製品概要
概要
The Teseo-LIV3F module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS). The Teseo-LIV3F modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.Within its 9.7x10.1 mm tiny size, Teseo-LIV3F is offerinDS12152g superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying to its dedicated 32 KHz Real Time Clock (RTC) oscillator.
Thanks to the embedded 16 Mbit flash Teseo-LIV3F offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.
Teseo-LIV3F provides also the Autonomous Assisted GNSS able to predict satellite data based on previous observation of satellite.
Teseo-LIV3F module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40°C to 85°C.
-
特徴
- Simultaneously multiconstellation
- -163 dBm navigation sensitivity
- 1.5 m CEP accuracy positioning
- 16 Mbit embedded Flash for data logging and FW upgrade
- 2.1 V to 4.3 V supply voltage range
- Tiny LCC 18 pin package (9.7x10.1)
- Operating temperature (-40°, 85°C)
- Free FW configuration
- 17 μW standby current and 75 mW tracking power consumption
おすすめ製品
All tools & software
All resources
| Resource title | Latest update |
|---|
製品スペック (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 14 Oct 2019 | 14 Oct 2019 |
アプリケーションノート (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Mar 2021 | 17 Mar 2021 | |||
| 17 Mar 2021 | 17 Mar 2021 | |||
| 17 Mar 2021 | 17 Mar 2021 |
ユーザ･マニュアル (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Mar 2021 | 17 Mar 2021 | |||
| 17 Mar 2021 | 17 Mar 2021 |
ツール&ソフトウェア用アプリケーション・ノート (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Dec 2019 | 17 Dec 2019 |
プレゼンテーション (5 of 6)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Mar 2021 | 17 Mar 2021 | |||
| 14 Apr 2020 | 14 Apr 2020 | |||
| 14 Apr 2020 | 14 Apr 2020 | |||
| 14 Apr 2020 | 14 Apr 2020 | |||
| 17 Mar 2021 | 17 Mar 2021 | |||
| 11 Jun 2019 | 11 Jun 2019 |
フライヤ (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Mar 2021 | 17 Mar 2021 |
Product Certifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Apr 2019 | 17 Apr 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - Teseo-LIV3F
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
品質 & 信頼性
| 製品型番 | Marketing Status | パッケージ | グレード | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|---|
| TESEO-LIV3F | 量産中 | RF MODULE | インダストリアル | Ecopack2 |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 販売代理店から購入 | STから購入 | 製品ステータス | ECCN (US) | ECCN (EU) | 梱包タイプ | パッケージ | 温度（℃） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | |||||||||||
| TESEO-LIV3F | 6 distributors | Buy Direct | 量産中 | 7A994 | NEC | Tape And Reel | RF MODULE | -40 | 85 | SOUTH KOREA | ||
（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。
