Product overview
Description
ST25TN512 and ST25TN01K devices are NFC Forum Type 2 tag IC with TruST25 digital signature, Augmented NDEF, and privacy features.
The RF interface is compliant with ISO/IEC 14443-2 and 14443-3 Type A standards, and NFC Forum Type 2 tag specification. Thanks to its internal tuning capacitance and harvesting of operating power from RF field provided by the NFC poller, it simply operates with an antenna and without additional component.
The embedded electrically erasable programmable memory (EEPROM) can be written with a NDEF message conforming to NFC Forum specification offering native tap with all NFC-enabled phones.
The Augmented NDEF feature allows the tag to answer dynamic NDEF message without modification of the EEPROM by the user.
The TruST25 digital signature helps fighting against counterfeiting.
The kill feature guarantees user privacy by permanently muting the tag with a simple software procedure.
In this document, the term ST25TN refers interchangeably to ST25TN512 or ST25TN01K.
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All features
- Includes ST state-of-the-art patented technology
- Contactless interface
- Full compliancy with NFC Forum Type 2 tag and ISO/IEC 14443 type A specifications
- Power supplied by 13.56 MHz transmitter field
- Data transfer at 106 kbit/s
- Anticollision support for management of several tags in the field simultaneously
- Natively supported by Android™ and iOS™ phones
- Internal tuning capacitance 50 pF
- Memory
- Up to 208 bytes (1664 bits) dedicated to user content
- Accessible by blocks of four bytes
- NFC Forum NDEF format support
- Augmented NDEF (contextual automatic NDEF message)
- 100 000 Write cycles at + 85 °C
- Data retention during 40 years at + 55 °C
- Product identification and protection
- 7 bytes unique identifier
- TruST25 digital signature
- 3-digit unique tap code
- NFC Forum T2T permanent write locks at block level
- Privacy protection
- Configurable kill mode for permanent deactivation of the tag
- Temperature range
- -40 °C/ +85 °C
- Delivery forms
- 5-pin package ECOPACK2 (RoHS compliant)
- Bumped and sawn inkless wafer
eDesignSuite
eDesignSuite is a comprehensive set of easy-to-use design-aid utilities ready to help you streamline the system development process with a wide range of ST products.
Power Management Design Center
Thermal-electrical Simulators for Components
Signal Conditioning Design Tool
NFC/RFID Calculators
Power Supply Design Tool
SMPS design, by topology, by type and by product PFC design with analog and digitial control Supports various PCB configurations 
LED Lighting Design Tool
Handles AC-DC and DC-DC design in common topologies Displays interactive and annotated schematic Provides current/voltage graphs, Bode plots, efficiency curves and power-loss data 
Digital Power Workbench
Provides a step-by-step optimized design of power section and control loop Generates the STM32Cube embedded software package for custom applications and allows firmware project generation, compatible with multiple STM32 IDEs 
Power Tree Designer
Specify input/output power for each node in the tree Check for consistency Design each individual node 
AC Switches Simulator
Select ratings and application waveforms Get junction temperature and blocking voltage graphs Search and sort suitable devices 
Rectifier Diodes Simulator
Select ratings and application waveforms Estimate power losses Search and sort suitable devices 
STPOWER Studio
Supports long mission profiles Provides power loss and temperature graphs Helps define heatsink thermal properties 
Twister Sim
Help select the right ViPOWER Automotive power device Supports load-compatibility, wiring harness optimization, fault condition impact and diagnostic analysis Supports various PCB configurations 
TVS Simulator
Specify system ratings and surge waveform Search and sort suitable devices 
Active Filters
Handles multi-stage-designs and common topologies Returns circuit component values Provides gain, phase and group delay graphs Low Pass, High Pass and Band Pass 
Comparators
Handles most common configurations Returns circuit components values Provides I/O signal waveforms Inverting, Non Inverting, Window 
Low side Current Sensing
Returns circuit component values Provides current error graphs 
High side Current Sensing
Provides current error graphs. Help to select the right High side current sensing and shunt devices. 
NFC Inductance
Input geometry and substrate properties Get antenna impedance 
UHF Link Budget
Enter forward and reverse link characteristics The tool returns link budget estimate 
NFC Tuning Circuit
Enter antenna parameter and matching target Select the topology of the matching network The tool returns component values for the desired design targets You might also like...
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All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 3.0 | 17 Dec 2021 | 17 Dec 2021 |
Application Notes (5)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 10 Sep 2021 | 10 Sep 2021 | ||
| 1.0 | 02 Feb 2021 | 02 Feb 2021 | ||
| 2.0 | 10 Sep 2021 | 10 Sep 2021 | ||
| 5.0 | 30 Aug 2023 | 30 Aug 2023 | ||
| 3.0 | 02 Feb 2021 | 02 Feb 2021 |
Technical Notes & Articles (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 02 Feb 2021 | 02 Feb 2021 |
User Manuals (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 31 Jan 2023 | 31 Jan 2023 |
Presentations (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.1 | 05 Dec 2022 | 05 Dec 2022 |
Flyers (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 08 Apr 2021 | 08 Apr 2021 | ||
| 1.0 | 21 Sep 2021 | 21 Sep 2021 |
Brochures (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 06 Sep 2022 | 06 Sep 2022 | ||
| 1.1 | 30 Aug 2023 | 30 Aug 2023 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ST25TN01K
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| ST25TN01K-AFF5 | Active | 75UM GOLD BUMPED DICE | Industrial | N/A | |
| ST25TN01K-AFG5 | Active | GOLD BUMPED DICE | Industrial | N/A | |
| ST25TN01K-AFH5 | Active | UFDFPN5 | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | ESample Max Qty | Free Samples | Budgetary Price (US$)*/Qty | Country of Origin | ESample Max Qty | Free Samples | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||||
| ST25TN01K-AFF5 | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Not Applicable | 75UM GOLD BUMPED DICE | - | - | TAIWAN | - | No | | TAIWAN | - | No | ||
| ST25TN01K-AFH5 | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Tape and Reel | UFDFPN5 | - | - | PHILIPPINES | 3 | Yes | | PHILIPPINES | 3 | Yes | ||
| ST25TN01K-AFG5 | distributors No availability of distributors reported, please contact our sales office | Active | EAR99 | NEC | Not Applicable | GOLD BUMPED DICE | - | - | TAIWAN | - | No | | TAIWAN | - | No | ||
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors