Product overview
Description
STA1385 is a fully automotive, power efficient System-On-Chip, targeting cost effective processing solutions for innovative Telematics and Connectivity applications including Cyber-security protection. It features a powerful Dual ARM Cortex-A7 processor, an embedded and independent Hardware Security Module (HSM), an isolated sub-system based on ARM Cortex-M3 for vehicle CAN interface and a full set of standard connectivity interfaces, including a dual Gbit ETH AVB controller and Flexray.-
All features
- AEC-Q100 qualified Grade 2 Core and Infrastructure
- Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support
- Memory organization:Embedded Vehicle Interface
- L1 Cache: 32 KB I, 32 KB D
- L2 Cache: 256 KB
- Total embedded SRAM: 768 KB
- Isolated Cortex-M3 core
- L1 Cache: 8 KB I
- 256 KB reserved embedded SRAM (extendible to 768 KB)
- 1x CAN Standard (C_CAN)
- 2x CAN FD (M_CAN)
- 1x Flexray
- 1x SD/MMC/SDIO SDR50 (SD/MMC0)
- 1x SD/MMC/SDIO SDR25 (SD/MMC1)
- 1x USB 2.0 DR with HS PHY and HSIC
- 1x USB 2.0 DR with HS PHY
- 2x ETH AVB MAC with RMII/RGMII
- HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)
- Cryptographic Functions Accelerators
- Symmetric keys: MP AES
- Public keys: RSA, ECC
- Hash: MD5, SHA1, SHA2
- True Random Number Generator
- User pogrammable OTP memory (eHSM OTP)
- 16-bit DDR3L-1066 (533 MHz)
- 16-bit LPDDR2-800 (400 MHz)
- SQI Interface
- 8-bit Parallel NAND (1 chip select)
- 1x 6-channel 10-bits ADC
- 3x I2C multi-master/slave interfaces
- 6x UART controller
- 3xI2S audio interfaces
- 3x Synchronous Serial Port (SSP/SPI)
- 5x 32-bit GPIO ports
- JTAG based in-circuit emulator (ICE) with Embedded Trace Module
- VDD, VDD_ARM: 1.14 V-1.21 V
- VDD_IO_3V3: 3.3 V ±10%
- VDD_IO_SDMMC0: 1.8 V-3.3 V ±10%
- VDD_IO_BOOT: 1.8 V/3.3 V ±10%
- VDD_IO_ON: 3.3 V ± 10%
- VDDQ: 1.35 V ± 5% (DDR3L)
- Junction temperature range: -40 C/ +150 C
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All tools & software
All resources
| Resource title | Latest update |
|---|
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 10 Feb 2020 | 10 Feb 2020 |
Flyers (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 16 Apr 2021 | 16 Apr 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STA1385
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STA1385EOAS2 | Active | LFBGA 361 16x16x1.7 | Automotive | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||
| STA1385EOAS2 | No availability of distributors reported, please contact our sales office | Active | 5A992C | 5A002A4 | Tray | LFBGA 361 16x16x1.7 | -40 | 105 | |||
Marketing Status
ActiveECCN (US)
5A992C(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
