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標準シリアルEEPROM

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Standard Serial EEPROM are competitive products designed for flexible and reliable management of parameters in Smart Things, Smart Homes/Cities as well as Smart Industry with extended temperature ranges. Products feature up to 4 million write/erase cycles per byte, over 100 million cycles per device and 200 years data retention.

The Industrial 85 °C line offers products with a focus on low voltage, low pin-count and the smallest form factor to fit mobile, consumer and computer applications. Packages such as DFN8, DFN5, WLCSP 8/4 balls and bare die allow to fit in the tiniest modules. Low-power operation also makes them ideal for battery-operated wearable modules. 

I2C – M24xxx 1 Kbit to 2 Mbits 1.6 to 5.5 V Up to 1 MHz More about I2C
SPI – M95xxx 1 Kbit to 2 Mbits 1.7 to 5.5 V Up to 20 MHz More about SPI
Microwire – M93xxx 1 to 16 Kbits 2.5 to 5.5 V Up to 2 MHz More about MW

Industrial-Plus 105 °C products are proposed in SO8N and TSSOP8 packages to design robust solutions for Smart Cities such as networking, power and lighting in outdoor applications. Products offer improved traceability thanks to a lockable page and extended operating temperature ranges. 

I2C – M24xxx 2 to 512 Kbits 1.7 to 5.5 V Lockable page More about I2C
SPI – M95xxx 4 to 512 Kbits 1.7 to 5.5 V Lockable page More about SPI

Gain development time by using the IBIS and Verilog models available in Resources.

推奨製品

New DFN5 (1.4 x 1.7mm) package

I2C EEPROM family in robust package with reduced pin count and smaller footprint

World’s First Automotive-Qualified 2-Mbit SPI EEPROM

extends parameter storage in complex automotive modules

New DFN8 (2x3 mm) package

for 125 °C automotive-grade EEPROMs

Benefits of I2C EEPROM in DFN5 package

The 5-pin DFN is a standard JEDEC package with an extremely compact outline (1.4 x 1.7 mm) making it a versatile alternative between the standard 8-pin DFN (2 x 3 mm) package and the more advanced chip scale package solution. Its plastic encapsulated package using conventional copper lead frame technology makes it very robust for handling and manufacturing. Ensuring a reduced footprint and lower weight while maintaining an easy manufacturing process, the DFN5 I2C EEPROM is ideal for boot, setup and datalog functions in communication and sensor modules used in portable applications. ST's DFN5 I2C EEPROM portfolio is complete with devices from 2 up to 128 Kbits.

4-ball WLCSP EEPROM designed for tiny Camera modules.

Camera modules for mobile devices follow a path of quick miniaturization while display resolution increases and requires a higher set of parameters to operate efficiently.

The 4-ball WLCSP I2C EEPROM family provides a minimal pin count, footprint and thickness, fitting the most stringent hardware design requirements. In addition, thanks to internally-wired device select code options, the EEPROM for rear and front cameras can share the same I2C bus, providing further module design optimization.

The factory-programmed settings can also be protected when selecting products with the software write-protect instruction.

Manufacturing robustness aspects are also covered with an optional back-side coating.

Choose your product: Compatible 4-ball I2C (with industry-standard footprint) or SWP 4-ball I2C (with software write-protect option)