware library and example for all sensors compatible with STM32Cube firmware
  • I²C sensor hub features on LSM6DSL available
  • Compatible with STM32 Nucleo boards
  • Equipped with Arduino UNO R3 connector
  • RoHS compliant

Show More

IMAGE

Image
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FEATURED RESOURCES

Schematics BOM Gerber
STEVAL-IDP004V1

IO-Link master multi-port evaluation board based on L6360

Key Features

  • Main supply voltage 32 V maximum
  • 4 L6360 IO-Link master devices
  • RS-485 serial interface
  • CAN serial interface
  • USB interface
  • DC-DC converter
  • On-board reverse polarity protection
  • Designed to meet IEC requirement for industrial standards
  • RoHS and WEEE compliant

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FEATURED RESOURCES

Schematics BOM Gerber
STEVAL-STWINWFV1

Wi-Fi expansion for the SensorTile Wireless Industrial Node (STWIN) kit

Key Features

  • Wi-Fi adapter for STWIN (STEVAL-STWINKT1)
  • Plugs into STWIN core system board through dedicated 12-pin connector
  • Single 3.3 V power supply input
  • ISM43362-M3G-L44-E Wi-Fi module:
    • 802.11 b/g/n Compatible based on Broadcom MAC/Baseband/Radio device
    • Fully contained TCP/IP stack
    • Host interface: SPI up to 25 MHz
    • Network features ICMP ( Ping), ARP, DHCP,TCP, UDP
    • Low power operation (3.3 V supply) with built-in low power modes
    • Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK
    • CE certified
    • FCC certified
    • IC certified
  • RoHS and China RoHS compliant
  • WEEE compliant

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Schematics BOM Gerber
00 Files selected for download

Technical Documentation

    • Description Version Size Action
      AN5146
      IIS3DHHC: high-resolution, high-stability 3-axis digital accelerometer
      2.0
      411.03 KB
      PDF
      AN5041
      IO-Link solution based on STEVAL-IDP004V2 master evaluation board and STEVAL-IDP003V1 kit
      4.0
      1.34 MB
      PDF
      AN5063
      LPS33HW digital pressure sensor: guidelines for system integration
      1.0
      681.3 KB
      PDF
      AN4113
      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32F05x USART
      1.3
      142.25 KB
      PDF
      AN3070
      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32™’s USART
      1.4
      188.96 KB
      PDF
      AN5146

      IIS3DHHC: high-resolution, high-stability 3-axis digital accelerometer

      AN5041

      IO-Link solution based on STEVAL-IDP004V2 master evaluation board and STEVAL-IDP003V1 kit

      AN5063

      LPS33HW digital pressure sensor: guidelines for system integration

      AN4113

      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32F05x USART

      AN3070

      Managing the Driver Enable signal for RS-485 and IO-Link communications with the STM32™’s USART

    • Description Version Size Action
      DT0064
      Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance
      1.0
      616.94 KB
      PDF
      DT0064

      Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance

Presentations & Training Material

    • Description Version Size Action
      FP-CLD-AZURE1 quick start guide 3.3
      4.84 MB
      PDF
      IoT: Cloud Connectivity Expansion Packages for STM32Cube 1.0
      895.03 KB
      PDF
      LPWAN Technologies For IoT Francesco Doddo 1.0
      7.55 MB
      PDF
      STEVAL-BFA001V1B GETTING STARTED GUIDE 1.1
      3.41 MB
      PDF

      FP-CLD-AZURE1 quick start guide

      IoT: Cloud Connectivity Expansion Packages for STM32Cube

      LPWAN Technologies For IoT Francesco Doddo

      STEVAL-BFA001V1B GETTING STARTED GUIDE

Publications and Collaterals

    • Description Version Size Action
      L6360 and L6362A - Embracing the Industry 4.0 revolution 12.2018
      282.88 KB
      PDF
      MEMS sensors for smart industry 4.0 4.0
      892.85 KB
      PDF
      S2-LP:Ultra-low-power, high-performance, sub-1GHz RF transceiver 4.0
      1.47 MB
      PDF
      STSAFE-TPM Standardized solution for trusted devices 1.0
      195 KB
      PDF

