Ultra-low-power dual core Arm Cortex-M4 MCU 64 MHz, Cortex-M0 32MHz with 512Kbyte of Flash memory, Bluetooth 5, 802.15.4, USB, LCD, AES-256

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  • The STM32WB55xx multiprotocol wireless and ultra-low-power devices embed a powerful and ultra-low-power radio compliant with the Bluetooth® Low Energy SIG specification v5.0 and with IEEE 802.15.4-2011. They contain a dedicated Arm® Cortex® -M0+ for performing all the real-time low layer operation.

    The STM32WB55xx devices are designed to be extremely low-power and are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 64 MHz. The Cortex®-M4 core features a Floating point unit (FPU) single precision that supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.
    Enhanced inter-processor communication is provided by the IPCC with six bidirectional channels. The HSEM provides hardware semaphores used to share common resources between the two processors.
    The STM32WB55xx devices embed high-speed memories (Flash memory up to 1 Mbyte, up to 256 Kbyte of SRAM), a Quad-SPI Flash memory interface (available on all packages) and an extensive range of enhanced I/Os and peripherals.
    Direct data transfer between memory and peripherals and from memory to memory is supported by fourteen DMA channels with a full flexible channel mapping by the DMAMUX peripheral.
    The STM32WB55xx devices embed several mechanisms for embedded Flash memory and SRAM: readout protection, write protection and proprietary code readout protection. Portions of the memory can be secured for Cortex® -M0+ exclusive access.
    The two AES encryption engines, PKA and RNG enable lower layer MAC and upper layer cryptography. A customer key storage feature may be used to keep the keys hidden.
    The devices offer one fast 16-bit ADC and two ultra-low-power comparators associated with a high accuracy reference voltage generator
    The STM32WB55xx devices embed a low-power RTC, one advanced 16-bit timer, one general-purpose 32-bit timer, two general-purpose 16-bit timers, and two 16-bit low-power timers.
    In addition, up to 18 capacitive sensing channels are available. The devices also embed an integrated LCD driver up to 8x40 or 4x44, with internal step-up converter.
    They also feature standard and advanced communication interfaces:
    The STM32WB55xx operate in the -40 to +105 °C (+125 °C junction) temperature range from a 1.71 to 3.6 V power supply. A comprehensive set of power-saving modes enables the design of low-power applications.
    The STM32WB55xx integrate a high efficiency SMPS step-down converter with automatic bypass mode capability when the VDD falls below VBORx (x=1, 2, 3, 4) voltage level (default is 2.0 V). It includes independent power supplies for analog input for ADC and comparators, as well as a 3.3 V dedicated supply input for USB.
    A VBAT dedicated supply allows the devices to back up the LSE 32.768KHz oscillator, the RTC and the backup registers, thus enabling the STM32WB55xx to supply these functions even if the main VDD is not present through a CR2032-like battery, a Supercap or a small rechargeable battery.
    The STM32WB55xx family offers three packages, from 48 to 100 pins.

