STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.
It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass
- Small footprint: < 1.5 mm2
- Very low profile
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
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|FLIP CHIP BUMPLESS CSPG||Industrial||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.