      L6360 and L6362A - Embracing the Industry 4.0 revolution

      MEMS sensors for smart industry 4.0

      S2-LP:Ultra-low-power, high-performance, sub-1GHz RF transceiver

      STSAFE-TPM Standardized solution for trusted devices

    • Description Version Size Action
      Amplifiers & Comparators Brochures Broaden Your Horizons 1.0
      2.55 MB
      PDF
      Brochure Secure MCUs - Secure Solutions 1.2
      1.11 MB
      PDF
      Products and solutions for IO-Link transceivers 08.2017
      1.21 MB
      PDF
      Products and solutions for Smart industry 3.0
      2.99 MB
      PDF
      STM32L series - Ultra-low-power 32-bit MCUs 18.11
      3.86 MB
      PDF

      Amplifiers & Comparators Brochures Broaden Your Horizons

      Brochure Secure MCUs - Secure Solutions

      Products and solutions for IO-Link transceivers

      Products and solutions for Smart industry

      STM32L series - Ultra-low-power 32-bit MCUs

    • Description Version Size Action
      Capacitive MEMS accelerometer for condition monitoring 1.0
      3.35 MB
      PDF

      Capacitive MEMS accelerometer for condition monitoring

Embedded Software

    • Part Number

      Cloud based web application for condition monitoring and predictive maintenance

      Predictive maintenance evaluation kit firmware

      Firmware for STEVAL-STWINKT1 evaluation kit for predictive maintenance, smart industry, IoT and remote monitoring applications

    • Part Number

      STM32Cube function pack for multi sensors node with signal processing to enable predictive maintenance

      STM32 MPU OpenSTLinux Expansion Pack for Predictive Maintenance applications

eDesignSuite

Converter

Input

V This option is required. And must be less than or equal to Volt. Max [V]
V This option is required. And must be greater than or equal to Volt. Min [V]

Output Power

V This option is required and must be a number.
A This option is required and must be a number.

Audio ICs

Part number Description
MP23ABS1 High performance MEMS audio sensor single ended analog bottom-port microphone
MP34DT05-A MEMS audio sensor omnidirectional digital microphone, 64 dB SNR, -26 dBFS sensitivity, top-port, 122.5 dBSPL AOP
MP34DT06J MEMS audio sensor omnidirectional stereo digital microphone
Part number
High performance MEMS audio sensor single ended analog bottom-port microphone
MEMS audio sensor omnidirectional digital microphone, 64 dB SNR, -26 dBFS sensitivity, top-port, 122.5 dBSPL AOP
MEMS audio sensor omnidirectional stereo digital microphone

Interfaces and Transceivers

Part number Description
SERC816 SERCOS Interface controller
ST1480AB 3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [-40oC, 85oC] TEMPERATURE RANGE
ST1480AC 3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [0oC, 70oC] TEMPERATURE RANGE
ST26C31B CMOS QUAD TRI-STATE DIFFERENTIAL LINE DRIVER
ST26C32AB CMOS QUAD 3-STATE DIFFERENTIAL LINE RECEIVER
ST3485EB 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST3485EC 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
ST3485EI 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 125oC] temperature range
ST3485EIY 3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, automotive grade
ST4485EB 3.3 V powered, 15 kV ESD protected, up to 20 Mbps RS-485/RS-422 transceiver, [-40oC, 105oC] temperature range
ST485AB very high speed low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485B low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485C low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
ST485EB 15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485EC 15 kV ESD protected, low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
ST485ERB 15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
ST485EX 15 kV ESD protected, low power RS-485/RS-422 transceiver, [-55oC, 125oC] temperature range
ST490AB Low power full duplex high speed RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
STR485 3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps
STR485E 3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps
Part number
SERCOS Interface controller
3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [-40oC, 85oC] TEMPERATURE RANGE
3.3V POWERED, 15KV ESD PROTECTED TRANSMIT AT UP TO 12MBPS TRUE RS-485/RS422 TRANSCEIVER, [0oC, 70oC] TEMPERATURE RANGE
CMOS QUAD TRI-STATE DIFFERENTIAL LINE DRIVER
CMOS QUAD 3-STATE DIFFERENTIAL LINE RECEIVER
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, [-40oC, 125oC] temperature range
3.3 V powered, 15 kV ESD protected, up to 12 Mbps RS-485/RS-422 transceiver, automotive grade
3.3 V powered, 15 kV ESD protected, up to 20 Mbps RS-485/RS-422 transceiver, [-40oC, 105oC] temperature range
very high speed low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [0oC, 70oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
15 kV ESD protected, low power RS-485/RS-422 transceiver, [-55oC, 125oC] temperature range
Low power full duplex high speed RS-485/RS-422 transceiver, [-40oC, 85oC] temperature range
3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps
3.3V RS485 compatible with 1.8V I/Os and selectable speed 20Mbps or 250kbps

