AcSiP specializes in the miniaturization and integration of wireless technologies, providing advanced System in Package (SiP) solutions for the IoT sector. The company’s portfolio addresses industrial, IoT applications, smart city infrastructure, asset tracking, retail, advertising, and smart home domains, offering compact modules that combine microcontrollers, RF transceivers, and MEMS sensors. AcSiP’s manufacturing capabilities in Taiwan and China support high-volume production, enabling rapid scaling for global IoT deployments.
AcSiP’s products integrate seamlessly with the STMicroelectronics ecosystem, focusing on modules and development tools that leverage STM32 32-bit MCUs and Sub-GHz wireless connectivity. The company’s expertise spans microcontrollers, wireless connectivity, and RF module design, with a strong emphasis on hardware RF board design and RF qualification. AcSiP’s solutions, such as the ST50H module based on the STM32WL series, provide customers with pre-certified, compact, and power-efficient wireless modules, accelerating time-to-market and simplifying development. Their alignment with ST platforms and exclusive use of ST MCUs reinforce the value of the STM32 ecosystem, particularly in the LPWAN and industrial IoT markets.
AcSiP’s value to customers lies in its ability to manufacture at scale, offering a monthly production capacity of 1 million units and comprehensive support services, including technical support, design reviews, and certification assistance. For STMicroelectronics, AcSiP extends market reach in Asia and China, with plans to expand into the US and Europe, and serves as a dedicated channel for STM32-based wireless solutions.
Products provided by AcSiP
- AcSiP ST50H: Ultra-long-range wireless connectivity with strong interference immunity and low power consumption integrates a Cortex-M4 microcontroller with advanced LoRa modulation for exceptional wireless communication and interference immunity
- EK-ST50H: EK-ST50H is compliant with the Nucleo boards and STM32Cube ecosystem form as the consistent set of HW and SW development resources enables developers to design RF, digital, and analog layouts around the module and develop MCU & LPWAN applications such as LoRaWAN and Sigfox concurrently in the design-in phase
- STH50 LoRaWAN firmware: Seamless LPWAN connectivity integration with AT command control and flexible protocol management enables efficient wireless communication for IoT applications by integrating LPWAN connectivity into existing MCU platforms
- STH50 SW development tool: Comprehensive software development environment for IoT applications with integrated hardware and software support provides a tailored environment for IoT development, supporting both hardware modules and integrated software resources for efficient project execution
Products and Services offered:
• Embedded Software
• Evaluation Boards
• Hardware Integrated Devices
• Software Development Tools
Company Head Office address:
Rm. 1, 3F., No.207, Fuxing Rd., Taoyuan Dist, 330, Taoyuan City, Taiwan
Company primary contact:
Aven Chiu
Company website:
www.acsip.com.tw
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