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The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.
An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.主な特徴
- 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
- 3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
- Extended temperature range from -40 to +105 °C
- Embedded compensation for high stability over temperature
- SPI/I²C serial interface
- Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)
- Six-channel synchronized output
- Sensor hub feature to efficiently collect data from additional external sensors
- Embedded smart FIFO up to 9 kbytes
- Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors
- Machine Learning Core
- Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
- Embedded pedometer, step detector and counter for healthcare applications
- Analog supply voltage: 1.71 V to 3.6 V
- Embedded temperature sensor
- Embedded self-test both for gyroscope and accelerometer
- High shock survivability
- ECOPACK, RoHS and “Green” compliant
ビデオ
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
開発環境
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画像 製品型番 製造者 概要 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 製品型番AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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画像 製品型番 製造者 概要 IMU383ZA ACEINNA High-performance inertial platform. SensiBLE SensiEDGE Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today! SensiSUB SensiEDGE Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery. 製品型番High-performance inertial platform.
Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.
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画像 製品型番 製造者 概要 
X-NUCLEO-IKS02A1 ST Motion MEMS and microphone MEMS expansion board for STM32 Nucleo 製品型番Motion MEMS and microphone MEMS expansion board for STM32 Nucleo
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ソフトウェア製品
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画像 製品型番 製造者 概要 
Unicleo-GUI ST GUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube 製品型番GUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube
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画像 製品型番 製造者 概要 
X-CUBE-ALGOBUILD ST AlgoBuilder firmware template generator expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube 製品型番AlgoBuilder firmware template generator expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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画像 製品型番 製造者 概要 AlgoBuilder ST Application for the graphical design of algorithms C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors FSM-Examples ST Configuration examples for embedded Finite State Machine feature MLC-Examples ST Configuration examples for embedded Machine Learning Core feature 製品型番Application for the graphical design of algorithms
Standard C platform-independent drivers for MEMS motion and environmental sensors
Configuration examples for embedded Finite State Machine feature
Configuration examples for embedded Machine Learning Core feature
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評価ツール
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画像 製品型番 製造者 概要 
NUCLEO-F401RE ST STM32 Nucleo-64 development board with STM32F401RE MCU, supports Arduino and ST morpho connectivity 
NUCLEO-L073RZ ST STM32 Nucleo-64 development board with STM32L073RZ MCU, supports Arduino and ST morpho connectivity 
NUCLEO-L152RE ST STM32 Nucleo-64 development board with STM32L152RE MCU, supports Arduino and ST morpho connectivity 
NUCLEO-L476RG ST STM32 Nucleo-64 development board with STM32L476RG MCU, supports Arduino and ST morpho connectivity 
STEVAL-MKI109V3 ST Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters 
STEVAL-MKI207V1 ST ISM330DHCX adapter board for a standard DIL24 socket 
STEVAL-MKI210V1K ST iNemo inertial module kit based on ISM330DHCX 
STEVAL-STWINKT1 ST STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications 製品型番STM32 Nucleo-64 development board with STM32F401RE MCU, supports Arduino and ST morpho connectivity
STM32 Nucleo-64 development board with STM32L073RZ MCU, supports Arduino and ST morpho connectivity
STM32 Nucleo-64 development board with STM32L152RE MCU, supports Arduino and ST morpho connectivity
STM32 Nucleo-64 development board with STM32L476RG MCU, supports Arduino and ST morpho connectivity
Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters
ISM330DHCX adapter board for a standard DIL24 socket
iNemo inertial module kit based on ISM330DHCX
STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications
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サポート & アプリケーション
品質 & 信頼性
| 製品型番 | Marketing Status | パッケージ | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|
| ISM330DHCXTR | 量産中 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
ISM330DHCXTR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
| 製品型番 | 販売代理店からオーダー | STからオーダー | パッケージ | 梱包タイプ | 製品ステータス | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|
| ISM330DHCXTR | 6 distributors | サンプル入手 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel | 量産中 | EAR99 | PHILIPPINES | 4.0 / 1k |
（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。