MEMS and Sensors

Part number Description
IIS2DH 3-axis digital accelerometer, ultra low-power high performance MEMS motion sensor
IIS2DLPC MEMS digital output motion sensor: high-performance ultra-low-power 3-axis accelerometer for industrial applications
IIS2MDC High accuracy, ultra-low-power ,3-axis digital output magnetometer
IIS328DQ 3-axis accelerometer for industrial applications, SPI/I2C digital output, ultra low-power high performance
IIS3DHHC High-resolution, high-stability 3-axis digital inclinometer for industrial applications
IMP34DT05 MEMS audio sensor omnidirectional digital microphone for industrial applications
ISM303DAC High Performance,Low Power, compact 3D accelerometer and 3D Magnetometer module
ISM330DHCX iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications
ISM330DLC iNEMO inertial measurement unit (IMU): 3D accelerometer and 3D gyroscope with digital output for industrial applications
LPS22HB Ultra-compact piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, full-mold, holed LGA package (HLGA)
LPS22HD Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, small and thin package
LPS22HH MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
LPS25HB Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, I2C, SPI
LPS27HHW MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water resistant package
LPS33HW Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, water resistant package
LPS33W MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with potted gel package
LPS35HW Waterproof piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer
STTS22H Low-voltage, ultra-low-power, 0.5 °C accuracy I2C/SMBus 3.0 temperature sensor
Part number
3-axis digital accelerometer, ultra low-power high performance MEMS motion sensor
MEMS digital output motion sensor: high-performance ultra-low-power 3-axis accelerometer for industrial applications
High accuracy, ultra-low-power ,3-axis digital output magnetometer
3-axis accelerometer for industrial applications, SPI/I2C digital output, ultra low-power high performance
High-resolution, high-stability 3-axis digital inclinometer for industrial applications
MEMS audio sensor omnidirectional digital microphone for industrial applications
High Performance,Low Power, compact 3D accelerometer and 3D Magnetometer module
iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications
iNEMO inertial measurement unit (IMU): 3D accelerometer and 3D gyroscope with digital output for industrial applications
Ultra-compact piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, full-mold, holed LGA package (HLGA)
Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, small and thin package
MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer
Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, I2C, SPI
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with water resistant package
Piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer, water resistant package
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer with potted gel package
Waterproof piezoresistive absolute pressure sensor, 260-1260 hPa, digital output barometer
Low-voltage, ultra-low-power, 0.5 °C accuracy I2C/SMBus 3.0 temperature sensor

