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The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.
An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.主な特徴
- 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
- 3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
- Extended temperature range from -40 to +105 °C
- Embedded compensation for high stability over temperature
- SPI/I²C serial interface
- Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)
- Six-channel synchronized output
- Sensor hub feature to efficiently collect data from additional external sensors
- Embedded smart FIFO up to 9 kbytes
- Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors
- Machine Learning Core
- Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
- Embedded pedometer, step detector and counter for healthcare applications
- Analog supply voltage: 1.71 V to 3.6 V
- Embedded temperature sensor
- Embedded self-test both for gyroscope and accelerometer
- High shock survivability
- ECOPACK, RoHS and “Green” compliant
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | 製品ステータス | 概算価格（USS） | Quantity | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|
| ISM330DHCXTR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel | Active | 4 | 1000 | EAR99 | - | 在庫チェック | |
| ISM330DHCX | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tray | Active | - | - | EAR99 | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください |
ISM330DHCXTR
パッケージ
VFLGA2.5X3X.86 14L P.5 L.475X.25梱包タイプ
Tape And ReelUnit Price (US$)
4.0*ISM330DHCX
パッケージ
VFLGA2.5X3X.86 14L P.5 L.475X.25梱包タイプ
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
開発環境
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Picture 製品型番 製造元 概要 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 製品型番AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Picture 製品型番 製造元 概要 
X-NUCLEO-IKS02A1 ST Motion MEMS and microphone MEMS expansion board for STM32 Nucleo 製品型番Motion MEMS and microphone MEMS expansion board for STM32 Nucleo
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ソフトウェア製品
評価ツール
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Picture 製品型番 製造元 概要 
STEVAL-MKI207V1 ST ISM330DHCX adapter board for a standard DIL24 socket 
STEVAL-MKI210V1K ST iNemo inertial module kit based on ISM330DHCX 製品型番ISM330DHCX adapter board for a standard DIL24 socket
iNemo inertial module kit based on ISM330DHCX
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Picture 製品型番 製造元 概要 
STEVAL-STWINKT1 ST STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications 製品型番STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications
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サポート & アプリケーション
| 製品型番 | 製品ステータス | パッケージ | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|
| ISM330DHCX | Active | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
| ISM330DHCXTR | Active | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
