STM32MP133F

量産中
Design Win Education

32-bit Arm Cortex-A7 1GHz MPU for Security

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製品概要

主なメリット

Dual Ethernet Ports

Addressing new applications and markets

Fastest MPU

1GHz MPU for cost-controlled applications

Improved security with certifications

Target highly secured applications like POS, cash registers…

概要

The STM32MP133C/F devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 1 GHz. The Cortex®-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 128-Kbyte level2 cache. The Cortex®-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20 % more single thread performance than the Cortex®-A5 and provides similar performance to the Cortex®­A9.

The Cortex®-A7 incorporates all features of the high-performance Cortex®-A15 and Cortex®-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP133C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP133C/F devices incorporate high-speed embedded memories with 168 Kbytes of internal SRAM (including 128 Kbytes of AXI SYSRAM, two banks of 8 Kbytes and one bank of 16 Kbytes securable AHB SRAM, and 8 Kbytes of SRAM in Backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, and a 64-bit multi-layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, a low-power secured RTC, ten general-purpose 16-bit timers, two 32-bit timers, two PWM timers for motor control, five low-power timers, a secured true random number generator (RNG), and an advanced secured cryptographic acceleration cell. The devices support two digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • 特徴

    • Includes ST state-of-the-art patented technology
    • コア
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 128-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16-bit
        • up to DDR3/DDR3L-1066 16-bit
      • 168 Kbytes of internal SRAM: 128 Kbytes of AXI SYSRAM + 32 Kbytes of AHB SRAM and 8 Kbytes of SRAM in Backup domain
      • Dual Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, 12 x tamper pins including 5 x active tampers
      • Temperature, voltage, frequency and 32 kHz monitoring
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop, LPLV-Stop, LPLV­Stop2 and Standby
      • DDR retention in Standby mode
      • Controls for PMIC companion chip
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 4 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 135 secure I/O ports with interrupt capability
      • Up to 6 wakeup
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 4 DMA controllers to unload the CPU
      • 56 physical channels in total
      • 1 x high-speed general-purpose master direct memory access controller (MDMA)
      • 3 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 29 communication peripherals
      • 5 × I2C FM+ (1 Mbit/s, SMBus/PMBus™)
      • 4 x UART + 4 x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 5 × SPI (50 Mbit/s, including 4 with full-duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 2 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • 2 × SDMMC up to 8 bits (SD/e•MMC™/SDIO)
      • 2 × CAN controllers supporting CAN FD protocol
      • 2 × USB 2.0 high-speed Host
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 2 x Ethernet MAC/GMAC
        • IEEE 1588v2 hardware, MII/RMII/RGMII
    • 6 analog peripherals
      • 2 × ADCs with 12-bit max. resolution up to 5 Msps
      • 1 x temperature sensor
      • 1 x digital filter for sigma-delta modulator (DFSDM) with 4 channels and 2 filters
      • Internal or external ADC reference VREF+
    • Up to 24 timers and 2 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • Secure RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non­secure, virtual, hypervisor)
      • 2 × independent watchdogs
    • Hardware acceleration
      • AES 128, 192, 256 DES/TDES
      • AES 128, 256 with DPA protection
      • PKA ECC/RSA with DPA protection
      • AES 128 on-the-fly DRAM encryption and decryption
      • HASH (SHA-1, SHA-224, SHA-256, SHA-384, SHA-512, SHA-3), HMAC
      • 1 x true random number generator (6 triple oscillators)
      • 1 x CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces usable as GPIOs
      • 4-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1280 bits available for user and 256-bit HUK to protect AES 256 keys
    • All packages are ECOPACK2 compliant

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品質 & 信頼性

製品型番 マーケティング・ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32MP133FAE7
量産中
LFBGA 14X14 289L PITCH 0.8 MM インダストリアル Ecopack2
STM32MP133FAF7
量産中
TFBGA 11X11 320L PITCH 0.5 MM インダストリアル Ecopack2
STM32MP133FAG7
量産中
TFBGA 9X9 289L PITCH 0.5 MM インダストリアル Ecopack2

STM32MP133FAE7

Package:

LFBGA 14X14 289L PITCH 0.8 MM

Material Declaration**:

Marketing Status

量産中

Package

LFBGA 14X14 289L PITCH 0.8 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP133FAF7

Package:

TFBGA 11X11 320L PITCH 0.5 MM

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 11X11 320L PITCH 0.5 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP133FAG7

Package:

TFBGA 9X9 289L PITCH 0.5 MM

Material Declaration**:

Marketing Status

量産中

Package

TFBGA 9X9 289L PITCH 0.5 MM

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

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STM32MP133FAE7 Available at distributors

販売代理店在庫 STM32MP133FAE7

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
5A992.c NEC Tray LFBGA 14X14 289L PITCH 0.8 MM - - -40

105

5.2297

TAIWAN

STM32MP133FAG7 Available at distributors

販売代理店在庫 STM32MP133FAG7

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
5A992.c NEC Tray TFBGA 9X9 289L PITCH 0.5 MM - - -40

105

4.4434

TAIWAN

STM32MP133FAF7 Available at distributors

販売代理店在庫 STM32MP133FAF7

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
5A992.c NEC Tray TFBGA 11X11 320L PITCH 0.5 MM - - -40

105

4.6629

TAIWAN

STM32MP133FAE7 量産中

パッケージ:
LFBGA 14X14 289L PITCH 0.8 MM
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP133FAE7

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

STM32MP133FAG7 量産中

パッケージ:
TFBGA 9X9 289L PITCH 0.5 MM
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP133FAG7

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

STM32MP133FAF7 量産中

パッケージ:
TFBGA 11X11 320L PITCH 0.5 MM
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP133FAF7

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-40

Junction Temperature (°C) (max):

105

Country of Origin:

TAIWAN

Swipe or click the button to explore more details Don't show this again

(*)概算用の参考価格(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。