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BALF-NRF01D3

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50 Ω nominal input / conjugate match balun to nRF51822-QFAAG0,\rnRF51822-QFAB0, nRF51422-QFAAE0 / integrated harmonic filter

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  • STMicroelectronics BALF-NRF01D3 is an ultraminiature balun. The BALF-NRF01D3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/QFAB, and nRF51422-QFAA/QFAB RF transceivers.

    The BALF-NRF01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.

    Key Features

    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated Flip-Chip on Glass
    • Small footprint: < 1.5 mm2
    • Benefits
      • Very low profile: < 560 μm after reflow
      • High RF performance
      • PCB space saving versus discrete solution
      • BOM count reduction
      • Efficient manufacturability
    Read more Read less

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Technical Documentation

    • Description Version Size Action
      		DS10227
      50 Ω nominal input / conjugate match balun to nRF51822-QFAA/QFAB and nRF51422-QFAA/QFAB with integrated harmonic filter       		4.0
      622.03 KB
      		PDF
      DS10227

      50 Ω nominal input / conjugate match balun to nRF51822-QFAA/QFAB and nRF51422-QFAA/QFAB with integrated harmonic filter

      PDF
    • Description Version Size Action
      		AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers       		2.2
      687.23 KB
      		PDF
      		AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use       		5.0
      261.7 KB
      		PDF
      		AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use       		8.0
      251.82 KB
      		PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      PDF
      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      PDF
      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

      PDF
    • Description Version Size Action
      		TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches       		7.0
      433.12 KB
      		PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

      PDF

Publications and Collaterals

    • Description Version Size Action
      		Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      		PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

      PDF
    • Description Version Size Action
      		Products and solutions for Smart industry 3.0
      2.99 MB
      		PDF
      		Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      		PDF

      Products and solutions for Smart industry

      PDF

      Semiconductor solutions for healthcare applications

      PDF

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-NRF01D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-NRF01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML
More Info

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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Minimum Sellable Quantity
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Budgetary Price (US$)*/Qty
BALF-NRF01D3 Available at 1 distributors

Distributor availability ofBALF-NRF01D3

Distributor Name
Region Stock Min. Order Third party link
ARROW EUROPE 5000 0 Order Now

Distributor reported inventory date: 2020-07-05

Distributor Name

ARROW

Stock

5000

Min.Order

0

Region

EUROPE Order Now

Distributor reported inventory date: 2020-07-05

Chip Scale Package 0.4mm pitch Tape And Reel 5000
Active
EAR99 FRANCE

BALF-NRF01D3

Package

Chip Scale Package 0.4mm pitch

Packing Type

Tape And Reel
More Info

Budgetary Price (US$)*/Qty

Distributor availability ofBALF-NRF01D3

Distributor Name
Region Stock Min. Order Third party link
ARROW EUROPE 5000 0 Order Now

Distributor reported inventory date: 2020-07-05

Distributor Name

ARROW

Stock

5000

Min.Order

0

Region

EUROPE Order Now

Distributor reported inventory date: 2020-07-05

Minimum Sellable Quantity

5000

Marketing Status

Active

Budgetary Price (US$)* / Qty

ECCN (US)

EAR99

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors