パンフレット
ユーザ･マニュアル
技術ノート
- Assembly recommendations for STMicroelectronics ISOTOP package
- HU3PAK package mounting and thermal behavior
- Irradiated HV Power MOSFETs working in Linear Zone: a comparison of electro-thermal behavior with standard HV products
- Mounting instructions for SMD (surface mounting device) packages
- Mounting instructions for THD (through-hole device) packages
アプリケーション･ノート
- 19 V - 90 W adapter with PFC for laptop computers using the L6563H and L6699
- 250 W grid connected microinverter
- A power factor corrector with MDmesh™ II and SiC diode
- Advantage of the use of an added driver source lead in discrete Power MOSFETs
- Electronic ballast with active PFC using STD3N62K3 power MOSFET and STD845DN40 BJT device
データシート
- Automotive N-channel 600 V, 70 mΩ typ., 36 A MDmesh™ DM6 Power MOSFET in an H²PAK-7 package
- Automotive N-channel 650 V, 0.024 Ω typ., 69 A MDmesh M5 Power MOSFET in a TO-247 long leads package
- Automotive N-channel 650 V, 0.042 Ω typ., 60 A Power MOSFET MDmesh™ DM2 in a D³PAK package
- Automotive N-channel 650 V, 33 mΩ typ., 72 A MDmesh DM6 Power MOSFET in a TO247‑4 package
- Automotive-grade N-channel 250 V, 140 mΩ typ., 17 A STripFET II Power MOSFET in a DPAK package