Winbond’s 1.35V DDR3 products support 2133Mbps data rate in both x8 and x16 configurations and are 100% compatible to 1.5V DDR3. Winbond’s DRAM roadmap now supports:
- 1Gb-4Gb DDR3,
- 128Mb-2Gb DDR2,
- 512Mb-2Gb LP-DDR2,
as well as:
- SDRAM interfaces
for applications that require 4Gb or below densities DRAM products, such as AI accelerator, IoT, Automotive, Industrial, Tele-communication, WiFi-6, WiFi-6e, xDSL, Fiber-Optical Network, Smart TV, Set-Top-Box, IP camera and many others.
Winbond is also adding new wafer capacity in the new fab in Kaohsiung, Taiwan from 2022 Q4 that offers more advanced manufacturing technologies. Now, Winbond DDR3 shipments are 30% of total DRAM revenue and is projected to increase to 50% in 2024.