    主な特徴

    • Includes ST state-of-the-art patented technology
    • Radio
      • 2.4 GHz
      • RF transceiver supporting Bluetooth® 5 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread and ZigBee® 3.0
      • RX Sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4)
      • Programmable output power up to +6 dBm with 1 dB steps
      • Integrated balun to reduce BOM
      • Support for 2 Mbps
      • Dedicated Arm® 32-bit Cortex® M0 + CPU for real-time Radio layer
      • Accurate RSSI to enable power control
      • Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66
      • Support for external PA
    • Ultra-low-power platform
      • 1.71 V to 3.6 V power supply
      • – 40 °C to 85 / 105 °C temperature ranges
      • 13 nA shutdown mode
      • 600 nA Standby mode + RTC + 32 KB RAM
      • 2.1 μA Stop mode + RTC + 256 KB RAM
      • Active-mode MCU: < 53 μA / MHz when RF and SMPS On
      • Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA
    • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, adaptive real-time accelerator (ART Accelerator™) allowing 0-wait-state execution from Flash memory, frequency up to 64 MHz, MPU, 80 DMIPS and DSP instructions
    • Supply and reset management
      • High efficiency embedded SMPSstep-down converter with intelligent bypass mode
      • Ultra-safe, low-power BOR (brownout reset) with five selectable thresholds
      • Ultra-low-power POR/PDR
      • Programmable voltage detector (PVD)
      • VBAT mode with RTC and backup registers
    • Clock sources
      • 32 MHz crystal oscillator with integrated trimming capacitors (Radio and CPU clock)
      • 32 kHz crystal oscillator for RTC (LSE)
      • Internal low-power 32 kHz (±5%) RC (LSI1)
      • Internal low-power 32 kHz (stability ±500 ppm) RC (LSI2)
      • Internal multispeed 100 kHz to 48 MHz oscillator, auto-trimmed by LSE (better than ±0.25% accuracy)
      • High speed internal 16 MHz factory trimmed RC (±1%)
      • 2x PLL for system clock, USB, SAI and ADC
    • Memories
      • Up to 1 MB Flash memory with sector protection (PCROP) against R/W operations, enabling authentic Bluetooth® Low Energy and 802.15.4 SW stack
      • Up to 256 KB SRAM, including 64 KB with hardware parity check
      • 20x32-bit backup register
      • Boot loader supporting, USART, SPI, I2C and USB interfaces
      • OTA (Over the air) Bluetooth® Low Energy and 802.15.4 update
      • Quad SPI memory interface with XIP
    • Rich analog peripherals (down to 1.62 V)
      • 12-bit ADC 4.26Msps, up to 16-bit with hardware oversampling, 200 μA/Msps
      • 2x ultra-low-power comparator
      • Accurate 2.5 V or 2.048 V reference voltage buffered output
    • System peripherals
      • Inter processor communication controller (IPCC) for communication with Bluetooth® Low Energy and 802.15.4
      • HW semaphores for resources sharing between CPUs
      • 2x DMA controllers (7x channels each) supporting ADC, SPI, I2C, USART, QSPI, SAI, AES, Timers
      • 1x USART (ISO 7816, IrDA, SPI Master, Modbus and Smartcard mode)
      • 1x LPUART (low power)
      • 2x SPI 32 Mbit/s
      • 2x I2C (SMBus/PMBus)
      • 1x SAI (dual channel high quality audio)
      • 1x USB 2.0 FS device, crystal-less, BCD and LPM
      • Touch sensing controller, up to 18 sensors
      • LCD 8x40 with step-up converter
      • 1x 16-bit, four channels advanced timer
      • 2x 16-bits, two channels timer
      • 1x 32-bits, four channels timer
      • 2x 16-bits ultra-low-power timer
      • 1x independent Systick
      • 1x independent watchdog
      • 1x window watchdog
    • Security and ID
      • Secure firmware installation (SFI) for Bluetooth® Low Energy and 802.15.4 SW stack
      • 3x hardware encryption AES maximum 256-bit for the application, the Bluetooth® Low Energy and IEEE802.15.4
      • Customer key storage / key manager services
      • HW public key authority (PKA)
      • Cryptographic algorithms: RSA, Diffie-Helman, ECC over GF(p)
      • True random number generator (RNG)
      • Sector protection against R/W operation (PCROP)
      • CRC calculation unit
      • 96-bit unique ID
      • 64-bit unique ID. Possibility to derive 802.15.5 64-bit and Bluetooth® Low Energy 48-bit EUI
    • Up to 72 fast I/Os, 70 of them 5 V-tolerant
    • Development support
      • Serial wire debug (SWD), JTAG for the Application processor
      • Application cross trigger with input and output
      • Embedded Trace Macrocell™ for application
    • All packages are ECOPACK®2 compliant

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STM32WB55REV6 VFQFPN 8X8X1.0 68L PITCH 0.4 Tray -40 85
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Farnell Element14 EUROPE 76 1 Order Now

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STM32WB55REV7 VFQFPN 8X8X1.0 68L PITCH 0.4 Tray -40 105
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No availability of distributors reported, please contact our sales office

STM32WB55REU6

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*

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Proposal

Unit Price (US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

STM32WB55REV6

パッケージ

VFQFPN 8X8X1.0 68L PITCH 0.4

梱包タイプ

Tray

Unit Price (US$)

3.7954*

Distributor availability ofSTM32WB55REV6

代理店名
地域 在庫 最小発注 Third party link
Farnell Element14 EUROPE 76 1 Order Now

代理店レポートによる在庫データ: 2019-08-08

代理店名

Farnell Element14

在庫

76

Min.Order

1

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-08-08

Operating Temperature (°C)

(最小値)

-40

(max)

85

製品ステータス

Active

Unit Price (US$)

3.7954

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32WB55REV7

パッケージ

VFQFPN 8X8X1.0 68L PITCH 0.4

梱包タイプ

Tray

Unit Price (US$)

4.0611*

Operating Temperature (°C)

(最小値)

-40

(max)

105

製品ステータス

Active

Unit Price (US$)

4.0611

数量

10000

ECCN (US)

5A992C

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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技術文書

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      Handling of soft errors in STM32 applications

