STPAY-TOPAZ-X1

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Dual interface Banking SoC supporting Visa, MasterCard payment applications and FIDO user authentication

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Product overview

Description

The STPay-Topaz-X1 is a GlobalPlatform® 2.3.1 Java® Card platform for payment applications, based on the 40 nm flash technology with up to 150 Kbytes of user non-volatile memory.

The STPay-Topaz-X1 can be configured to support VISA® VSDC 2.9.2 and MasterCard® M/Chip® Advance 1.2.3 payment applications. It also supports an authenticator certified implementation compliant to FIDO2 specifications from FIDO Alliance.

The STPay system-on-chip solution is a family of products that come ready for embedding in smartcards and loaded with payment applications that run on certified Java® Card platforms. They meet all required security and payment-scheme certifications.

For detailed configuration data, contact your local ST sales office.

Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Java is a registered trademark of Oracle and/or its affiliates.

  • All features

      • 40 nm flash technology
      • Java® Card platform
      • Up to 150 Kbytes of user NVM
      • Certified payment applications: VISA® and MasterCard®
      • FIDO2 authenticator application
    • Platform
      • Java® Card 3.0.5 classic operating system
      • GlobalPlatform® 2.3.1 financial configuration 1.0.2 API support
      • Common personalization specification (CPS)-compliant
      • ISO/IEC 7816 T = 0 or T = 1 contact protocol
      • ISO/IEC 14443 Type A contactless interface
    • Hardware
      • ST31N600 product based on a 32-bit Arm® SecurCore® SC000™ RISC core
      • Advanced 40 nm flash technology
      • Best-in-class RF performance
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • Enhanced personalization performance for very fast personalization
      • EMV® CPS v1.1 compliant
      • VISA® smart debit/credit (VSDC) Personalization Specification v2.0
      • M/Chip® Advance 1.2.3 Common Personalization Specification

EDA Symbols, Footprints and 3D Models

STMicroelectronics - STPAY-TOPAZ-X1

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Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STPAY-TOPAZ-X1
Active
SAWN WAFER F 8 Industrial N/A

STPAY-TOPAZ-X1

Package:

SAWN WAFER F 8

Material Declaration**:

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Marketing Status

Active

Package

SAWN WAFER F 8

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors