パンフレット
ユーザ・マニュアル
Conference Paper
- 3C-SiC Hetero-Epitaxially Grown on Silicon Compliance Substrates and New 3C-SiC Substrates for Sustainable Wide-Band-Gap Power Devices
- 4H-SiC Defects Evolution by Thermal Processes
- An evaluation of the failures in resonant topologies due to the body diode and the role of fast diode MOSFET
- Analysis of the impacts of the VGSth in modern SMPS
- Automotive-grade P-Channel Power MOSFETs for Static, Dynamic and Repetitive Reverse Polarity Protection
技術ノート
- HU3PAK package mounting and thermal behavior
- Irradiated HV Power MOSFETs working in Linear Zone: a comparison of electro-thermal behavior with standard HV products
- Leadless packages with enhanced board level solder joint reliability for automotive application
- Mounting instructions for SMD (surface mounting device) packages
- Mounting instructions for THD (through-hole device) packages