Product overview
Description
Packaged in an insulated TO-220FPAB, this device offers high thermal performance during operation of up to 20 ARMS, thanks to a junction temperature of up to 150 °C.
This insulated fullpack package allows a back to back configuration.
The combination of noise immunity and low gate triggering current allows to design strong and compact control circuit.
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All features
- High junction temperature: Tj = 150 °C
- High noise immunity dV/dt = 400 V/µs up to 150 °C
- Gate triggering current IGT = 10 mA
- Peak off-state voltage VDRM/VRRM = 600 V
- High turn-on current rise dI/dt = 100 A/µs
- ECOPACK®2 compliant component
- TO-220FPAB insulated package:
- Complies with UL standards (File ref: E81734)
- Insulated voltage: 2000 VRMS
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EDA Symbols, Footprints and 3D Models
The STMicroelectronics team - TN2010H-6FP
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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3D models
All resources
| Resource title | Version | Latest update |
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SPICE models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 7.0 | 06 Jun 2023 | 06 Jun 2023 |