A1P25S12M3-F

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ACEPACK 1 sixpack topology, 1200 V, 25 A, trench gate field-stop IGBT M series, soft diode and NTC

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Product overview

Description

This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz.

  • All features

    • ACEPACK™ 1 power module
      • DBC Cu Al2O3 Cu
    • Sixpack topology
      • 1200 V, 25 A IGBTs and diodes
      • Soft and fast recovery diode
    • Integrated NTC

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STPOWER Studio

Supports long mission profiles
Provides power loss and temperature graphs
Helps define heatsink thermal properties

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STMicroelectronics - A1P25S12M3-F

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
A1P25S12M3-F
Active
ACEPACK 1 Industrial Ecopack1

A1P25S12M3-F

Package:

ACEPACK 1

Material Declaration**:

PDF XML

Marketing Status

Active

Package

ACEPACK 1

Grade

Industrial

RoHS Compliance Grade

Ecopack1

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

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A1P25S12M3-F Available at distributors

Distributor availability of A1P25S12M3-F

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Active
EAR99 NEC Tray ACEPACK 1 - - PHILIPPINES

A1P25S12M3-F Active

Package:
ACEPACK 1
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

Part Number:

A1P25S12M3-F

ECCN (EU):

NEC

Packing Type:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

PHILIPPINES

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors