ST33TPHF2EI2C
NRND
Design Win
Trusted Platform Module 1.2 & 2.0 with TCG I2C interface

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製品概要

概要

The ST33TPHF2EI2C is a cost-effective and high-performance Trusted Platform Module (TPM) targeting PC, server platforms and embedded systems.

This product supports two modes exclusively: TPM 1.2 mode and TPM 2.0 mode. In TPM 1.2 mode, the set of TPM 1.2 commands is supported and only TPM 1.2 assets can be accessed. In TPM 2.0 mode, the set of TPM 2.0 commands is supported and only TPM 2.0 assets can be accessed.

In TPM 1.2 mode, the product implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Specifications version 1.2 Level 2 Revision 116 [TPM1.2 P1 r116], [TPM1.2 P2 r116], [TPM1.2 P3 r116]), and is also based on the TCG PC Client specific TPM interface specifications 1.3 [TIS 1.30].

In TPM 2.0 mode, the product implements the functions defined by the Trusted Computing Group (www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Library Specifications version 2.0 Level 0 Revision 138 ([TPM 2.0 P1 r138], [TPM 2.0 P2 r138], [TPM 2.0 P3 r138], [TPM 2.0 P4 r138]) and errata version 1.4 [TPM 2.0 rev138 Err 1.4]. It is also based on the TCG PC client-specific TPM Platform specifications rev 1.03 [PTP 2.0 r1.03] and [Errata sheet]. [TPM 2.0 PP] specifies the protection profile.

The product also supports the ability to upgrade the TPM firmware thanks to a persistent application Flash loader to support new standard evolutions.

  • All features

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set
      • Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly
      • For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3
      • For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • Compliant with the Trusted Computing Group (TCG) Trusted Platform Module (TPM) I²C Interface Specification defined in PTP 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
      • I²C support up to 400 kHz
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
    • Security features
      • Active shield and environmental sensors
      • Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes
      • Monitoring of environmental parameters (power and clock)
      • Hardware and software protection against fault injection
      • FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature and encryption
    • Product compliance
      • TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites

EDA Symbols, Footprints and 3D Models

STMicroelectronics - ST33TPHF2EI2C

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Quality and Reliability

Part Number Marketing Status Package RoHSコンプライアンスグレード Material Declaration**
ST33HTPH2E32AHC2
NRND
VFQFPN 32 5x5x1.0 mm Ecopack2

ST33HTPH2E32AHC2

Package:

VFQFPN 32 5x5x1.0 mm

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

VFQFPN 32 5x5x1.0 mm

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

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