STM32MP151F

量産中
Design Win Education

MPU with Arm Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, TFT display, Secure boot and Cryptography

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製品概要

主なメリット

LCD-TFT display controller

Includes a 24-bit parallel digital RGB controller and provides all signals to interface directly to a broad range of LCD and TFT panels

Support and resources

Get everything you'll need to start your development: go on wiki, online trainings or on the community.

概要

The STM32MP151C/F devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.

The STM32MP151C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32MP151C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP151C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

  • 特徴

    • コア
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • DDR memory retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 5 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 35 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
        • Pixel clock up to 90 MHz
        • Two layers with programmable colour LUT
    • Up to 25 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

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STMicroelectronics - STM32MP151F

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品質 & 信頼性

製品型番 マーケティング・ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32MP151FAA1
量産中
LFBGA 448 18x18x1.7 P 0.8 mm インダストリアル Ecopack2
STM32MP151FAB1
量産中
LFBGA 354 16x16x1.7 P 0.8 mm インダストリアル Ecopack2
STM32MP151FAC1
量産中
TFBGA 361 12x12x1.2 P 0.5 mm インダストリアル Ecopack2
STM32MP151FAD1
量産中
TFBGA 257 10x10x1.2 P 0.5 mm インダストリアル Ecopack2

STM32MP151FAA1

Package:

LFBGA 448 18x18x1.7 P 0.8 mm

Material Declaration**:

Marketing Status

量産中

Package

LFBGA 448 18x18x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151FAB1

Package:

LFBGA 354 16x16x1.7 P 0.8 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

LFBGA 354 16x16x1.7 P 0.8 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151FAC1

Package:

TFBGA 361 12x12x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 361 12x12x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151FAD1

Package:

TFBGA 257 10x10x1.2 P 0.5 mm

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TFBGA 257 10x10x1.2 P 0.5 mm

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

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STM32MP151FAD1 Available at distributors

販売代理店在庫 STM32MP151FAD1

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

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量産中
5A992.c NEC Tray TFBGA 257 10x10x1.2 P 0.5 mm - - -20

105

5.8494

SOUTH KOREA

STM32MP151FAC1 Available at distributors

販売代理店在庫 STM32MP151FAC1

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
5A992.c NEC Tray TFBGA 361 12x12x1.2 P 0.5 mm - - -20

105

6.1177

SOUTH KOREA

STM32MP151FAB1 Available at distributors

販売代理店在庫 STM32MP151FAB1

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
5A992.c NEC Tray LFBGA 354 16x16x1.7 P 0.8 mm - - -20

105

6.1892

SOUTH KOREA

STM32MP151FAA1 Available at distributors

販売代理店在庫 STM32MP151FAA1

販売代理店
地域 在庫 最小発注数量 パートナー企業リンク

販売代理店在庫データ:

販売代理店に在庫がない場合は、STのセールス・オフィスまでお問い合わせください

量産中
5A992.c NEC Tray LFBGA 448 18x18x1.7 P 0.8 mm - - -20

105

6.9048

SOUTH KOREA

STM32MP151FAD1 量産中

パッケージ:
TFBGA 257 10x10x1.2 P 0.5 mm
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP151FAD1

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

Country of Origin:

SOUTH KOREA

販売代理店

販売代理店在庫データ:

STM32MP151FAC1 量産中

パッケージ:
TFBGA 361 12x12x1.2 P 0.5 mm
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP151FAC1

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

Country of Origin:

SOUTH KOREA

販売代理店

販売代理店在庫データ:

STM32MP151FAB1 量産中

パッケージ:
LFBGA 354 16x16x1.7 P 0.8 mm
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP151FAB1

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

Country of Origin:

SOUTH KOREA

販売代理店

販売代理店在庫データ:

STM32MP151FAA1 量産中

パッケージ:
LFBGA 448 18x18x1.7 P 0.8 mm
ECCN (US):
5A992.c
Budgetary Price (US$)*/Qty:
-

製品型番:

STM32MP151FAA1

ECCN (EU):

NEC

梱包タイプ:

Tray

Operating Temperature (°C)

最小:

-

最大:

-

Junction Temperature (°C) (min):

-20

Junction Temperature (°C) (max):

105

Country of Origin:

SOUTH KOREA

販売代理店

販売代理店在庫データ:

Swipe or click the button to explore more details Don't show this again

(*)概算用の参考価格(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。