STM32MP135C

量産中
Design Win Education

32-bit Arm Cortex-A7 650MHz MPU for Industrial, Graphics and Security

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製品概要

主な利点

Dual Ethernet Ports

Addressing new applications and markets

Enhanced Camera pipe

Better performances with up to 5Mpix @ 15fps or 3Mpix @ 30fps​

Improved security with certifications

Target highly secured applications like POS, cash registers…

概要

The STM32MP135C/F devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 1 GHz. The Cortex®-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 128-Kbyte level2 cache. The Cortex®-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20 % more single thread performance than the Cortex®-A5 and provides similar performance to the Cortex®­A9.

The Cortex®-A7 incorporates all features of the high-performance Cortex®-A15 and Cortex®-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP135C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP135C/F devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, a low-power secured RTC, ten general-purpose 16-bit timers, two 32-bit timers, two PWM timers for motor control, five low-power timers, a secured true random number generator (RNG), and an advanced secured cryptographic acceleration cell. The devices support two digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • 特徴

    • Includes ST state-of-the-art patented technology
    • コア
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 128-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
    • メモリ
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16-bit
        • up to DDR3/DDR3L-1066 16-bit
      • 168 Kbytes of internal SRAM: 128 Kbytes of AXI SYSRAM + 32 Kbytes of AHB SRAM and 8 Kbytes of SRAM in Backup domain
      • Dual Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, 12 x tamper pins including 5 x active tampers
      • Temperature, voltage, frequency and 32 kHz monitoring
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop, LPLV-Stop, LPLV­Stop2 and Standby
      • DDR retention in Standby mode
      • Controls for PMIC companion chip
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 4 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 135 secure I/O ports with interrupt capability
      • Up to 6 wakeup
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 4 DMA controllers to unload the CPU
      • 56 physical channels in total
      • 1 x high-speed general-purpose master direct memory access controller (MDMA)
      • 3 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 30 communication peripherals
      • 5 × I2C FM+ (1 Mbit/s, SMBus/PMBus™)
      • 4 x UART + 4 x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI)
      • 5 × SPI (50 Mbit/s, including 4 with full-duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 2 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • 2 × SDMMC up to 8 bits (SD/e•MMC™/SDIO)
      • 2 × CAN controllers supporting CAN FD protocol
      • 2 × USB 2.0 high-speed Host
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 2 x Ethernet MAC/GMAC
        • IEEE 1588v2 hardware, MII/RMII/RGMII
      • 8- to 16-bit camera interface, 3 Mpix @30 fps or 5Mpix @15 fps in color or monochrome with pixel clock @120 MHz (max freq)
    • 6 analog peripherals
      • 2 × ADCs with 12-bit max. resolution up to 5 Msps
      • 1 x temperature sensor
      • 1 x digital filter for sigma-delta modulator (DFSDM) with 4 channels and 2 filters
      • Internal or external ADC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 x 1080) @ 30 fps
        • pixel clock up to 90 MHz
        • two layers (incl. 1 secured) with programmable color LUT
    • Up to 24 timers and 2 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • Secure RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non­secure, virtual, hypervisor)
      • 2 × independent watchdogs
    • Hardware acceleration
      • AES 128, 192, 256 DES/TDES
      • AES 128, 256 with DPA protection
      • PKA ECC/RSA with DPA protection
      • AES 128 on-the-fly DRAM encryption and decryption
      • HASH (SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, SHA-3), HMAC
      • 1 x true random number generator (6 triple oscillators)
      • 1 x CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces usable as GPIOs
      • 4-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1280 bits available for user and 256-bit HUK to protect AES 256 keys
    • All packages are ECOPACK2 compliant

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品質 & 信頼性

製品型番 マーケティング・ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32MP135CAE3
量産中
LFBGA 289 14x14x1.7 P 0.8 mm インダストリアル Ecopack2
STM32MP135CAF3
量産中
TFBGA 320 11x11x1.2 P 0.5 mm インダストリアル Ecopack2
STM32MP135CAF3T
量産中
TFBGA 320 11x11x1.2 P 0.5 mm インダストリアル Ecopack2
STM32MP135CAG3
量産中
TFBGA 289 9x9x1.2 P 0.5 mm インダストリアル Ecopack2

STM32MP135CAE3

Package:

LFBGA 289 14x14x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

LFBGA 289 14x14x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135CAF3

Package:

TFBGA 320 11x11x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 320 11x11x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135CAF3T

Package:

TFBGA 320 11x11x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 320 11x11x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP135CAG3

Package:

TFBGA 289 9x9x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 289 9x9x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

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パッケージ
梱包タイプ
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
Junction Temperature (°C) (min)
Junction Temperature (°C) (max)
STM32MP135CAE3
Available at distributors

販売代理店在庫 STM32MP135CAE3

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STM32MP135CAF3
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STM32MP135CAG3
Available at distributors

販売代理店在庫 STM32MP135CAG3

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STM32MP135CAF3T
Available at distributors

販売代理店在庫 STM32MP135CAF3T

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

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STM32MP135CAE3 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP135CAE3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

販売代理店

販売代理店在庫データ:

STM32MP135CAF3 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP135CAF3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

販売代理店

販売代理店在庫データ:

STM32MP135CAG3 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP135CAG3

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

販売代理店

販売代理店在庫データ:

STM32MP135CAF3T 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP135CAF3T

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

125

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(*)概算用の参考価格(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。