Product overview
Description
The HSP062-2 is a 2-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps.
The device is packaged in μQFN-6L (1.45 x 1.0 mm) with a 500 μm pitch.
-
All features
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 4.6 GHz
- Ultralow capacitance: 0.6 pF
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- RoHS compliant
EDA Symbols, Footprints and 3D Models
STMicroelectronics - HSP062-2
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Please select one model supplier :
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
SPICE models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 12 Aug 2022 | 12 Aug 2022 |
CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 02 Apr 2021 | 02 Apr 2021 | |
| ZIP | 1.3 | 03 Sep 2020 | 03 Sep 2020 |