Product overview
Description
The BUXD87 is manufactured using High Voltage Multi Epitaxial Planar technology for high switching speeds and high voltage withstand capability.
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All features
- REVERSE PINS OUT Vs STANDARD IPAK/DPAK PACKAGE
- HIGH DC CURRENT GAIN
- HIGH VOLTAGE CAPABILITY
- SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE IN TAPE & REEL (SUFFIX \"T4\")
- THROUGH-HOLE IPAK (TO-251) POWER PACKAGE IN TUBE (SUFFIX \"-1\")
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BUXD87
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|
| BUXD87T4 | Active | DPAK | Industrial | Ecopack2 | 10 | 2024-06-10T00:00:00.000+02:00 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| BUXD87T4 | | | distributors No availability of distributors reported, please contact our sales office | |||||||||||
BUXD87T4 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors