TO-LL leadless and SMD thermally efficient package for high power applications
The TO-LL package offers an excellent balance between heat management, current capability, and PCB space. The lower Rthj-amb of the TO-LL package, combined with thermal vias and bottom heatsink on the host board, allows designers to occupy less PCB space and manage heat more efficiently than SMD and through-hole packages.
The additional Kelvin-source lead on the package also helps designers achieve higher efficiency through reduced turn-on/turn-off switching losses.
Another key characteristic is the 2.7 mm creepage between the drain and source pads, which ensures better isolation and protection from failures caused by voltage events that exceed the breakdown rating of the device.
ST offers MDmesh M6 (600V) and MDmesh DM6 (600-650V) superjunction MOSFETs in TO-LL packages targeting servers, telecom data centers, SMPS, and solar microinverters. The range of devices in TO-LL packages will be expanded with the inclusion of the latest MDmesh M9 and DM9 series of STPOWER MOSFETs. applications.
- Reduced space on PCB vs D2PAK with the same area inside
- Reduced thickness: 2.3 mm
- Large exposed drain pad
- Additional Kelvin source pin
- High creepage: 2.7 mm
TO-LL and MDmesh M6 the latest breakthrough in high-level telecom SMPS.
The new space-saving and thermally efficient leadless package.
The latest evolution in SMD power packages.