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ISM330DHCX

量産中
Education Education
MySTに保存

iNEMO inertial module with Machine Learning Core, Finite State Machine with digital output for industrial applications.

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製品概要

概要

The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.
All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.
An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.
The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

  • 特徴

    • 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
    • 3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
    • Extended temperature range from -40 to +105 °C
    • Embedded compensation for high stability over temperature
    • SPI/I²C serial interface
    • Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)
    • Six-channel synchronized output
    • Sensor hub feature to efficiently collect data from additional external sensors
    • Embedded smart FIFO up to 9 kbytes
    • Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors
    • Machine Learning Core
    • Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
    • Embedded pedometer, step detector and counter for healthcare applications
    • Analog supply voltage: 1.71 V to 3.6 V
    • Embedded temperature sensor
    • Embedded self-test both for gyroscope and accelerometer
    • High shock survivability
    • ECOPACK, RoHS and “Green” compliant
    続きを読む 一部を表示

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All resources

Expand all categories
Resource title
Latest update

製品スペック (1)

Resource title
Latest update
DS13012 iNEMO inertial module with embedded Machine Learning Core: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications 7.0
23 Nov 2020
23 Nov 2020
DS13012 iNEMO inertial module with embedded Machine Learning Core: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications 7.0

アプリケーションノート (4)

Resource title
Latest update
AN5388 ISM330DHCX: Finite State Machine 2.0
19 Mar 2021
19 Mar 2021
AN5388 ISM330DHCX: Finite State Machine 2.0
AN5392 ISM330DHCX: Machine Learning Core 3.0
14 Apr 2021
14 Apr 2021
AN5392 ISM330DHCX: Machine Learning Core 3.0
AN5398 ISM330DHCX: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications 3.0
22 Jan 2021
22 Jan 2021
AN5398 ISM330DHCX: always-on 3D accelerometer and 3D gyroscope with digital output for industrial applications 3.0
AN5551 Precise and accurate tilt sensing in industrial applications 1.0
21 Aug 2020
21 Aug 2020
AN5551 Precise and accurate tilt sensing in industrial applications 1.0

技術ノート & 解説 (1)

Resource title
Latest update
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2
18 Jan 2021
18 Jan 2021
TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5 of 7)

Resource title
Latest update
DT0105 1-point or 3-point tumble sensor calibration 1.1
21 Jan 2021
21 Jan 2021
DT0105 1-point or 3-point tumble sensor calibration 1.1
DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
08 Jan 2021
08 Jan 2021
DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
DT0139 Decision tree generation 2.0
09 Feb 2021
09 Feb 2021
DT0139 Decision tree generation 2.0
DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
11 Jan 2021
11 Jan 2021
DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0
19 Mar 2021
19 Mar 2021
DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1
21 Jan 2021
21 Jan 2021
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1
DT0140 Tilt computation using accelerometer data for inclinometer applications 1.0
23 Nov 2020
23 Nov 2020
DT0140 Tilt computation using accelerometer data for inclinometer applications 1.0
Load more

ツール&ソフトウェア用アプリケーション・ノート (2)

Resource title
Latest update
AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 2.0
24 Mar 2021
24 Mar 2021
AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 2.0
AN5472 LPWAN cellular connectivity on STEVAL-STWINKT1B for cloud condition monitoring-based applications 2.0
24 Mar 2021
24 Mar 2021
AN5472 LPWAN cellular connectivity on STEVAL-STWINKT1B for cloud condition monitoring-based applications 2.0

プレゼンテーション (4)

Resource title
Latest update
ISM330DHCX tools and GUI 1.0
24 Mar 2020
24 Mar 2020
ISM330DHCX tools and GUI 1.0
ST sensors longevity program 2.0
07 Apr 2021
07 Apr 2021
ST sensors longevity program 2.0
iNEMO* inertial modules - Tools and GUIs for ML 1.0
14 Jan 2021
14 Jan 2021
iNEMO* inertial modules - Tools and GUIs for ML 1.0
iNEMO* inertial modules: Evaluation tools and GUI 1.0
13 Jan 2021
13 Jan 2021
iNEMO* inertial modules: Evaluation tools and GUI 1.0

フライヤ (3)

Resource title
Latest update
ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0
11 Mar 2020
11 Mar 2020
ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0
LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.1
01 Jul 2020
01 Jul 2020
LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.1
LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core 1.0
11 Mar 2020
11 Mar 2020
LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core 1.0

パンフレット (4)

Resource title
Latest update
MEMS Sensors for automotive applications 1.0
13 Jun 2019
13 Jun 2019
MEMS Sensors for automotive applications 1.0
MEMS and Sensors Quick Reference Guide 1.1
07 Apr 2021
07 Apr 2021
MEMS and Sensors Quick Reference Guide 1.1
MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.1
06 Aug 2020
06 Aug 2020
MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.1
Sensor libraries software pack for STM32Cube 2.0
25 Feb 2021
25 Feb 2021
Sensor libraries software pack for STM32Cube 2.0

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STMicroelectronics - ISM330DHCX

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品質 & 信頼性

製品型番 Marketing Status パッケージ RoHSコンプライアンスグレード 材料宣誓書**
ISM330DHCXTR
量産中
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

ISM330DHCXTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

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Marketing Status

量産中

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

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ISM330DHCXTR Available at 1 distributors

販売代理店在庫ISM330DHCXTR

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク
Farnell Element14 EUROPE 19 1 発注する

販売代理店在庫データ: 2021-04-16

販売代理店

Farnell Element14

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EUROPE 発注する

販売代理店在庫データ: 2021-04-16

量産中
EAR99 NEC Tape And Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 105 PHILIPPINES 4.0 / 1k

ISM330DHCXTR

製品ステータス

量産中

ECCN (US)

EAR99
詳細情報

Budgetary Price (US$)*/Qty

4.0 / 1k

販売代理店在庫ISM330DHCXTR

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク
Farnell Element14 EUROPE 19 1 発注する

販売代理店在庫データ: 2021-04-16

販売代理店

Farnell Element14

在庫

19

Min.Order

1

地域

EUROPE 発注する

販売代理店在庫データ: 2021-04-16

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(最小)

-40

(最大)

105

Budgetary Price (US$)* / Qty

4.0 / 1k

Country of Origin

PHILIPPINES

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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