STM32MP153F

量産中
Design Win Education

MPU with Arm Dual Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, TFT display, FD-CAN, Secure boot and Cryptography

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製品概要

主な利点

Support and resources

Get everything you'll need to start your development: go on wiki, online trainings or on the community.

Mainlined OpenSTLinux Distribution

One OpenSTLinux Software compatible with STM32MP1 Series. OpenSTLinux expansion packages can be applied on the top to enable the use of additional components.

LCD-TFT display controller

Includes a 24-bit parallel digital RGB controller and provides all signals to interface directly to a broad range of LCD and TFT panels

概要

The STM32MP153C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP153C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32MP153C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP153C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • 特徴

    • コア
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • DDR memory retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 5 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
        • Pixel clock up to 90 MHz
        • Two layers with programmable colour LUT
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

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品質 & 信頼性

製品型番 マーケティング・ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32MP153FAA1
量産中
LFBGA 448 18x18x1.7 P 0.8 mm インダストリアル Ecopack2
STM32MP153FAB1
量産中
LFBGA 354 16x16x1.7 P 0.8 mm インダストリアル Ecopack2
STM32MP153FAC1
量産中
TFBGA 361 12x12x1.2 P 0.5 mm インダストリアル Ecopack2
STM32MP153FAD1
量産中
TFBGA 257 10x10x1.2 P 0.5 mm インダストリアル Ecopack2

STM32MP153FAA1

Package:

LFBGA 448 18x18x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153FAB1

Package:

LFBGA 354 16x16x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153FAC1

Package:

TFBGA 361 12x12x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP153FAD1

Package:

TFBGA 257 10x10x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

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STM32MP153FAC1
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STM32MP153FAB1
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STM32MP153FAA1
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STM32MP153FAD1
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STM32MP153FAC1 量産中

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Country of Origin:
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STM32MP153FAC1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

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STM32MP153FAB1 量産中

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パッケージ:
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RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP153FAB1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

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販売代理店在庫データ:

STM32MP153FAA1 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP153FAA1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

販売代理店

販売代理店在庫データ:

STM32MP153FAD1 量産中

Budgetary Price (US$)*/Qty:
-
パッケージ:
梱包タイプ:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

製品型番:

STM32MP153FAD1

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

販売代理店

販売代理店在庫データ:

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(*)概算用の参考価格(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。