Microcontrollers & Microprocessors

Part number Description
STM32F469AI High-performance advanced line, ARM Cortex-M4 core with DSP and FPU, 2 Mbytes Flash, 180 MHz CPU, ART Accelerator, Chrom-ART Accelerator, FMC with SDRAM, Dual QSPI, TFT, MIPI-DSI
STM32L476RG Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, LCD, USB OTG, DFSDM
STM32L4A6QG Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, USB OTG, LCD, AES-256, DFSDM
STM32L4R9ZI Ultra-low-power with FPU ARM Cortex-M4 MCU 120 MHz with 2048 kbytes Flash, USB OTG, DFSDM, LCD-TFT, MIPI DSI
STM32MP157C MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography
STM32WB50CG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1Mbyte Flash memory, 128KB RAM, Bluetooth 5, 802.15.4, +4dBm output power, 100dB link budget
STM32WB55CC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55CE Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55CG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55RC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256 Kbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55RE Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55RG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55VC Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55VE Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
STM32WB55VG Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Part number
High-performance advanced line, ARM Cortex-M4 core with DSP and FPU, 2 Mbytes Flash, 180 MHz CPU, ART Accelerator, Chrom-ART Accelerator, FMC with SDRAM, Dual QSPI, TFT, MIPI-DSI
Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, LCD, USB OTG, DFSDM
Ultra-low-power with FPU ARM Cortex-M4 MCU 80 MHz with 1 Mbyte Flash, USB OTG, LCD, AES-256, DFSDM
Ultra-low-power with FPU ARM Cortex-M4 MCU 120 MHz with 2048 kbytes Flash, USB OTG, DFSDM, LCD-TFT, MIPI DSI
MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1Mbyte Flash memory, 128KB RAM, Bluetooth 5, 802.15.4, +4dBm output power, 100dB link budget
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256 Kbyte Flash, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 256Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256
Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0+ 32MHz with 1 Mbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256

Power Management

Part number Description
L6360 IO-Link communication master transceiver IC
L6362A IO-Link communication transceiver device IC
Part number
IO-Link communication master transceiver IC
IO-Link communication transceiver device IC

Secure MCUs

Part number Description
Kerkey Security Module for Smart Metering system
ST33TPHF20I2C Trusted Platform Module 2.0 with I2C interface
ST33TPHF20SPI Trusted Platform Module 2.0 with TCG SPI interface
ST33TPHF2EI2C Trusted Platform Module 1.2 & 2.0 with TCG I2C interface
ST33TPHF2ESPI Trusted Platform Module 1.2 & 2.0 with TCG SPI interface
ST33TPM12I2C Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300 CPU
ST33TPM12LPC Trusted Platform Module with LPC interface based on 32-bit ARM® SecurCore® SC300 CPU
ST33TPM12SPI Trusted Platform Module with SPI interface based on 32-bit ARM® SecurCore® SC300 CPU
STSAFE-A100 Authentication & Brand protection secure solution
STSAFE-A1SX Secure Element for Sigfox LPWAN network
STSAFE-J100 Flexible programmable secure solution for Gateway
STSAFE-J100-BS Security Module of a Smart Meter gateway as defined by BSI
Part number
Security Module for Smart Metering system
Trusted Platform Module 2.0 with I2C interface
Trusted Platform Module 2.0 with TCG SPI interface
Trusted Platform Module 1.2 & 2.0 with TCG I2C interface
Trusted Platform Module 1.2 & 2.0 with TCG SPI interface
Trusted Platform Module with I2C interface based on 32-bit ARM® SecurCore® SC300 CPU
Trusted Platform Module with LPC interface based on 32-bit ARM® SecurCore® SC300 CPU
Trusted Platform Module with SPI interface based on 32-bit ARM® SecurCore® SC300 CPU
Authentication & Brand protection secure solution
Secure Element for Sigfox LPWAN network
Flexible programmable secure solution for Gateway
Security Module of a Smart Meter gateway as defined by BSI

Wireless Transceivers, MCUs and Modules

Part number Description
BlueNRG-M2 Very low power application processor module for Bluetooth® low energy v5.0
S2-LP Ultra-low power, high performance, sub-1GHz transceiver
Part number
Very low power application processor module for Bluetooth® low energy v5.0
Ultra-low power, high performance, sub-1GHz transceiver
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