The BUXD87 is manufactured using High Voltage Multi Epitaxial Planar technology for high switching speeds and high voltage withstand capability.
- REVERSE PINS OUT Vs STANDARD IPAK/DPAK PACKAGE
- HIGH DC CURRENT GAIN
- HIGH VOLTAGE CAPABILITY
- SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX \"T4\")
- THROUGH-HOLE IPAK (TO-251) POWER PACKAGE IN TUBE (SUFFIX \"-1\")
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.