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The HSP062-2 is a 2-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps.
The device is packaged in μQFN-6L (1.45 x 1.0 mm) with a 500 μm pitch.Key Features
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 4.6 GHz
- Ultralow capacitance: 0.6 pF
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- RoHS compliant
Sample & Buy
| Part Number | Marketing Status | Breakdown Voltage (V) (min) | Directionality | Package | Packing Type | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | More info | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HSP062-2M6 |
Active
|
6 | Uni-Directional | uQFN-6L | Tape And Reel | 0.144 | 100 | EAR99 | CHINA | Check Availability | Buy now |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors
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In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
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| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| HSP062-2M6 |
Active
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uQFN-6L | Industrial | Ecopack2 |
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HSP062-2M6
Package:
uQFN-6LMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
