The MP34DT01-M is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The MP34DT01-M has an acoustic overload point of 120 dBSPL with a 61 dB signal-to-noise ratio and –26 dBFS sensitivity.
The MP34DT01-M is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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|AN4428: Best practices in the manufacturing process of MEMS microphones||1.1||1 MB|
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|AN4426: Tutorial for MEMS microphones||2.0||947 KB|
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|APWorkbench software for audio ICs and MEMS microphones||1.0||2 MB|
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|X-CUBE-MEMSMIC1||ST||Digital MEMS microphones acquisition and processing software expansion for STM32Cube|
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|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|MP34DT01TR-M||HCLGA 3X4X1.06 5L METAL CAP||Tape And Reel||NRND : Not Recommended for New Design. Product is in volume production only to support customers ongoing production.||-||-||EAR99||-||MORE INFO||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|MP34DT01TR-M||NRND||HCLGA 3X4X1.06 5L METAL CAP||Industrial||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.