パンフレット
ユーザ・マニュアル
技術ノート
- HU3PAK package mounting and thermal behavior
- Irradiated HV Power MOSFETs working in Linear Zone: a comparison of electro-thermal behavior with standard HV products
- Leadless packages with enhanced board level solder joint reliability for automotive application
- Mounting instructions for SMD (surface mounting device) packages
- Mounting instructions for THD (through-hole device) packages