Front end technology key components
  • Functionality of the Technology Platform Qualification Vehicle demonstrated, plan for final qualification
  • Characterization on typical silicon to demonstrate alignment with models
  • Technology reliability at wafer level (and package level when necessary)
  • EWS testing capability and front end/back end compatibility with corresponding FMEA
  • Process flow, control plan and technology FMEA
  • New material specification and Qualified Material List (QML) updated
  • Preliminary front end/back end compatibility ensured
Back end technology development key components
  • Process parameter compatibility check with production environment conditions
  • Stress qualification trials with defined parameters, materials, flow chart and control plan to validate new production environment
  • Front end/back end compatibility ensured
  • Secure product deliveries on advanced technologies using stress methodologies to detect potential weak parts
  • Advanced design rule specification updated (if needed)
  • Relevant failures identified and documented in the Failure Mode Knowledge Matrix (FMKM)
  • Process FMEA, flow chart and control plan
  • Process capability on all steps (attribute, variable) checked
  • Equipment selection and validation
  • First version of equipment FMEA for new equipment
Product development key components
  • Analysis of new product specification to forecast reliability performance
  • Reliability plan, reliability design rules, prediction of failure rates for operating life test using Arrhenius’ law and other applicable models
  • Use of tools and methodologies, such as APQP, DFM, DFT, DFT, DFMEA, FMKM
  • Detection of potential reliability issues and solutions to overcome them
  • Assessment of Engineering Samples (ES) to identify the main potential failure mechanisms
  • Statistical analysis of electrical parameter drifts for early warning in case of fast parametric degradation (such as retention tests)
  • Failure analysis on failed parts to clarify failure modes and mechanisms and identify the root causes
  • Physical destructive analysis on good parts after reliability tests when required
  • Electrostatic discharge (ESD) and latch-up sensitivity measurement