標準シリアルEEPROM

The 5-pin DFN is a standard JEDEC package with an extremely compact outline (1.4 x 1.7 mm) making it a versatile alternative between the standard 8-pin DFN (2 x 3 mm) package and the more advanced chip scale package solution. Its plastic encapsulated package using conventional copper lead frame technology makes it very robust for handling and manufacturing. Ensuring a reduced footprint and lower weight while maintaining an easy manufacturing process, the DFN5 I2C EEPROM is ideal for boot, setup and datalog functions in communication and sensor modules used in portable applications. ST's DFN5 I2C EEPROM portfolio is complete with devices from 2 up to 128 Kbits.

Camera modules for mobile devices follow a path of quick miniaturization while display resolution increases and requires a higher set of parameters to operate efficiently.

The 4-ball WLCSP I2C EEPROM family provides a minimal pin count, footprint and thickness, fitting the most stringent hardware design requirements. In addition, thanks to internally-wired device select code options, the EEPROM for rear and front cameras can share the same I2C bus, providing further module design optimization.

The factory-programmed settings can also be protected when selecting products with the software write-protect instruction.

Manufacturing robustness aspects are also covered with an optional back-side coating.

Choose your product: Compatible 4-ball I2C (with industry-standard footprint) or SWP 4-ball I2C (with software write-protect option)