Product overview
概要
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP1 Series to allow users easily develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the co-processor.
They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbps connector, one USB Type-C® OTG connector, four USB Type-A Host connectors, one HDMI® transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.
To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO® and Raspberry Pi® shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi-Fi® and Bluetooth® Low Energy capability.
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All features
- Common features
- STM32MP157 Arm®-based dual Cortex®-A7 800 MHz 32 bits + Cortex®-M4 32 bits MPU in TFBGA361 package
- ST PMIC STPMIC1
- 4-Gbit DDR3L, 16 bits, 533 MHz
- 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
- USB OTG HS
- Audio codec
- 4 user LEDs
- 2 user and reset push-buttons, 1 wake-up button
- 5 V / 3 A USB Type-C® power supply input (not provided)
- Board connectors:
Ethernet RJ45 4 × USB Host Type-A USB Type-C® DRP MIPI DSISM HDMI® Stereo headset jack including analog microphone input microSD™ card GPIO expansion connector (Raspberry Pi® shield capability) ARDUINO® Uno V3 expansion connectors - On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
- STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- Board-specific features
- 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
- Wi-Fi® 802.11b/g/n
- Bluetooth® Low Energy 4.1
- Common features
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すべてのリソース
| Resource title | Version | Latest update | Actions | Details | ダウンロード |
|---|
Board Manufacturing Specifications (2)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 3.0 | 14 Dec 2022 | 14 Dec 2022 | |||
| ZIP | 2.1 | 14 Dec 2022 | 14 Dec 2022 |
BOM (1)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 3.0 | 14 Dec 2022 | 14 Dec 2022 |
Schematic Pack (2)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| 1.0 | 30 Nov 2022 | 30 Nov 2022 | ||||
| 1.0 | 30 Nov 2022 | 30 Nov 2022 |
Quality and Reliability
| Part Number | Marketing Status | RoHSコンプライアンスグレード | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|
| STM32MP157D-DK1 | Active 交換品交換品 | Ecopack1 | - | - | |
STM32MP157D-DK1
Package:
Ecopack1Material Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
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Sample & Buy
| Part Number | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Specific features | WEEE Compliant | Core Product | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32MP157D-DK1 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
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STM32MP157D-DK1 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。