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The LSM6DSR is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended full-scale range for the gyroscope, up to 4000 dps, and high stability over temperature and time.
The LSM6DSR supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes with FIFO compression up to three times for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The LSM6DSR has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps.
The LSM6DSR embeds a broad range of advanced functions supporting Android wearable sensors and programmable sensors (suitable for activity recognition).
The LSM6DSR is available in a plastic land grid array (LGA) package.Key Features
- Extended full-scale range for gyroscope up to 4000 dps
- High stability over temperature and time
- Smart FIFO up to 9 kbytes
- Android compliant
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Supports sensor synchronization S4S for Qualcomm, full spec compliant (I²C,MIPI I3CSM, SPI)
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Programmable finite state machine: accelerometer, gyroscope, and external sensors
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DSRTR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel |
Active
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3 | 1000 | EAR99 | - | Check Availability | |
| LSM6DSR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tray |
Active
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- | - | EAR99 | - | No availability of distributors reported, please contact our sales office |
LSM6DSRTR
Package
VFLGA2.5X3X.86 14L P.5 L.475X.25Packing Type
Tape And ReelUnit Price (US$)
3.0*LSM6DSR
Package
VFLGA2.5X3X.86 14L P.5 L.475X.25Packing Type
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
Featured Videos
LSM6DSOX IMU embeds a Machine Learning core able to run with only 5 uA, to pre-process and classify information coming from its internal gyro and accelerometer plus up to 4 external sensors to save system-level power since the main MCU can be put in sleep mode for significant amount of time.
A bridge between the sensor on the mother board an your laptop
Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Embedded Software
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Picture Part number Manufacturer Description C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors Part NumberStandard C platform-independent drivers for MEMS motion and environmental sensors
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Evaluation Tools
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Picture Part number Manufacturer Description 
STEVAL-MKI194V1 ST LSM6DSR adapter board for a standard DIL24 socket Part NumberLSM6DSR adapter board for a standard DIL24 socket
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Support and Applications
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Picture Part number Manufacturer Description SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. Part NumberEngineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
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| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM6DSR |
Active
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
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| LSM6DSRTR |
Active
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
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LSM6DSR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
LSM6DSRTR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
