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  • The STEVAL-BFA001V2B is an industrial reference design kit designed for condition monitoring (CM) and predictive maintenance (PdM).

    The layout is designed to meet IEC61000-4-2/4 and EN60947 requirements for industrial applications.
    The hardware development kit consists of an industrial sensor board (STEVAL-IDP005V2; not available for separate sale), specifically designed with dimensions (50mm x 9mm x 9mm) that reflect real industrial applications and needs, an STLINK-V3MINI programming and debugging tool, an adapter (STEVAL-UKI001V2; not available for separate sale), a 0.050” 10-pin flat cable, a 4-pole cable mount connector plug with male contacts and an M12 female connector with a 2 m cable which is used for power on and connection with a master port. The connection is managed using a standard multipolar cable with one wire used for IO-Link data, one for the L+ line (positive supply voltage pole) and one for the L- line (negative supply voltage pole).
    The STSW-BFA001V2 firmware package (freely available on www.st.com) includes dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring. The package includes pressure, relative humidity and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE).
    The firmware runs on the high performance STM32F469AI, ARM® Cortex®-M4, 32-bit microcontroller. The sensor data analysis results can be displayed on a user PC terminal emulator via wired connectivity (by connecting the STEVAL-IDP005V2 UART to a USB PC port through the STEVAL-UKI001V2 adapter and STLINK-V3MINI Virtual COM) or the related IO-Link master board interface (connecting the STEVAL-IDP005V2 to an IO-Link master board through the M12 cable).
    IO-Link device stack v1.1. (for evaluation purposes with some limitations) is included in object library format with IO-Link Device Descriptor (IODD) for all measurements and with dedicated examples to demonstrate device interoperability with any master tool. It supports BLOB transfer for vibration and acoustic FFT data, event generator and parameter configuration.
    The package includes also a GUI to demonstrate the IO-Link device features when connected to the STEVAL-IDP004V2 multi-port master evaluation board.

    主な特徴

    • Kit content:
      • Sensor node (marked STEVAL-IDP005V2; not available for separate sale)
      • Communication adapter board (marked STEVAL-UKI001V2; not available for separate sale)
      • STLINK-V3MINI programming and debugging interface
      • Cables and connector
    • Main supply voltage: 18 - 32 V
    • Main components of the sensor node:
      • 32-bit ARM® Cortex®-M4 core for signal processing and analysis (STM32F469AI)
      • Ultra-wide bandwidth 3-axis digital accelerometer (IIS3DWB)
      • Absolute digital pressure sensor (LPS22HB)
      • Relative humidity and temperature sensors (HTS221)
      • Digital microphone sensors (IMP34DT05)
      • IO-Link PHY device (L6362A)
      • EEPROM (M95M01-DF) for data storage
      • Step-down switching regulator and LDO regulator (L6984 and LDK220)
      • ESD protection (ESDALC6V1-1U2, SMBJ33CA)
    • Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
      • Programmable FFT size (256, 512, 1024, 2048), overlapping and averaging
      • Programmable windowing (Flat Top, Hanning, Hamming, Rectangular)
      • Speed RMS moving average, acceleration max. peak
      • Programmable threshold for warning and alarm conditions in spectral band
    • Microphone algorithms for:
      • PDM to PCM
      • Sound pressure level (SPL)
      • Audio FFT
    • IO-Link device stack v1.1 protocol and IO-Link Device Descriptor (IODD) for all measurements included (provided by TEConcept GmbH)
    • M12 standard industrial connector
    • SWD connector for debugging and programming capability
    • Reset button
    • Expansion connector with GPIO, ADC, I²C bus, timer
    • Designed to meet IEC industrial standard requirements

サンプル & 購入

製品型番
コア製品
製品ステータス
概算価格(USS)
Quantity
ECCN (US)
Country of Origin
販売代理店からオーダー
STからオーダー
STEVAL-BFA001V2B L6362A, IIS3DWB, STM32F469AI
Evaluation
145 1 3A991A2 -

販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください

STEVAL-BFA001V2B

コア製品

L6362A, IIS3DWB, STM32F469AI

製品ステータス

Evaluation

Unit Price (US$)

145.0*

Unit Price (US$)

145

Quantity

1

ECCN (US)

3A991A2

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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開発ツール・ハードウェア

    • 製品型番

      STLINK-V3 compact in-circuit debugger and programmer for STM32

00 ファイルがダウンロード用に選択されています

技術文書

    • 概要 Version Size Action
      DB4059
      Multi-sensor predictive maintenance kit with IO-Link stack v.1.1
      1.0
      2.81 MB
      PDF
      DB4059

      Multi-sensor predictive maintenance kit with IO-Link stack v.1.1

ハードウェアリソース

    • 概要 Version Size Action
      STEVAL-BFA001V2B GERBER 1.0
      306.56 KB
      ZIP

      STEVAL-BFA001V2B GERBER

    • 概要 Version Size Action
      STEVAL-BFA001V2B BOM 1.0
      109.58 KB
      PDF

      STEVAL-BFA001V2B BOM

    • 概要 Version Size Action
      STEVAL-BFA001V2B SCHEMATIC 1.0
      198.67 KB
      PDF

      STEVAL-BFA001V2B SCHEMATIC

法務

    • 概要 Version Size Action
      Evaluation products license agreement 1.6
      74.12 KB
      PDF

      Evaluation products license agreement

製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード WEEE Compliant 材料宣誓書**
STEVAL-BFA001V2B
Evaluation
CARD インダストリアル Ecopack2 あり

STEVAL-BFA001V2B

Package:

CARD

Material Declaration**:

Marketing Status

Evaluation

Package

CARD

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

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