      AN4803

      High-speed SI simulations using IBIS and board-level simulations using HyperLynx SI on STM32 32-bit ARM® Cortex® MCUs

      AN5292

      How to build a Bluetooth® Low Energy mesh application for STM32WBx5 microcontrollers

      AN2834

      How to get the best ADC accuracy in STM32 microcontrollers

      AN4229

      How to implement a vocoder solution using STM32 microcontrollers

      AN4221

      I2C protocol used in the STM32 bootloader

      AN4299

      Improve conducted noise robustness for touch sensing applications on MCUs

      AN3236

      Increase the number of touchkeys for touch sensing applications on MCUs

      AN5027

      Interfacing PDM digital microphones using STM32 MCUs and MPUs

      AN5156

      Introduction to STM32 microcontrollers security

      AN5129

      Low cost PCB antenna for 2.4GHz radio: meander design for STM32WB Series

      AN4838

      Managing memory protection unit (MPU) in STM32 MCUs

      AN5290

      Minimal BOM for STM32WB Series microcontrollers

      AN4635

      Minimization of power consumption using LPUART for STM32 microcontrollers

      AN2867

      Oscillator design guide for STM8AF/AL/S and STM32 microcontrollers

      AN5247

      Over-the-air application and wireless firmware update for STM32WB Series microcontrollers

      AN4760

      Quad-SPI interface (QUADSPI) on STM32 microcontrollers

      AN4286

      SPI protocol used in the STM32 bootloader

      AN5185

      ST firmware upgrade services for STM32WB Series

      AN5224

      STM32 DMAMUX: the DMA request router

      AN4899

      STM32 GPIO configuration for hardware settings and low-power consumption

      AN4013

      STM32 cross-series timer overview

      AN2606

      STM32 microcontroller system memory boot mode

      AN5155

      STM32Cube MCU Package examples for STM32WB Series

      AN5071

      STM32WB ultra-low-power features overview

      AN5270

      STM32WBx5 Bluetooth® Low Energy (BLE) wireless interface

      AN4310

      Sampling capacitor selection guide for touch sensing applications on MCUs

      AN5036

      Thermal management guidelines for STM32 applications

      AN4316

      Tuning a touch sensing application on MCUs

      AN3155

      USART protocol used in the STM32 bootloader

      AN3156

      USB DFU protocol used in the STM32 bootloader

      AN5246

      Usage of SMPS on STM32WB Series microcontrollers

      AN4759

      Using the hardware real-time clock (RTC) in low-power modes with STM32 microcontrollers

      AN4655

      Virtually increasing the number of serial communication peripherals in STM32 applications

    • Description バージョン サイズ アクション
      TN1163
      Description of WLCSP for microcontrollers and recommendations for its use
      4.0
      1.07 MB
      PDF
      TN1204
      Tape and reel shipping media for STM32 microcontrollers in BGA packages
      2.1
      745.74 KB
      PDF
      TN1205
      Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages
      3.0
      753.31 KB
      PDF
      TN1206
      Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages
      3.0
      830.98 KB
      PDF
      TN1207
      Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages
      1.0
      755.03 KB
      PDF
      TN1208
      Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages
      1.0
      743.08 KB
      PDF
      TN1163

      Description of WLCSP for microcontrollers and recommendations for its use

      TN1204

      Tape and reel shipping media for STM32 microcontrollers in BGA packages

      TN1205

      Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages

      TN1206

      Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages

      TN1207

      Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages

      TN1208

      Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages

    • Description バージョン サイズ アクション
      RM0434
      Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® Low-Energy and 802.15.4 radio solution
      4.0
      16.78 MB
      PDF
      RM0434

      Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® Low-Energy and 802.15.4 radio solution

    • Description バージョン サイズ アクション
      PM0214
      STM32 Cortex®-M4 MCUs and MPUs programming manual
      8.0
      2.94 MB
      PDF
      PM0214

      STM32 Cortex®-M4 MCUs and MPUs programming manual

    • Description バージョン サイズ アクション
      ES0394
      STM32WB55Cx/Rx/Vx device errata
      4.0
      306.43 KB
      PDF
      ES0394

      STM32WB55Cx/Rx/Vx device errata

    • Description バージョン サイズ アクション
      AN4841
      Digital signal processing for STM32 microcontrollers using CMSIS
      2.0
      1.38 MB
      PDF
      AN4865
      Low-power timer (LPTIM) applicative use-cases on STM32 microcontrollers
      4.0
      241.34 KB
      PDF
      AN4635
      Minimization of power consumption using LPUART for STM32 microcontrollers
      4.0
      1.46 MB
      PDF
      AN4571
      STM32 BLE toolbox for Android
      1.0
      997.46 KB
      PDF
      AN4502
      STM32 SMBus/PMBus™ embedded software expansion for STM32Cube™
      3.0
      1.34 MB
      PDF
      AN4657
      STM32 in-application programming (IAP) using the USART
      1.0
      635.73 KB
      PDF
      AN5155
      STM32Cube MCU Package examples for STM32WB Series
      1.0
      315.96 KB
      PDF
      AN5054
      Secure programming using STM32CubeProgrammer
      2.0
      2.89 MB
      PDF
      AN3406
      Using an STM32W108-based board and Wireshark for IEEE 802.15.4 packet analysis
      1.5
      250.88 KB
      PDF
      AN4841

      Digital signal processing for STM32 microcontrollers using CMSIS

      AN4865

      Low-power timer (LPTIM) applicative use-cases on STM32 microcontrollers

      AN4635

      Minimization of power consumption using LPUART for STM32 microcontrollers

      AN4571

      STM32 BLE toolbox for Android

      AN4502

      STM32 SMBus/PMBus™ embedded software expansion for STM32Cube™

      AN4657

      STM32 in-application programming (IAP) using the USART

      AN5155

      STM32Cube MCU Package examples for STM32WB Series

      AN5054

      Secure programming using STM32CubeProgrammer

      AN3406

      Using an STM32W108-based board and Wireshark for IEEE 802.15.4 packet analysis

HWモデル、CADライブラリ & SVD

    • Description バージョン サイズ アクション
      STM32WB IBIS files 1.0
      1.45 MB
      ZIP

      STM32WB IBIS files

    • Description バージョン サイズ アクション
      STM32WB BSDL files 1.0
      16.24 KB
      ZIP

      STM32WB BSDL files

プレゼンテーション & トレーニング資料

    • Description バージョン サイズ アクション
      New STM32WB Series MCU with built-in Bluetooth™ 5 and IEEE 802.15.4 1.0
      1.74 MB
      PDF
      STM32 Development Boards Portfolio 1.0
      3.08 MB
      PDF

      New STM32WB Series MCU with built-in Bluetooth™ 5 and IEEE 802.15.4

      STM32 Development Boards Portfolio

関連資料

    • Description バージョン サイズ アクション
      Get ready for the largest IoT development ecosystem 17.4
      350.08 KB
      PDF
      STM32 Nucleo boards - Unified scalable offering 17.6
      913.03 KB
      PDF
      STM32WB Wireless Series Bluetooth™ 5 and IEEE 802.15.4 18.3
      261.53 KB
      PDF

      Get ready for the largest IoT development ecosystem

      STM32 Nucleo boards - Unified scalable offering

      STM32WB Wireless Series Bluetooth™ 5 and IEEE 802.15.4

    • Description バージョン サイズ アクション
      STM32 32-bit MCU family - Leading supplier of Arm® Cortex®-M microcontrollers 17.3
      1.34 MB
      PDF

      STM32 32-bit MCU family - Leading supplier of Arm® Cortex®-M microcontrollers

品質 & 信頼性

    • Description バージョン サイズ アクション
      Full Thread Device interoperability Certificate 1.0
      32.59 KB
      PDF
      Minimal Thread Device Interoperability Certification 1.0
      32.32 KB
      PDF
      STM32WB55 Bluetooth 5 certifications using Qualified Design Listing 1.1
      220.55 KB
      PDF

      Full Thread Device interoperability Certificate

      Minimal Thread Device Interoperability Certification

      STM32WB55 Bluetooth 5 certifications using Qualified Design Listing

製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32WB55REU6
Proposal
- インダストリアル -
STM32WB55REV6
Active
VFQFPN 8X8X1.0 68L PITCH 0.4 インダストリアル Ecopack2
STM32WB55REV7
Active
VFQFPN 8X8X1.0 68L PITCH 0.4 インダストリアル Ecopack2

STM32WB55REU6

Package:

-

Material Declaration**:

Marketing Status

Proposal

Package

-

Grade

Industrial

RoHS Compliance Grade

-

STM32WB55REV6

Package:

VFQFPN 8X8X1.0 68L PITCH 0.4

Material Declaration**:

Marketing Status

Active

Package

VFQFPN 8X8X1.0 68L PITCH 0.4

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32WB55REV7

Package:

VFQFPN 8X8X1.0 68L PITCH 0.4

Material Declaration**:

Marketing Status

Active

Package

VFQFPN 8X8X1.0 68L PITCH 0.4

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.